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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618573 |
Resin sealing method for electronic part and mold used for the method |
Nov. 17, 2009 |
| 7604765 |
Electronic circuit device and manufacturing method of the same |
Oct. 20, 2009 |
| 7595017 |
Method for using a pre-formed film in a transfer molding process for an integrated circuit |
Sep. 29, 2009 |
| 7591969 |
Method for making a supporting body for the lock of a motor vehicle, and a supporting body thus obtained |
Sep. 22, 2009 |
| 7585546 |
Surface passivation and sealing of micro-optics devices for improved performance in harsh environments |
Sep. 8, 2009 |
| 7552532 |
Method for hermetically encapsulating a component |
Jun. 30, 2009 |
| 7525180 |
Semiconductor mount substrate, semiconductor device and method of manufacturing semiconductor package |
Apr. 28, 2009 |
| 7501086 |
Encapsulation method for leadless semiconductor packages |
Mar. 10, 2009 |
| 7482700 |
Semiconductor device having projection on surface thereof, and method of identifying semiconductor package |
Jan. 27, 2009 |
| 7465368 |
Die molding for flip chip molded matrix array package using UV curable tape |
Dec. 16, 2008 |
| 7419629 |
Metal mold for forming, method for the preparation of the metal mold for forming and molded article obtained on forming by the metal mold for forming |
Sep. 2, 2008 |
| 7407608 |
Resin molding equipment and resin molding method |
Aug. 5, 2008 |
| 7402270 |
Method and system for integrated circuit packaging |
Jul. 22, 2008 |
| 7393489 |
Mold die for molding chip array, molding equipment including the same, and method for molding chip array |
Jul. 1, 2008 |
| 7381359 |
Method for making filled epoxy resin compositions |
Jun. 3, 2008 |
| 7378455 |
Molding composition and method, and molded article |
May. 27, 2008 |
| 7364684 |
Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels |
Apr. 29, 2008 |
| 7357886 |
Singular molded and co-molded electronic's packaging pre-forms |
Apr. 15, 2008 |
| 7358599 |
Optical semiconductor device having a lead frame and electronic equipment using same |
Apr. 15, 2008 |
| 7355278 |
Mold die for a semiconductor device |
Apr. 8, 2008 |
| 7267791 |
Method for the production of light-guiding LED bodies in two chronologically separate stages |
Sep. 11, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7255610 |
Molded part and electronic device using the same |
Aug. 14, 2007 |
| 7250687 |
Systems for degating packaged semiconductor devices with tape substrates |
Jul. 31, 2007 |
| 7247267 |
Mold and method of molding semiconductor devices |
Jul. 24, 2007 |
| 7241414 |
Method and apparatus for molding a semiconductor device |
Jul. 10, 2007 |
| 7239933 |
Substrate supports for use with programmable material consolidation apparatus and systems |
Jul. 3, 2007 |
| 7205170 |
Method for the production of LED bodies |
Apr. 17, 2007 |
| 7195955 |
Technique for protecting photonic devices in optoelectronic packages with clear overmolding |
Mar. 27, 2007 |
| 7178235 |
Method of manufacturing an optoelectronic package |
Feb. 20, 2007 |
| 7169345 |
Method for integrated circuit packaging |
Jan. 30, 2007 |
| 7170158 |
Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture |
Jan. 30, 2007 |
| 7153462 |
Injection casting system for encapsulating semiconductor devices and method of use |
Dec. 26, 2006 |
| 7144538 |
Method for making a direct chip attach device and structure |
Dec. 5, 2006 |
| 7070659 |
System for filling openings in semiconductor products |
Jul. 4, 2006 |
| 7060216 |
Tire pressure sensors and methods of making the same |
Jun. 13, 2006 |
| 7005101 |
Virtual gate design for thin packages |
Feb. 28, 2006 |
| 6989122 |
Techniques for manufacturing flash-free contacts on a semiconductor package |
Jan. 24, 2006 |
| 6989121 |
Method for encasing plastic array packages |
Jan. 24, 2006 |
| 6977055 |
Securing electrical conductors |
Dec. 20, 2005 |
| 6971863 |
Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent |
Dec. 6, 2005 |
| 6969918 |
System for fabricating semiconductor components using mold cavities having runners configured to minimize venting |
Nov. 29, 2005 |
| 6956098 |
High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto |
Oct. 18, 2005 |
| 6949296 |
Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto |
Sep. 27, 2005 |
| 6939501 |
Methods for labeling semiconductor device components |
Sep. 6, 2005 |
| 6933176 |
Ball grid array package and process for manufacturing same |
Aug. 23, 2005 |
| 6913950 |
Semiconductor device with chamfered substrate and method of making the same |
Jul. 5, 2005 |
| 6896837 |
Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length |
May. 24, 2005 |
| 6893903 |
Semiconductor device and method for manufacturing the same |
May. 17, 2005 |
| 6890460 |
Method for manufacturing lens cap for optical module |
May. 10, 2005 |
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