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Class Information
Number: 257/E31.131
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Semiconductor devices responsive or sensitive to electromagnetic radiation (e.g., infrared radiation, adapted for conversion of radiation into electrical energy or for control of electrical energy by such radiation processes, or apparatus peculiar to manufacture or treatment of such devices, or of parts thereof) (epo) > Detail of nonsemiconductor component of radiation-sensitive semiconductor device (epo) > Arrangement for temperature regulation (e.g., cooling, heating, or ventilating) (epo)
Description: This subclass is indented under subclass E31.11. This subclass is substantially the same in scope as ECLA classification H01L31/024.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8692348 Photodetector Apr. 8, 2014
8597984 Modular low stress package technology Dec. 3, 2013
8569808 Temperature stabilitized MEMS Oct. 29, 2013
8524549 Method of fabricating thin-film transistor substrate Sep. 3, 2013
8471349 Photoreceiving device Jun. 25, 2013
8395255 Semiconductor device having a cooling function component Mar. 12, 2013
8350350 Optical sensor Jan. 8, 2013
8338902 Uncooled infrared image sensor Dec. 25, 2012
8304897 Thermal interface material design for enhanced thermal performance and improved package structural integrity Nov. 6, 2012
8252616 Package structure of photodiode and forming method thereof Aug. 28, 2012
8232129 Bonding solar cells directly to polyimide Jul. 31, 2012
8198628 Doped substrate to be heated Jun. 12, 2012
8145021 Cable for concentrating photovoltaic module Mar. 27, 2012
8053854 Micro-heater arrays and pn-junction devices having micro-heater arrays, and methods for fabricating the same Nov. 8, 2011
8044506 Thermal-emitting memory module, thermal-emitting module socket, and computer system Oct. 25, 2011
8030719 Thermal sensing and reset protection for an integrated circuit chip Oct. 4, 2011
8026567 Thermoelectric cooler for semiconductor devices with TSV Sep. 27, 2011
7964958 Heatsink structure for solid-state image sensor Jun. 21, 2011
7956456 Thermal interface material design for enhanced thermal performance and improved package structural integrity Jun. 7, 2011
7952190 Fabrication of microelectronic devices May. 31, 2011
7928564 Multichip module package and fabrication method Apr. 19, 2011
7911068 Component and method for producing a component Mar. 22, 2011
7872338 Microelectromechanical device packages with integral heaters Jan. 18, 2011
7851815 Light-emitting element having at least one light-emitting chip crystal Dec. 14, 2010
7839908 Mode control waveguide laser device Nov. 23, 2010
RE41869 Semiconductor device Oct. 26, 2010
7804148 Opto-thermal mask including aligned thermal dissipative layer, reflective layer and transparent capping layer Sep. 28, 2010
7745928 Heat dissipation plate and semiconductor device Jun. 29, 2010
7741160 Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate Jun. 22, 2010
7736997 Production method of flexible electronic device Jun. 15, 2010
7714433 Piezoelectric cooling of a semiconductor package May. 11, 2010
7713783 Electronic component package, electronic component using the package, and method for manufacturing electronic component package May. 11, 2010
7705449 Cooling apparatus for memory module Apr. 27, 2010
7692290 Heat slug and semiconductor package Apr. 6, 2010
7626261 Wafer stacked package having vertical heat emission path and method of fabricating the same Dec. 1, 2009
7598535 Light-emitting diode assembly and method of fabrication Oct. 6, 2009
7592695 Compound heat sink Sep. 22, 2009
7585702 Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate Sep. 8, 2009
7569931 Cooling semiconductor device and manufacturing method thereof Aug. 4, 2009
7439601 Linear integrated circuit temperature sensor apparatus with adjustable gain and offset Oct. 21, 2008
7417293 Image sensor packaging structure Aug. 26, 2008
7388286 Semiconductor package having enhanced heat dissipation and method of fabricating the same Jun. 17, 2008
7382047 Heat dissipation device Jun. 3, 2008
7352062 Integrated circuit package design Apr. 1, 2008
7235876 Semiconductor device having metallic plate with groove Jun. 26, 2007
7233065 Semiconductor device having capacitors for reducing power source noise Jun. 19, 2007
7180178 Semiconductor heat-dissipating substrate, and manufacturing method and package therefor Feb. 20, 2007
7115988 Bypass capacitor embedded flip chip package lid and stiffener Oct. 3, 2006
7112883 Semiconductor device with temperature control mechanism Sep. 26, 2006
7098079 Electronic assembly with high capacity thermal interface and methods of manufacture Aug. 29, 2006

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