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Class Information
Number: 264/272.11
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating
Description: Processes in which the surrounded or embedded body, or at least a part thereof, is intended for use as component of an electrical circuit.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5399804 |
Semiconductor device and method of producing the same |
Mar. 21, 1995 |
| 5397522 |
Method of encapsulating an article |
Mar. 14, 1995 |
| 5377403 |
Method of manufacturing a pressure sensor assembly |
Jan. 3, 1995 |
| 5372665 |
Thermoplastic terminal encapsulation method and apparatus |
Dec. 13, 1994 |
| 5357083 |
Electro-welding sleeve obtained by fabrication method |
Oct. 18, 1994 |
| 5348460 |
Apparatus for producing flat plastic moldings, for example identity cards |
Sep. 20, 1994 |
| 5344604 |
Process for forming a substantially gas free encapsulation |
Sep. 6, 1994 |
| 5338602 |
Article of manufacture |
Aug. 16, 1994 |
| 5304512 |
Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process |
Apr. 19, 1994 |
| 5302269 |
Ion exchange membrane/electrode assembly having increased efficiency in proton exchange processes |
Apr. 12, 1994 |
| 5280133 |
Junction box for a solar panel |
Jan. 18, 1994 |
| 5279030 |
Method for producing an electric wire insert |
Jan. 18, 1994 |
| 5266739 |
Chip electronic device with a resin housing and manufacturing process thereof |
Nov. 30, 1993 |
| 5252053 |
Apparatus for closing a mold |
Oct. 12, 1993 |
| 5242642 |
Method of manufacturing a switch substrate |
Sep. 7, 1993 |
| 5236779 |
Article of manufacture |
Aug. 17, 1993 |
| 5229058 |
Environmental sealing |
Jul. 20, 1993 |
| 5228187 |
Method of making an idle position detection switch for engines |
Jul. 20, 1993 |
| 5205977 |
Method of securing an insert in a shell |
Apr. 27, 1993 |
| 5200125 |
Method for seal molding electronic components with resin |
Apr. 6, 1993 |
| 5194694 |
Base to a housing for an electrical component |
Mar. 16, 1993 |
| 5182853 |
Method for encapsulting IC chip |
Feb. 2, 1993 |
| 5182440 |
Process and connection component using an electrical resistor for the welding of plastic elements |
Jan. 26, 1993 |
| 5156715 |
Apparatus for applying two layers of plastic to a conductor |
Oct. 20, 1992 |
| 5153988 |
Method of making modular telecommunications terminal block |
Oct. 13, 1992 |
| 5151239 |
Method of making a wire junction encapsulating wire connector |
Sep. 29, 1992 |
| 5151147 |
Coated article production system |
Sep. 29, 1992 |
| 5140746 |
Method and device for making electrical connector |
Aug. 25, 1992 |
| 5140137 |
Electro-welding sleeve fabrication method, device for implementing it and sleeves obtained by the method |
Aug. 18, 1992 |
| 5139728 |
Method of using molding pot having configured bottom |
Aug. 18, 1992 |
| 5135694 |
Electronic device wristband |
Aug. 4, 1992 |
| 5128086 |
Epoxy-modified encapsulation composition |
Jul. 7, 1992 |
| 5112419 |
Method for producting strip cable |
May. 12, 1992 |
| 5106785 |
Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant |
Apr. 21, 1992 |
| 5104468 |
Method of producing a molded connection piece and method for joining tube with molded connection piece |
Apr. 14, 1992 |
| 5091135 |
Improvements in the encapsulation of electronic components employing low stress encapsulant composition |
Feb. 25, 1992 |
| 5064583 |
Method for applying mold release coating to separator plates for molding printed circuit boards |
Nov. 12, 1991 |
| 5059746 |
Housing assembly for electronic components |
Oct. 22, 1991 |
| 5038468 |
Method of insert molding with web placed in the mold |
Aug. 13, 1991 |
| 5024727 |
Method of forming an animal marker implanting system |
Jun. 18, 1991 |
| 4983110 |
Resin encapsulating apparatus for semiconductor devices |
Jan. 8, 1991 |
| 4980016 |
Process for producing electric circuit board |
Dec. 25, 1990 |
| 4942140 |
Method of packaging semiconductor device |
Jul. 17, 1990 |
| 4940504 |
Apparatus for extrusion |
Jul. 10, 1990 |
| 4906311 |
Method of making a hermetically sealed electronic component |
Mar. 6, 1990 |
| 4904429 |
Method of producing a molding of foamed resin having a section for fitting an electrical part |
Feb. 27, 1990 |
| 4891734 |
Vibration mount for electronic assemblies |
Jan. 2, 1990 |
| 4881885 |
Dam for lead encapsulation |
Nov. 21, 1989 |
| 4882298 |
Method for encapsulating microelectronic semiconductor and thin film devices |
Nov. 21, 1989 |
| 4879805 |
Method for making a circuit interrupter device |
Nov. 14, 1989 |
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