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Class Information
Number: 257/E29.324
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Semiconductors devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo) > Types of semiconductor device (epo) > Controllable by variation of applied mechanical force (e.g., of pressure) (epo)
Description: This subclass is indented under subclass E29.166. This subclass is substantially the same in scope as ECLA classification H01L29/84.

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8710601 MEMS structure and method for making the same Apr. 29, 2014
8704315 CMOS integrated micromechanical resonators and methods for fabricating the same Apr. 22, 2014
8704318 Encapsulation structure for silicon pressure sensor Apr. 22, 2014
8704331 MEMS integrated chip with cross-area interconnection Apr. 22, 2014
8692338 Micro electronic device having CMOS circuit and MEMS resonator formed on common silicon substrate Apr. 8, 2014
8692337 Structure with a moving portion and a buried electrode for movement detection included in a multi-substrate configuration Apr. 8, 2014
8679886 Microelectronic device and MEMS package structure and fabricating method thereof Mar. 25, 2014
8680631 High aspect ratio capacitively coupled MEMS devices Mar. 25, 2014
8674464 MEMS component, method for producing a MEMS component, and method for handling a MEMS component Mar. 18, 2014
8674462 Sensor package Mar. 18, 2014
8673756 Out-of-plane spacer defined electrode Mar. 18, 2014
8674463 Multifunction MEMS element and integrated method for making MOS and multifunction MEMS Mar. 18, 2014
8653613 Electromechanical transducer and method of manufacturing the same Feb. 18, 2014
8653634 EMI-shielded semiconductor devices and methods of making Feb. 18, 2014
8648433 Method for producing oblique surfaces in a substrate and wafer having an oblique surface Feb. 11, 2014
8648432 Fully embedded micromechanical device, system on chip and method for manufacturing the same Feb. 11, 2014
8648431 Acoustic semiconductor device Feb. 11, 2014
8647908 Semiconductor pressure sensor and method of manufacturing semiconductor pressure sensor Feb. 11, 2014
8642986 Integrated circuit having microelectromechanical system device and method of fabricating the same Feb. 4, 2014
8637945 Component having a micromechanical microphone structure, and method for its production Jan. 28, 2014
8633049 Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom Jan. 21, 2014
8627720 Acceleration sensor Jan. 14, 2014
8624337 Resonant body transistor and oscillator Jan. 7, 2014
8618621 Semiconductor device layer structure and method of fabrication Dec. 31, 2013
8618620 Pressure sensor package systems and methods Dec. 31, 2013
8617960 Silicon microphone transducer Dec. 31, 2013
8614491 Package interface plate for package isolation structures Dec. 24, 2013
8604565 Physical quantity detection device and method for manufacturing the same Dec. 10, 2013
8604568 Multi-chip package Dec. 10, 2013
8592877 Embedded MEMS sensors and related methods Nov. 26, 2013
8592876 Micro-electro-mechanical system (MEMS) capacitive OHMIC switch and design structures Nov. 26, 2013
8580596 Front end micro cavity Nov. 12, 2013
8581251 Device for protecting an electronic integrated circuit housing against physical or chemical ingression Nov. 12, 2013
8581354 Semiconductor device carrying micro electro mechanical system Nov. 12, 2013
8581355 Micro electric mechanical system device and method of producing the same Nov. 12, 2013
8581357 Package comprising an electrical circuit Nov. 12, 2013
8575710 Capacitive semiconductor pressure sensor Nov. 5, 2013
8569851 Sensor and method for fabricating the same Oct. 29, 2013
8569850 Ultra low pressure sensor Oct. 29, 2013
8569115 Method of forming a compliant bipolar micro device transfer head with silicon electrodes Oct. 29, 2013
8564078 Method for producing a micromechanical component having a trench structure for backside contact Oct. 22, 2013
8564115 Package structure having micro-electromechanical element Oct. 22, 2013
8558330 Deep well process for MEMS pressure sensor Oct. 15, 2013
8558327 Micromechanical component and corresponding production method Oct. 15, 2013
8557698 Method for producing a micromechanical and/or nanomechanical device with anti-bonding stops Oct. 15, 2013
8557623 Methods and apparatuses for integrated packaging of microelectromechanical devices Oct. 15, 2013
8553911 Diaphragm of MEMS electroacoustic transducer Oct. 8, 2013
8552514 Semiconductor physical quantity sensor Oct. 8, 2013
8552513 Semiconductor pressure sensor Oct. 8, 2013
8552512 MEMS device and fabrication method thereof Oct. 8, 2013

1 2 3 4 5 6 7 8 9

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