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Class Information
Number: 257/E27.155
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Device consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate, e.g., integrated circuit device (epo) > Including active semiconductor component sensitive to infrared radiation, light, or electromagnetic radiation of a shorter wavelength (epo) > Device controlled by radiation (epo) > Imager including structural or functional details of the device (epo) > Charge coupled imager (epo) > Area ccd imager (epo) > Frame-interline transfer (epo)
Description: This subclass is indented under subclass E27.154. This subclass is substantially the same in scope as ECLA classification H01L27/148C2.

Patents under this class:

Patent Number Title Of Patent Date Issued
8653635 Power overlay structure with leadframe connections Feb. 18, 2014
8389379 Method for making a stressed structure designed to be dissociated Mar. 5, 2013
7902574 Solid state image pickup device and operating method thereof Mar. 8, 2011
7605411 Charge transfer device and imaging apparatus Oct. 20, 2009
6635911 Solid state image sensing device Oct. 21, 2003
6480226 Image pickup apparatus having gradation control function for providing image signals definitive of backlighted objects Nov. 12, 2002
6400404 Solid-state imaging device and camera using the same Jun. 4, 2002
6339213 Solid state imaging device and method for driving the same Jan. 15, 2002
5715001 Solid-state camera device and method of driving thereof Feb. 3, 1998

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