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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5328347 |
Device for introducing a plastic material into a mould cavity |
Jul. 12, 1994 |
| 5328870 |
Method for forming plastic molded package with heat sink for integrated circuit devices |
Jul. 12, 1994 |
| 5326243 |
Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device |
Jul. 5, 1994 |
| 5316463 |
Encapsulating molding equipment |
May. 31, 1994 |
| 5314842 |
Resin-sealed type semiconductor device and method for manufacturing the same |
May. 24, 1994 |
| 5306459 |
Insert molding method using a crush rib |
Apr. 26, 1994 |
| 5304512 |
Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process |
Apr. 19, 1994 |
| 5302101 |
Mold for resin-packaging electronic components |
Apr. 12, 1994 |
| 5302850 |
Semiconductor sealing mold |
Apr. 12, 1994 |
| 5302553 |
Method of forming a coated plastic package |
Apr. 12, 1994 |
| 5300459 |
Method for reducing thermal stress in an encapsulated integrated circuit package |
Apr. 5, 1994 |
| 5290197 |
Method for mounting a wiring board on a liquid crystal display substrate |
Mar. 1, 1994 |
| 5288698 |
Method of positioning lead frame on molding die to seal semiconductor element with resin |
Feb. 22, 1994 |
| 5286439 |
Packaging for semiconductors |
Feb. 15, 1994 |
| 5286426 |
Assembling a lead frame between a pair of molding cavity plates |
Feb. 15, 1994 |
| 5281121 |
Resin sealing apparatus |
Jan. 25, 1994 |
| 5275546 |
Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor |
Jan. 4, 1994 |
| 5264061 |
Method of forming a three-dimensional printed circuit assembly |
Nov. 23, 1993 |
| 5258331 |
Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars |
Nov. 2, 1993 |
| 5254501 |
Same-side gated process for encapsulating semiconductor devices |
Oct. 19, 1993 |
| 5254500 |
Method for making an integrally molded semiconductor device heat sink |
Oct. 19, 1993 |
| 5252051 |
Resin-seal apparatus for semiconductor element |
Oct. 12, 1993 |
| 5252052 |
Mold for manufacturing plastic integrated circuits incorporating a heat sink |
Oct. 12, 1993 |
| 5249101 |
Chip carrier with protective coating for circuitized surface |
Sep. 28, 1993 |
| 5244838 |
Process and apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device |
Sep. 14, 1993 |
| 5244840 |
Method for manufacturing an encapsulated IC card having a molded frame and a circuit board |
Sep. 14, 1993 |
| 5219608 |
Method of spraying release agent |
Jun. 15, 1993 |
| 5218759 |
Method of making a transfer molded semiconductor device |
Jun. 15, 1993 |
| 5214846 |
Packaging of semiconductor chips |
Jun. 1, 1993 |
| 5204287 |
Integrated circuit device having improved post for surface-mount package |
Apr. 20, 1993 |
| 5204122 |
Mold for use in resin encapsulation molding |
Apr. 20, 1993 |
| 5200366 |
Semiconductor device, its fabrication method and molding apparatus used therefor |
Apr. 6, 1993 |
| 5197183 |
Modified lead frame for reducing wire wash in transfer molding of IC packages |
Mar. 30, 1993 |
| 5182071 |
Method of molding a carrier ring to leads |
Jan. 26, 1993 |
| 5179039 |
Method of making a resin encapsulated pin grid array with integral heatsink |
Jan. 12, 1993 |
| 5173220 |
Method of manufacturing a three-dimensional plastic article |
Dec. 22, 1992 |
| 5169586 |
Method of manufacturing resin-sealed type semiconductor device |
Dec. 8, 1992 |
| 5167556 |
Method for manufacturing a light emitting diode display means |
Dec. 1, 1992 |
| 5166502 |
Gaming chip with implanted programmable identifier means and process for fabricating same |
Nov. 24, 1992 |
| 5164335 |
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
Nov. 17, 1992 |
| 5158735 |
Encapsulating electronic components |
Oct. 27, 1992 |
| 5158780 |
Device for encapsulating electronic components |
Oct. 27, 1992 |
| 5151276 |
Resin molding apparatus |
Sep. 29, 1992 |
| 5147822 |
Plasma processing method for improving a package of a semiconductor device |
Sep. 15, 1992 |
| 5147821 |
Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation |
Sep. 15, 1992 |
| 5139728 |
Method of using molding pot having configured bottom |
Aug. 18, 1992 |
| 5137479 |
Lead structure for packaging semiconductor chip |
Aug. 11, 1992 |
| 5134773 |
Method for making a credit card containing a microprocessor chip |
Aug. 4, 1992 |
| 5133921 |
Method for manufacturing plastic encapsulated electronic semiconductor devices |
Jul. 28, 1992 |
| 5123826 |
Molding pot having configured bottom |
Jun. 23, 1992 |
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