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Class Information
Number: 257/E27.115
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Device consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate, e.g., integrated circuit device (epo) > Including only passive thin-film or thick-film elements on a common insulating substrate (epo) > Thick-film circuits (epo)
Description: This subclass is indented under subclass E27.114. This subclass is substantially the same in scope as ECLA classification H01L27/01B.

Patents under this class:

Patent Number Title Of Patent Date Issued
7449740 Semiconductor memory device having capacitors and method for forming the same Nov. 11, 2008
7335538 Method for manufacturing bottom substrate of liquid crystal display device Feb. 26, 2008
6788171 Millimeter wave (MMW) radio frequency transceiver module and method of forming same Sep. 7, 2004
5757062 Ceramic substrate for semiconductor device May. 26, 1998
5754093 Thick-film printed substrate including an electrically connecting member and method for fabricating the same May. 19, 1998
5709927 Thick film circuit board Jan. 20, 1998
5699224 Thick-film capacitor and chip-type composite electronic component utilizing the same Dec. 16, 1997
5617298 Collinear terminated transmission line structure Apr. 1, 1997
5504986 Method of manufacturing collinear terminated transmission line structure with thick film circuitry Apr. 9, 1996
5362927 Thick film hybrid circuit board device Nov. 8, 1994
5256836 Thick film hybrid circuit board device and method of manufacturing the same Oct. 26, 1993
5225969 Multilayer hybrid circuit Jul. 6, 1993
5204166 Thick film resistor composition, hybrid IC using the composition, and process for producing the hybrid IC Apr. 20, 1993
5047368 Method of manufacturing a thick-film circuit arrangement Sep. 10, 1991
5029043 LC circuit incorporated ceramic substrate Jul. 2, 1991
4903110 Single plate capacitor having an electrode structure of high adhesion Feb. 20, 1990
4839775 Thick-film circuit arrangement having a ceramic substrate plate Jun. 13, 1989
4835038 Substrate coated with multiple thick films May. 30, 1989
4830878 Method of manufacturing a substrate coated with multiple thick films May. 16, 1989
4730241 Laminated hybrid integrated DC-DC converter Mar. 8, 1988
4591814 Electronic component comprising printed circuit elements disposed on a folded tape and method of making such component May. 27, 1986
4585580 Thick film copper compatible resistors based on hexaboride conductors and nonreducible glasses Apr. 29, 1986
4573101 LC Composite component Feb. 25, 1986
4493789 Electroconductive paste and process for producing electroconductive metallized ceramics using the same Jan. 15, 1985
4424251 Thick-film multi-layer wiring board Jan. 3, 1984
4406944 Devices for mounting infrared lamps in furnaces Sep. 27, 1983
4401709 Overglaze inks Aug. 30, 1983
4397800 Ceramic body having a metallized layer Aug. 9, 1983
4377642 Overglaze inks Mar. 22, 1983
4369254 Crossover dielectric inks Jan. 18, 1983
4369220 Crossover dielectric inks used in forming a multilayer electrical circuit Jan. 18, 1983
4350618 Thick film conductors for use in microelectronic packaging Sep. 21, 1982
4323652 Starting mixture for a dielectric composition, screen printing paste having such a starting mixture, and product obtained Apr. 6, 1982
4323483 Mixed oxide bonded copper conductor compositions Apr. 6, 1982
4322316 Thick film conductor employing copper oxide Mar. 30, 1982
4317750 Thick film conductor employing nickel oxide Mar. 2, 1982
4274124 Thick film capacitor having very low internal inductance Jun. 16, 1981
4255291 Air-fireable conductor composition Mar. 10, 1981
4251397 Vehicle for thick film resistors fireable in nonoxidizing atmosphere Feb. 17, 1981
4230493 Gold conductor compositions Oct. 28, 1980
4225468 Temperature coefficient of resistance modifiers for thick film resistors Sep. 30, 1980
4070200 Compositions containing diethylene glycol ether Jan. 24, 1978
4039721 Thick-layer conductor path pastes Aug. 2, 1977

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