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Class Information
Number: 264/272.11
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating
Description: Processes in which the surrounded or embedded body, or at least a part thereof, is intended for use as component of an electrical circuit.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5879598 |
Method and apparatus for encapsulating electronic components |
Mar. 9, 1999 |
| 5875547 |
Cable sealing method |
Mar. 2, 1999 |
| 5864942 |
Method of making high voltage switches |
Feb. 2, 1999 |
| 5858500 |
Tamper respondent enclosure |
Jan. 12, 1999 |
| 5846469 |
Method for manufacturing a defibrillation electrode |
Dec. 8, 1998 |
| 5846476 |
Optical curing process for intergrated circuit package assembly |
Dec. 8, 1998 |
| 5843359 |
Method of manufacturing a case for electronic component |
Dec. 1, 1998 |
| 5840148 |
Method of assembly of implantable transponder |
Nov. 24, 1998 |
| 5837086 |
Method of injection-moulding plastics for electrical shielding casings |
Nov. 17, 1998 |
| 5825623 |
Packaging assemblies for encapsulated integrated circuit devices |
Oct. 20, 1998 |
| 5819394 |
Method of making board matched nested support fixture |
Oct. 13, 1998 |
| 5811132 |
Mold for semiconductor packages |
Sep. 22, 1998 |
| 5804126 |
Process for making preforms useful for encapsulating semiconductors |
Sep. 8, 1998 |
| 5800763 |
Method for producing data carriers with embedded elements |
Sep. 1, 1998 |
| 5781086 |
NRD guide circuit, radar module and radar apparatus |
Jul. 14, 1998 |
| 5768813 |
Carrier for an electronic identification device |
Jun. 23, 1998 |
| 5761804 |
Electronic circuit and a method for fabricating the electronic circuit |
Jun. 9, 1998 |
| 5744092 |
Axially movable cluster conduits for plastic processing in a screw machine |
Apr. 28, 1998 |
| 5728600 |
Circuit encapsulation process |
Mar. 17, 1998 |
| 5726391 |
Thermosetting Encapsulants for electronics packaging |
Mar. 10, 1998 |
| 5726386 |
Potted electrical circuits |
Mar. 10, 1998 |
| 5715594 |
Method of making removable computer peripheral cards having a solid one-piece housing |
Feb. 10, 1998 |
| 5709832 |
Method of manufacturing a printed antenna |
Jan. 20, 1998 |
| 5698152 |
Resin tablet for sealing semiconductor |
Dec. 16, 1997 |
| 5674343 |
Method for manufacturing a semiconductor |
Oct. 7, 1997 |
| 5674588 |
Welding sleeve for plastic pipe |
Oct. 7, 1997 |
| 5670097 |
Method of making blood gas sensors overcoats using permeable polymeric compositions |
Sep. 23, 1997 |
| 5658832 |
Method of forming a spacer for field emission flat panel displays |
Aug. 19, 1997 |
| 5647117 |
Method for sealing connected portions of lead wires of a switch device |
Jul. 15, 1997 |
| 5640746 |
Method of hermetically encapsulating a crystal oscillator using a thermoplastic shell |
Jun. 24, 1997 |
| H1654 |
Transfer molding process for encapsulating semiconductor devices |
Jun. 3, 1997 |
| 5622663 |
Method for preparing a continuous foam profile containing a filamentary core |
Apr. 22, 1997 |
| 5615475 |
Method of manufacturing an integrated package having a pair of die on a common lead frame |
Apr. 1, 1997 |
| 5609652 |
Method of manufacturing a synthetic resin part integrally formed with metal members |
Mar. 11, 1997 |
| 5606329 |
Buoyant cable antenna |
Feb. 25, 1997 |
| 5600885 |
Method of fabricating an overmold onto an electrical cable assembly terminated to a cable |
Feb. 11, 1997 |
| 5567175 |
Premold insert for a transparent plug |
Oct. 22, 1996 |
| 5556647 |
Encapsulation mold |
Sep. 17, 1996 |
| 5555488 |
Integrated circuit device having improved post for surface-mount package |
Sep. 10, 1996 |
| 5546657 |
Method of assembling wiring devices in continuous succession |
Aug. 20, 1996 |
| 5538586 |
Adhesiveless encapsulation of tab circuit traces for ink-jet pen |
Jul. 23, 1996 |
| 5538586 |
Adhesiveless encapsulation of tab circuit traces for ink-jet pen |
Jul. 23, 1996 |
| 5535510 |
Plastic encapsulated microelectronic device and method |
Jul. 16, 1996 |
| 5497136 |
Locating ring for encapsulating a coil |
Mar. 5, 1996 |
| 5490319 |
Thermotropic liquid crystal polymer composition and insulator |
Feb. 13, 1996 |
| 5462622 |
Molding an electrical element within a premold element and an overmold element to provide a one-piece component |
Oct. 31, 1995 |
| 5458716 |
Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid |
Oct. 17, 1995 |
| 5450286 |
Printed circuit having a dielectric covercoat |
Sep. 12, 1995 |
| 5419864 |
Process for encapsulating inserts with wet-laid material via compression molding |
May. 30, 1995 |
| 5407505 |
Method of encapsulating temperature sensitive devices in wax-like material having a high coefficient of fusion |
Apr. 18, 1995 |
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