| |
 |
|
Class Information
Number: 264/272.13
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > With curing procedure, or procedure or treatment to compensate for differential expansion
Description: Processes in which there is claimed a step of curing the encapsulating material or some expedient is employed to compensate for the differing coefficients of expansion of an electrical component or part thereof and the encapsulant.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7582244 |
Electrosurgical electrode shroud |
Sep. 1, 2009 |
| 7462317 |
Method of manufacturing an encapsulated package for a magnetic device |
Dec. 9, 2008 |
| 7426780 |
Method of manufacturing a power module |
Sep. 23, 2008 |
| 7405656 |
Device and method for encapsulation and mounting of RFID devices |
Jul. 29, 2008 |
| 7381359 |
Method for making filled epoxy resin compositions |
Jun. 3, 2008 |
| 7378455 |
Molding composition and method, and molded article |
May. 27, 2008 |
| 7364684 |
Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels |
Apr. 29, 2008 |
| 7357886 |
Singular molded and co-molded electronic's packaging pre-forms |
Apr. 15, 2008 |
| 7359144 |
Overmold component seal in an electronic device housing |
Apr. 15, 2008 |
| 7300615 |
High frequency transformers and high Q factor inductors formed using epoxy-based magnetic polymer materials |
Nov. 27, 2007 |
| 7271513 |
Thermal stress relieved overmolded mounting base |
Sep. 18, 2007 |
| 7247060 |
Plate fitted resin molded article and method of molding it |
Jul. 24, 2007 |
| 7037455 |
Insert molding method |
May. 2, 2006 |
| 6989121 |
Method for encasing plastic array packages |
Jan. 24, 2006 |
| 6896837 |
Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length |
May. 24, 2005 |
| 6852263 |
Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition |
Feb. 8, 2005 |
| 6830719 |
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
Dec. 14, 2004 |
| 6696005 |
Method for making a polishing pad with built-in optical sensor |
Feb. 24, 2004 |
| 6652795 |
Production method for semiconductor devices using resin molding mold |
Nov. 25, 2003 |
| 6643909 |
Method of making a proximity probe |
Nov. 11, 2003 |
| 6616880 |
Method for encasing array packages |
Sep. 9, 2003 |
| 6544466 |
Surface modification method for molds used during semiconductor device fabrication |
Apr. 8, 2003 |
| 6537482 |
Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography |
Mar. 25, 2003 |
| 6531083 |
Sproutless pre-packaged molding for component encapsulation |
Mar. 11, 2003 |
| 6527999 |
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
Mar. 4, 2003 |
| 6488879 |
Method of producing an electronic device having a sheathed body |
Dec. 3, 2002 |
| 6455122 |
Heat-resisting fiber-reinforced composite material and manufacturing method thereof |
Sep. 24, 2002 |
| 6428731 |
Mould part, mould and method for encapsulating electronic components mounted on a carrier |
Aug. 6, 2002 |
| 6402534 |
Lever-actuated connector and method for forming a connector body |
Jun. 11, 2002 |
| 6355199 |
Method of molding flexible circuit with molded stiffener |
Mar. 12, 2002 |
| 6315933 |
Method of application of a transducer backing material |
Nov. 13, 2001 |
| 6315936 |
Encapsulation method using non-homogeneous molding compound pellets |
Nov. 13, 2001 |
| 6306331 |
Ultra mold for encapsulating very thin packages |
Oct. 23, 2001 |
| 6287503 |
Method for encasing array packages |
Sep. 11, 2001 |
| RE37340 |
Wire junction encapsulating wire connector and method of making same |
Aug. 28, 2001 |
| 6223421 |
Method of manufacturing a transformer coil with a disposable mandrel and mold |
May. 1, 2001 |
| 6214152 |
Lead frame moisture barrier for molded plastic electronic packages |
Apr. 10, 2001 |
| 6177040 |
Method for making light transparent package for integrated circuit |
Jan. 23, 2001 |
| 6096259 |
Fabrication method of plastic-molded lead component |
Aug. 1, 2000 |
| 6081978 |
Resin-encapsulated semiconductor device producing apparatus and method |
Jul. 4, 2000 |
| 5955021 |
Method of making smart cards |
Sep. 21, 1999 |
| 5928598 |
Method of making a microelectronic device package |
Jul. 27, 1999 |
| 5895620 |
Process for encapsulating an electronic component |
Apr. 20, 1999 |
| 5885505 |
Method for producing electronic part sealed body |
Mar. 23, 1999 |
| 5879502 |
Method for making an electronic module and electronic module obtained according to the method |
Mar. 9, 1999 |
| 5849230 |
Method of manufacturing a card with a built-in electronic part, formed of a plurality of resin layers |
Dec. 15, 1998 |
| 5830403 |
Method of post mold curing plastic encapsulated semiconductor chips mounted on lead frames by operating a post mold curing apparatus in association with a molding line system |
Nov. 3, 1998 |
| 5809635 |
Method for fixedly attaching covered wires to a head suspension load beam |
Sep. 22, 1998 |
| 5762853 |
Method of encapsulating a sensor into a panel body |
Jun. 9, 1998 |
| 5698152 |
Resin tablet for sealing semiconductor |
Dec. 16, 1997 |
|
|
|
