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Class Information
Number: 257/E27.137
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Device consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate, e.g., integrated circuit device (epo) > Including active semiconductor component sensitive to infrared radiation, light, or electromagnetic radiation of a shorter wavelength (epo) > Device controlled by radiation (epo) > Imager including structural or functional details of the device (epo) > Photodiode array or mos imager (epo) > Infrared imager (epo) > Of the hybrid type (e.g., chip-on-chip, bonded substrates) (epo)
Description: This subclass is indented under subclass E27.136. This subclass is substantially the same in scope as ECLA classification H01L27/146F3H.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8664083 Vertical outgassing channels Mar. 4, 2014
8637953 Wafer scale membrane for three-dimensional integrated circuit device fabrication Jan. 28, 2014
8592964 Apparatus and method for high density multi-chip structures Nov. 26, 2013
8525348 Chip scale package and fabrication method thereof Sep. 3, 2013
8441134 Chip stacking structure May. 14, 2013
8404518 Integrated circuit packaging system with package stacking and method of manufacture thereof Mar. 26, 2013
8399993 Embedded package and method for manufacturing the same Mar. 19, 2013
8378482 Wiring board Feb. 19, 2013
8350372 Semiconductor device including a DC-DC converter Jan. 8, 2013
8319329 Stacked integrated circuit package having recessed sidewalls Nov. 27, 2012
8294231 Optical sensing device including visible and UV sensors Oct. 23, 2012
8174094 Bonded structures formed by plasma enhanced bonding May. 8, 2012
8159054 Semiconductor device Apr. 17, 2012
8134237 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Mar. 13, 2012
8129833 Stacked integrated circuit packages that include monolithic conductive vias Mar. 6, 2012
8129257 Vertical outgassing channels Mar. 6, 2012
8062956 Semiconductor on insulator and methods of forming same using temperature gradient in an anodic bonding process Nov. 22, 2011
8017450 Method of forming assymetrical encapsulant bead Sep. 13, 2011
8017902 Detector Sep. 13, 2011
8013430 Semiconductor device including DC-DC converter Sep. 6, 2011
7998833 Method for bonding wafers Aug. 16, 2011
7986043 Integrated circuit package on package system Jul. 26, 2011
7977781 Semiconductor device Jul. 12, 2011
7969023 Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof Jun. 28, 2011
7960843 Chip arrangement and method of manufacturing a chip arrangement Jun. 14, 2011
7932612 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Apr. 26, 2011
7932162 Method for manufacturing a stacked semiconductor package, and stacked semiconductor package Apr. 26, 2011
7902676 Stacked semiconductor device and fabricating method thereof Mar. 8, 2011
7863097 Method of preparing detectors for oxide bonding to readout integrated chips Jan. 4, 2011
7833836 Stack MCP and manufacturing method thereof Nov. 16, 2010
7834440 Semiconductor device with stacked memory and processor LSIs Nov. 16, 2010
7807503 Die-wafer package and method of fabricating same Oct. 5, 2010
7781879 Apparatus for integrating capacitors in stacked integrated circuits Aug. 24, 2010
7781887 Semiconductor device including an interconnect Aug. 24, 2010
7777350 Semiconductor stack package having wiring extension part which has hole for wiring Aug. 17, 2010
7767479 Quantum photonic imagers and methods of fabrication thereof Aug. 3, 2010
7750482 Integrated circuit package system including zero fillet resin Jul. 6, 2010
7723852 Stacked semiconductor package and method of making same May. 25, 2010
7663245 Interposer and stacked chip package Feb. 16, 2010
7663244 Semiconductor device and semiconductor wafer and a method for manufacturing the same Feb. 16, 2010
7638365 Stacked chip package and method for forming the same Dec. 29, 2009
7615871 Method and apparatus for attaching microelectronic substrates and support members Nov. 10, 2009
7608903 Image sensor with SOI substrate Oct. 27, 2009
7608920 Memory card and method for devising Oct. 27, 2009
7605454 Memory card and method for devising Oct. 20, 2009
7598619 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board Oct. 6, 2009
7592650 High density hybrid MOSFET device Sep. 22, 2009
7579694 Electronic devices including offset conductive bumps Aug. 25, 2009
7578891 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device Aug. 25, 2009
7535100 Wafer bonding of thinned electronic materials and circuits to high performance substrates May. 19, 2009

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