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Browse by Category: Main > Material Science
Class Information
Number: 264/272.14
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Plural electrical components
Description: Processes in which two or more electrical components are encapsulated.


Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
7595017 Method for using a pre-formed film in a transfer molding process for an integrated circuit Sep. 29, 2009
7520052 Method of manufacturing a semiconductor device Apr. 21, 2009
7510618 Method of forming an assembly of a patch and electronic monitoring device Mar. 31, 2009
7431875 Process of preparing a unitized membrane electrode assembly using compression molding Oct. 7, 2008
7405656 Device and method for encapsulation and mounting of RFID devices Jul. 29, 2008
7402270 Method and system for integrated circuit packaging Jul. 22, 2008
7380333 Chip resistor fabrication method Jun. 3, 2008
7364684 Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels Apr. 29, 2008
7308752 Method for making an optical pickup apparatus having a movable unit supported by springs attached to a fixed unit Dec. 18, 2007
7217335 Method of manufacturing a soft hearing aid May. 15, 2007
7166252 Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board Jan. 23, 2007
7082728 Electrical box for use with insulated concrete form building systems Aug. 1, 2006
7000317 Method for manufacturing electrical connectors for enhancing coplanarity Feb. 21, 2006
6989121 Method for encasing plastic array packages Jan. 24, 2006
6977055 Securing electrical conductors Dec. 20, 2005
6949709 Method for making a dashboard subassembly in paticular a motor vehicle dashboard console Sep. 27, 2005
6911166 Method of encapsulating hard disc drive and other electrical components Jun. 28, 2005
6893244 Apparatus for encasing array packages May. 17, 2005
6858172 Current sensor supporting structure Feb. 22, 2005
6797542 Fabrication method of semiconductor integrated circuit device Sep. 28, 2004
6787093 Semiconductor resin molding method Sep. 7, 2004
6761789 Method of manufacturing a soft hearing aid Jul. 13, 2004
6737002 Fabrication of plastic module with exposed backside contact May. 18, 2004
6733711 Plastic packaging of LED arrays May. 11, 2004
6695943 Method of manufacturing a soft hearing aid Feb. 24, 2004
6689446 Vehicle panel Feb. 10, 2004
6676885 Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding di Jan. 13, 2004
6625856 Method of manufacturing an ultrasonic transducer Sep. 30, 2003
6616880 Method for encasing array packages Sep. 9, 2003
6612890 Method and system for manufacturing electronic packaging units Sep. 2, 2003
6601296 Multi-shot injection molding process for making electrical connectors and three-dimensional circuits Aug. 5, 2003
6576288 Resin film forming method and resin film forming apparatus employing said method Jun. 10, 2003
6576178 Resin sealing apparatus and resin sealing method Jun. 10, 2003
6562278 Methods of fabricating housing structures and micromachines incorporating such structures May. 13, 2003
6562272 Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages May. 13, 2003
6558600 Method for packaging microelectronic substrates May. 6, 2003
6554598 Mold assembly for encapsulating semiconductor device Apr. 29, 2003
6549821 Stereolithographic method and apparatus for packaging electronic components and resulting structures Apr. 15, 2003
6531083 Sproutless pre-packaged molding for component encapsulation Mar. 11, 2003
6527998 Method of fabricating integrated circuit pack trays using modules Mar. 4, 2003
6523254 Method for gate blocking x-outs during a molding process Feb. 25, 2003
6503433 Liquid transfer molding system for encapsulating semiconductor integrated circuits Jan. 7, 2003
6491857 Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein Dec. 10, 2002
6482340 Sprayed-on foam wire harness Nov. 19, 2002
6432247 Method of manufacturing a soft hearing aid Aug. 13, 2002
6428731 Mould part, mould and method for encapsulating electronic components mounted on a carrier Aug. 6, 2002
6375778 Process for fabricating liners, and liner for a vehicle roof with integrated functions Apr. 23, 2002
6355199 Method of molding flexible circuit with molded stiffener Mar. 12, 2002
6344162 Method of manufacturing semiconductor devices and resin molding machine Feb. 5, 2002
6338813 Molding method for BGA semiconductor chip package Jan. 15, 2002

1 2 3 4


 
 
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