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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5110515 |
Method of encapsulating semiconductor chips |
May. 5, 1992 |
| 5108955 |
Method of making a resin encapsulated pin grid array with integral heatsink |
Apr. 28, 1992 |
| 5108278 |
Resin sealing apparatus |
Apr. 28, 1992 |
| 5104604 |
Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound |
Apr. 14, 1992 |
| 5102828 |
Method for manufacturing a semiconductor card with electrical contacts on both faces |
Apr. 7, 1992 |
| 5098626 |
Method for packing a measured quantity of thermosetting resin and operating a mold for encapsulating a component |
Mar. 24, 1992 |
| 5098630 |
Method of molding a solid state image pickup device |
Mar. 24, 1992 |
| 5096853 |
Method for manufacturing a resin encapsulated semiconductor device |
Mar. 17, 1992 |
| 5096851 |
Method of packaging an electronic device using a common holder to carry the device in both a CVD and molding step |
Mar. 17, 1992 |
| 5093281 |
method for manufacturing semiconductor devices |
Mar. 3, 1992 |
| 5091135 |
Improvements in the encapsulation of electronic components employing low stress encapsulant composition |
Feb. 25, 1992 |
| 5090117 |
Method of assembling electronic equipment |
Feb. 25, 1992 |
| 5085913 |
Silicone material |
Feb. 4, 1992 |
| 5082615 |
Method for packaging semiconductor devices in a resin |
Jan. 21, 1992 |
| 5077237 |
Method of encapsulating a semiconductor element using a resin mold having upper and lower mold half resin inflow openings |
Dec. 31, 1991 |
| 5071612 |
Method for sealingly molding semiconductor electronic components |
Dec. 10, 1991 |
| 5071334 |
Multiple transfer molding die |
Dec. 10, 1991 |
| 5064706 |
Carrier tape including molten resin flow path element for resin packaged semiconductor devices |
Nov. 12, 1991 |
| 5061164 |
Dowel-less mold chase for use in transfer molding |
Oct. 29, 1991 |
| 5059558 |
Use of venting slots to improve hermetic seal for semiconductor dice housed in ceramic packages |
Oct. 22, 1991 |
| 5059379 |
Method of resin sealing semiconductor devices |
Oct. 22, 1991 |
| 5059373 |
Method of manufacturing continuous strip of electronic devices |
Oct. 22, 1991 |
| 5059105 |
Resilient mold assembly |
Oct. 22, 1991 |
| 5057457 |
Multimold semiconductor device and the manufacturing method therefor |
Oct. 15, 1991 |
| 5052907 |
Resin sealing apparatus for use in manufacturing a resin-sealed semiconductor device |
Oct. 1, 1991 |
| 5049526 |
Method for fabricating semiconductor device including package |
Sep. 17, 1991 |
| 5049055 |
Mold assembly |
Sep. 17, 1991 |
| 5041254 |
Method of encapsulating a semiconductor device with a flame retardant epoxy molding compound |
Aug. 20, 1991 |
| 5034350 |
Semiconductor device package with dies mounted on both sides of the central pad of a metal frame |
Jul. 23, 1991 |
| 5032543 |
Coplanar packaging techniques for multichip circuits |
Jul. 16, 1991 |
| 5026669 |
Method of eliminating burrs on a lead frame with a thin metal coating |
Jun. 25, 1991 |
| 5026668 |
Apparatus and method for producing semiconductor device |
Jun. 25, 1991 |
| 5018003 |
Lead frame and semiconductor device |
May. 21, 1991 |
| 5015425 |
Manufacturing apparatus |
May. 14, 1991 |
| 5005282 |
Method of making an electronic memory card |
Apr. 9, 1991 |
| 5006295 |
Method for making a plurality of like printed circuit board test pieces and arranging them relative to one another cutting along a hole row center plane |
Apr. 9, 1991 |
| 4997355 |
Apparatus for producing semiconductor devices |
Mar. 5, 1991 |
| 4996170 |
Molding process for encapsulating semiconductor devices using a thixotropic compound |
Feb. 26, 1991 |
| 4983110 |
Resin encapsulating apparatus for semiconductor devices |
Jan. 8, 1991 |
| 4980016 |
Process for producing electric circuit board |
Dec. 25, 1990 |
| 4971930 |
EPROM semiconductor device erasable with ultraviolet rays and manufacturing process thereof |
Nov. 20, 1990 |
| 4963307 |
Method for producing a tablet for resin-molding semiconductor devices and resin-molding method making use of the tablet |
Oct. 16, 1990 |
| 4961893 |
Method for manufacturing memory cards |
Oct. 9, 1990 |
| 4957876 |
Resin sealed semiconductor device and a method for making the same |
Sep. 18, 1990 |
| 4957882 |
Method for manufacturing semiconductor device |
Sep. 18, 1990 |
| 4954307 |
Method for manufacturing plastic encapsulated electronic semiconductor devices |
Sep. 4, 1990 |
| 4954308 |
Resin encapsulating method |
Sep. 4, 1990 |
| 4947531 |
Insertion method for chip cards |
Aug. 14, 1990 |
| 4946633 |
Method of producing semiconductor devices |
Aug. 7, 1990 |
| 4946518 |
Method for improving the adhesion of a plastic encapsulant to copper containing leadframes |
Aug. 7, 1990 |
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