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Browse by Category: Main > Material Science
Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8652384 Method for molding semiconductor device Feb. 18, 2014
8647110 Apparatuses and methods for fabricating semiconductor packages Feb. 11, 2014
8617443 Method and equipment for providing the edge of a starting sheet with a dielectric strip Dec. 31, 2013
8574967 Method for fabricating array-molded package-on-package Nov. 5, 2013
8541249 Method for manufacturing light emitting device package and frame for manufacturing light emitting device package Sep. 24, 2013
8529811 Component protective overmolding using protective external coatings Sep. 10, 2013
8481343 Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same Jul. 9, 2013
8475696 Method for packaging light emitting diode Jul. 2, 2013
8431063 Heat treatment for a panel and apparatus for carrying out the heat treatment method Apr. 30, 2013
8409885 Method for packaging light emitting diode Apr. 2, 2013
8409484 Method for producing a ceramic compact Apr. 2, 2013
8394308 Mold method Mar. 12, 2013
8366982 Differential pressure underfill process and equipment Feb. 5, 2013
8303878 Method of making a light emitting device having a molded encapsulant Nov. 6, 2012
8268218 Release film for semiconductor resin molds Sep. 18, 2012
8262970 Semiconductor device and method of manufacturing thereof Sep. 11, 2012
8246867 Method for assembling an optoelectronic device Aug. 21, 2012
8226874 Method and apparatus for protecting an article during operation Jul. 24, 2012
8202460 Microelectronic substrate having removable edge extension element Jun. 19, 2012
8197738 Method for filling a gap between a substrate and a work placed thereon Jun. 12, 2012
8173056 Method of fabricating an entity and corresponding device May. 8, 2012
8163220 Method of packaging integrated circuits Apr. 24, 2012
8158046 Mold apparatus and method Apr. 17, 2012
8119050 Method of manufacturing a semiconductor device Feb. 21, 2012
8105524 Compression molding method for electronic component and compression molding apparatus employed therefor Jan. 31, 2012
8105883 Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method Jan. 31, 2012
8092735 Method of making a light emitting device having a molded encapsulant Jan. 10, 2012
8062571 Resin sealing method in stacked wiring substrate Nov. 22, 2011
8048358 Pop semiconductor device manufacturing method Nov. 1, 2011
8043545 Methods and apparatus to evenly clamp semiconductor substrates Oct. 25, 2011
8003036 Mold for forming a molding member and method of fabricating a molding member using the same Aug. 23, 2011
7943072 Method for producing a resin molded article May. 17, 2011
7883655 Molding apparatus for manufacturing a semiconductor device and method using the same Feb. 8, 2011
7846780 Flip-chip package covered with tape Dec. 7, 2010
7842219 Mold for forming a molding member and method of fabricating a molding member using the same Nov. 30, 2010
7833456 Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece Nov. 16, 2010
7824585 Apparatus and method for fabricating semiconductor packages Nov. 2, 2010
7815836 Packaging apparatus for optical-electronic semiconductors Oct. 19, 2010
7807009 Hermetic sealing apparatus and hermetic sealing method using frit Oct. 5, 2010
7754130 Method for manufacturing physical quantity sensor Jul. 13, 2010
7752747 Manufacturing method of electronic component Jul. 13, 2010
7748117 Method for producing movable contact parts with flat pins and contact parts made using this method Jul. 6, 2010
7732242 Composite board with semiconductor chips and plastic housing composition and method Jun. 8, 2010
7704801 Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device Apr. 27, 2010
7682544 Method of fabricating photovoltaic panel Mar. 23, 2010
7632720 Method of manufacturing a semiconductor device Dec. 15, 2009
7628948 Alternate vent hole sealing method Dec. 8, 2009
7624501 Method of manufacturing multilayer wiring board Dec. 1, 2009
7622067 Apparatus and method for manufacturing a semiconductor device Nov. 24, 2009
7618573 Resin sealing method for electronic part and mold used for the method Nov. 17, 2009

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