Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Browse by Category: Main > Physics
Class Information
Number: 257/E27.161
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Device consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate, e.g., integrated circuit device (epo) > Including active semiconductor component sensitive to infrared radiation, light, or electromagnetic radiation of a shorter wavelength (epo) > Device controlled by radiation (epo) > Imager including structural or functional details of the device (epo) > Charge coupled imager (epo) > Infrared ccd or cid imager (epo) > Of the hybrid type (e.g., chip-on-chip, bonded substrates) (epo)
Description: This subclass is indented under subclass E27.16. This subclass is substantially the same in scope as ECLA classification H01L27/148J2.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8673740 Method for formation of an electrically conducting through via Mar. 18, 2014
8664083 Vertical outgassing channels Mar. 4, 2014
8525348 Chip scale package and fabrication method thereof Sep. 3, 2013
8441134 Chip stacking structure May. 14, 2013
8378482 Wiring board Feb. 19, 2013
8338932 Power semiconductor module with interconnected package portions Dec. 25, 2012
8319329 Stacked integrated circuit package having recessed sidewalls Nov. 27, 2012
8134237 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Mar. 13, 2012
8129257 Vertical outgassing channels Mar. 6, 2012
8129833 Stacked integrated circuit packages that include monolithic conductive vias Mar. 6, 2012
7998833 Method for bonding wafers Aug. 16, 2011
7977781 Semiconductor device Jul. 12, 2011
7960843 Chip arrangement and method of manufacturing a chip arrangement Jun. 14, 2011
7932612 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Apr. 26, 2011
7859027 Back irradiating type solid state imaging device Dec. 28, 2010
7834440 Semiconductor device with stacked memory and processor LSIs Nov. 16, 2010
7833836 Stack MCP and manufacturing method thereof Nov. 16, 2010
7807503 Die-wafer package and method of fabricating same Oct. 5, 2010
7781887 Semiconductor device including an interconnect Aug. 24, 2010
7777229 Method and apparatus for reducing smear in back-illuminated imaging sensors Aug. 17, 2010
7777350 Semiconductor stack package having wiring extension part which has hole for wiring Aug. 17, 2010
7663244 Semiconductor device and semiconductor wafer and a method for manufacturing the same Feb. 16, 2010
7663245 Interposer and stacked chip package Feb. 16, 2010
7638365 Stacked chip package and method for forming the same Dec. 29, 2009
7615871 Method and apparatus for attaching microelectronic substrates and support members Nov. 10, 2009
7608920 Memory card and method for devising Oct. 27, 2009
7605454 Memory card and method for devising Oct. 20, 2009
7598619 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Oct. 6, 2009
7578891 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device Aug. 25, 2009
7550856 Grooved substrates for uniform underfilling solder ball assembled electronic devices Jun. 23, 2009
7531905 Stacked semiconductor device May. 12, 2009
7508058 Stacked integrated circuit module Mar. 24, 2009
7491580 Method of manufacturing electro-optical device Feb. 17, 2009
7485969 Stacked microelectronic devices and methods for manufacturing microelectronic devices Feb. 3, 2009
7482695 Stack MCP and manufacturing method thereof Jan. 27, 2009
7474005 Microelectronic element chips Jan. 6, 2009
7436071 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Oct. 14, 2008
7432599 Memory module having interconnected and stacked integrated circuits Oct. 7, 2008
7417293 Image sensor packaging structure Aug. 26, 2008
7413928 Die-wafer package and method of fabricating same Aug. 19, 2008
7400047 Integrated circuit with stacked-die configuration utilizing substrate conduction Jul. 15, 2008
7378331 Methods of vertically stacking wafers using porous silicon May. 27, 2008
7335533 Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another Feb. 26, 2008
7332372 Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween Feb. 19, 2008
7327038 Semiconductor device package Feb. 5, 2008
7291927 Dual chips stacked packaging structure Nov. 6, 2007
7285864 Stack MCP Oct. 23, 2007
7276793 Semiconductor device and semiconductor module Oct. 2, 2007
7196425 Copper interposer for reducing warping of integrated circuit packages and method of making IC packages Mar. 27, 2007
7129111 Method for forming bump protective collars on a bumped wafer Oct. 31, 2006

1 2 3










 
 
  Recently Added Patents
Voltage regulators with improved wake-up response
Epoxy composition for encapsulating an optical semiconductor element
Prevention and reduction of blood loss
Generating a funding and investment strategy associated with an underfunded pension plan
Lighting elements
SIC semiconductor device and method for manufacturing the same
SONOS stack with split nitride memory layer
  Randomly Featured Patents
Vehicle turn signal switch actuator
Coolant flow measurement devices and methods of measuring coolant flow
System and method for the reduction of interference in an indoor communications wireless distribution system
Planing jig
Electrical energy storage device for solar cell
Switchable line powered modem
Isolated cells and populations comprising same for the treatment of CNS diseases
Flat structure permeable to liquid, and a method for manufacturing such a structure
Ceramic metal matrix diaphragm for loudspeakers
Centrifugal pump