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Class Information
Number: 257/E27.144
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Device consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate, e.g., integrated circuit device (epo) > Including active semiconductor component sensitive to infrared radiation, light, or electromagnetic radiation of a shorter wavelength (epo) > Device controlled by radiation (epo) > Imager including structural or functional details of the device (epo) > Imager using a photoconductor layer (e.g., single photoconductor layer for all pixels) (epo) > Infrared imager (epo) > Of the hybrid type (e.g., chip-on-chip, bonded substrates) (epo)
Description: This subclass is indented under subclass E27.143. This subclass is substantially the same in scope as ECLA classification H01L27/146P3H.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8664083 Vertical outgassing channels Mar. 4, 2014
8592964 Apparatus and method for high density multi-chip structures Nov. 26, 2013
8525348 Chip scale package and fabrication method thereof Sep. 3, 2013
8441134 Chip stacking structure May. 14, 2013
8404518 Integrated circuit packaging system with package stacking and method of manufacture thereof Mar. 26, 2013
8399993 Embedded package and method for manufacturing the same Mar. 19, 2013
8378482 Wiring board Feb. 19, 2013
8338932 Power semiconductor module with interconnected package portions Dec. 25, 2012
8319329 Stacked integrated circuit package having recessed sidewalls Nov. 27, 2012
8134237 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Mar. 13, 2012
8129257 Vertical outgassing channels Mar. 6, 2012
8129833 Stacked integrated circuit packages that include monolithic conductive vias Mar. 6, 2012
8062956 Semiconductor on insulator and methods of forming same using temperature gradient in an anodic bonding process Nov. 22, 2011
8017450 Method of forming assymetrical encapsulant bead Sep. 13, 2011
7998833 Method for bonding wafers Aug. 16, 2011
7986043 Integrated circuit package on package system Jul. 26, 2011
7977781 Semiconductor device Jul. 12, 2011
7960843 Chip arrangement and method of manufacturing a chip arrangement Jun. 14, 2011
7932612 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Apr. 26, 2011
7833836 Stack MCP and manufacturing method thereof Nov. 16, 2010
7834440 Semiconductor device with stacked memory and processor LSIs Nov. 16, 2010
7825519 Method and device for wafer scale packaging of optical devices using a scribe and break process Nov. 2, 2010
7807503 Die-wafer package and method of fabricating same Oct. 5, 2010
7781879 Apparatus for integrating capacitors in stacked integrated circuits Aug. 24, 2010
7781887 Semiconductor device including an interconnect Aug. 24, 2010
7777350 Semiconductor stack package having wiring extension part which has hole for wiring Aug. 17, 2010
7737477 CMOS image sensor and method for manufacturing the same Jun. 15, 2010
7723852 Stacked semiconductor package and method of making same May. 25, 2010
7663244 Semiconductor device and semiconductor wafer and a method for manufacturing the same Feb. 16, 2010
7638365 Stacked chip package and method for forming the same Dec. 29, 2009
7615871 Method and apparatus for attaching microelectronic substrates and support members Nov. 10, 2009
7608920 Memory card and method for devising Oct. 27, 2009
7605454 Memory card and method for devising Oct. 20, 2009
7598619 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Oct. 6, 2009
7592650 High density hybrid MOSFET device Sep. 22, 2009
7578891 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device Aug. 25, 2009
7535100 Wafer bonding of thinned electronic materials and circuits to high performance substrates May. 19, 2009
7531905 Stacked semiconductor device May. 12, 2009
7508058 Stacked integrated circuit module Mar. 24, 2009
7491580 Method of manufacturing electro-optical device Feb. 17, 2009
7485969 Stacked microelectronic devices and methods for manufacturing microelectronic devices Feb. 3, 2009
7482695 Stack MCP and manufacturing method thereof Jan. 27, 2009
7436071 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Oct. 14, 2008
7432599 Memory module having interconnected and stacked integrated circuits Oct. 7, 2008
7425485 Method for forming microelectronic assembly Sep. 16, 2008
7417293 Image sensor packaging structure Aug. 26, 2008
7413928 Die-wafer package and method of fabricating same Aug. 19, 2008
7378331 Methods of vertically stacking wafers using porous silicon May. 27, 2008
7335533 Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another Feb. 26, 2008
7332372 Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween Feb. 19, 2008

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