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Class Information
Number: 264/272.15
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > With component positioning procedure or incorporation of article positioning means
Description: Processes in which the electrical component is claimed as positioned in a specified relation to the encapsulant or in which a positioning means is incorporated in the encapsulant.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618573 |
Resin sealing method for electronic part and mold used for the method |
Nov. 17, 2009 |
| 7604765 |
Electronic circuit device and manufacturing method of the same |
Oct. 20, 2009 |
| 7603770 |
Method of overmolding an electronic assembly having an insert-molded vertical mount connector header |
Oct. 20, 2009 |
| 7595017 |
Method for using a pre-formed film in a transfer molding process for an integrated circuit |
Sep. 29, 2009 |
| 7591969 |
Method for making a supporting body for the lock of a motor vehicle, and a supporting body thus obtained |
Sep. 22, 2009 |
| 7582244 |
Electrosurgical electrode shroud |
Sep. 1, 2009 |
| 7482700 |
Semiconductor device having projection on surface thereof, and method of identifying semiconductor package |
Jan. 27, 2009 |
| 7465368 |
Die molding for flip chip molded matrix array package using UV curable tape |
Dec. 16, 2008 |
| 7431875 |
Process of preparing a unitized membrane electrode assembly using compression molding |
Oct. 7, 2008 |
| 7419628 |
Method and moulding tool for manufacturing fibre-reinforced products |
Sep. 2, 2008 |
| 7407608 |
Resin molding equipment and resin molding method |
Aug. 5, 2008 |
| 7364684 |
Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels |
Apr. 29, 2008 |
| 7347963 |
Method of molding resin to protect a resolver winding |
Mar. 25, 2008 |
| 7320771 |
Method of making a ribbed part out of thermoplastic material covered in a conductive foil, and a ribbed part |
Jan. 22, 2008 |
| 7300615 |
High frequency transformers and high Q factor inductors formed using epoxy-based magnetic polymer materials |
Nov. 27, 2007 |
| 7270778 |
Method for attachment of a plastic probe tip to a metal component |
Sep. 18, 2007 |
| 7265453 |
Semiconductor component having dummy segments with trapped corner air |
Sep. 4, 2007 |
| 7264758 |
Method for producing an electrical connector |
Sep. 4, 2007 |
| 7250687 |
Systems for degating packaged semiconductor devices with tape substrates |
Jul. 31, 2007 |
| 7217335 |
Method of manufacturing a soft hearing aid |
May. 15, 2007 |
| 7211215 |
Mould, encapsulating device and method of encapsulation |
May. 1, 2007 |
| 7201867 |
Method of installing circuit member in resin-molded panel |
Apr. 10, 2007 |
| 7178235 |
Method of manufacturing an optoelectronic package |
Feb. 20, 2007 |
| 7172130 |
Electronic device, rubber product, and methods for manufacturing the same |
Feb. 6, 2007 |
| 7169345 |
Method for integrated circuit packaging |
Jan. 30, 2007 |
| 7166252 |
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
Jan. 23, 2007 |
| 7152316 |
Hybrid integrated circuit device and method of manufacturing the same |
Dec. 26, 2006 |
| 7134194 |
Method of developing an electronic module |
Nov. 14, 2006 |
| 7060216 |
Tire pressure sensors and methods of making the same |
Jun. 13, 2006 |
| 7049166 |
Methods and apparatus for making integrated circuit package including opening exposing portion of the IC |
May. 23, 2006 |
| 7037455 |
Insert molding method |
May. 2, 2006 |
| 7005101 |
Virtual gate design for thin packages |
Feb. 28, 2006 |
| 6989122 |
Techniques for manufacturing flash-free contacts on a semiconductor package |
Jan. 24, 2006 |
| 6989121 |
Method for encasing plastic array packages |
Jan. 24, 2006 |
| 6977056 |
Electromagnetic oscillating type pump and method for manufacturing the same |
Dec. 20, 2005 |
| 6949709 |
Method for making a dashboard subassembly in paticular a motor vehicle dashboard console |
Sep. 27, 2005 |
| 6922890 |
Planarization process for thin film surfaces |
Aug. 2, 2005 |
| 6910874 |
Apparatus for encapsulating a multi-chip substrate array |
Jun. 28, 2005 |
| 6911172 |
Method of manufacturing eyewear |
Jun. 28, 2005 |
| 6893244 |
Apparatus for encasing array packages |
May. 17, 2005 |
| 6881371 |
Method for forming outer packaging body of product |
Apr. 19, 2005 |
| 6863516 |
Transfer molding and underfilling apparatus |
Mar. 8, 2005 |
| 6860731 |
Mold for encapsulating a semiconductor chip |
Mar. 1, 2005 |
| 6811738 |
Manufacturing method of an electronic device package |
Nov. 2, 2004 |
| 6808661 |
Method for encapsulating leadframe-mounted integrated circuits |
Oct. 26, 2004 |
| 6807731 |
Method for forming an electronic assembly |
Oct. 26, 2004 |
| 6805826 |
Method of making a strain relief |
Oct. 19, 2004 |
| 6793863 |
Process for producing a spark plug boot resistor assembly |
Sep. 21, 2004 |
| 6787093 |
Semiconductor resin molding method |
Sep. 7, 2004 |
| 6770236 |
Method of resin molding |
Aug. 3, 2004 |
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