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Class Information
Number: 257/E27.024
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Device consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate, e.g., integrated circuit device (epo) > Including semiconductor component with at least one potential barrier or surface barrier adapted for rectifying, oscillating, amplifying, or switching, or including integrated passive circuit elements (epo) > With semiconductor substrate only (epo) > Including a plurality of components in a non-repetitive configuration (epo) > Integrated circuit having a two-dimensional layout of components without a common active region (epo) > With component other than field-effect type (epo) > Including combination of diode, capacitor, or resistor (epo)
Description: This subclass is indented under subclass E27.018. This subclass is substantially the same in scope as ECLA classification H01L27/06D6V.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7550806 |
Bondwire utilized for coulomb counting and safety circuits |
Jun. 23, 2009 |
| 7511356 |
Voltage-controlled semiconductor inductor and method |
Mar. 31, 2009 |
| 7473982 |
Point contact array, not circuit, and electronic circuit comprising the same |
Jan. 6, 2009 |
| 7388275 |
Electronic package with integrated capacitor |
Jun. 17, 2008 |
| 7381582 |
Method and structure of ion implanted elements for the optimization of resistance |
Jun. 3, 2008 |
| 7332814 |
Bondwire utilized for coulomb counting and safety circuits |
Feb. 19, 2008 |
| 7199443 |
Integration of filters using on-chip transformers for RF and wireless applications |
Apr. 3, 2007 |
| 7148535 |
Zero capacitance bondpad utilizing active negative capacitance |
Dec. 12, 2006 |
| 7071811 |
High performance voltage control diffusion resistor |
Jul. 4, 2006 |
| 7049958 |
Integrated circuit for a transponder |
May. 23, 2006 |
| 6965165 |
Top layers of metal for high performance IC's |
Nov. 15, 2005 |
| 6936877 |
Integrated circuit including a capacitor with a high capacitance density |
Aug. 30, 2005 |
| 6936531 |
Process of fabricating a chip structure |
Aug. 30, 2005 |
| 6903620 |
Circuit configuration for setting the input resistance and the input capacitance of an integrated semiconductor circuit chip |
Jun. 7, 2005 |
| 6897507 |
Capacitor for high performance system-on-chip using post passivation device |
May. 24, 2005 |
| 6897492 |
Power device with bi-directional level shift circuit |
May. 24, 2005 |
| 6869870 |
High performance system-on-chip discrete components using post passivation process |
Mar. 22, 2005 |
| 6815798 |
Integrated capacitor for sensing the voltage applied to a terminal of an integrated or discrete power device on a semiconductor substrate |
Nov. 9, 2004 |
| 6762115 |
Chip structure and process for forming the same |
Jul. 13, 2004 |
| 6762440 |
Semiconductor component and corresponding test method |
Jul. 13, 2004 |
| 6759692 |
Gate driver with level shift circuit |
Jul. 6, 2004 |
| 6756295 |
Chip structure and process for forming the same |
Jun. 29, 2004 |
| 6670649 |
Triodic rectifier switch |
Dec. 30, 2003 |
| 6657310 |
Top layers of metal for high performance IC's |
Dec. 2, 2003 |
| 6638808 |
Method of manufacturing gate driver with level shift circuit |
Oct. 28, 2003 |
| 6627968 |
Integrated capacitor and fuse |
Sep. 30, 2003 |
| 6624079 |
Method for forming high resistance resistor with integrated high voltage device process |
Sep. 23, 2003 |
| 6621142 |
Precision high-frequency capacitor formed on semiconductor substrate |
Sep. 16, 2003 |
| 6620728 |
Top layers of metal for high performance IC's |
Sep. 16, 2003 |
| 6621143 |
Precision high-frequency capacitor on semiconductor substrate |
Sep. 16, 2003 |
| 6605854 |
Schottky diode with bump electrodes |
Aug. 12, 2003 |
| 6538300 |
Precision high-frequency capacitor formed on semiconductor substrate |
Mar. 25, 2003 |
| 6528383 |
Simultaneous formation of deep trench capacitor and resistor |
Mar. 4, 2003 |
| 6515369 |
High performance system-on-chip using post passivation process |
Feb. 4, 2003 |
| 6495426 |
Method for simultaneous formation of integrated capacitor and fuse |
Dec. 17, 2002 |
| 6489656 |
Resistor for high performance system-on-chip using post passivation process |
Dec. 3, 2002 |
| 6489647 |
Capacitor for high performance system-on-chip using post passivation process structure |
Dec. 3, 2002 |
| 6455885 |
Inductor structure for high performance system-on-chip using post passivation process |
Sep. 24, 2002 |
| 6417061 |
Zener diode and RC network combination semiconductor device for use in integrated circuits and method therefor |
Jul. 9, 2002 |
| 6383916 |
Top layers of metal for high performance IC's |
May. 7, 2002 |
| 6303423 |
Method for forming high performance system-on-chip using post passivation process |
Oct. 16, 2001 |
| 6278871 |
Integrated circuit including a low-dispersion capacitive network |
Aug. 21, 2001 |
| 6262442 |
Zener diode and RC network combination semiconductor device for use in integrated circuits |
Jul. 17, 2001 |
| 6140188 |
Semiconductor device having load device with trench isolation region and fabrication thereof |
Oct. 31, 2000 |
| 5847423 |
Semiconductor device having a thin film capacitor and a resistance measuring element |
Dec. 8, 1998 |
| 5736778 |
Silicon resistor with expansion plate electrode |
Apr. 7, 1998 |
| 5468673 |
Avalanche diode incorporated in a bipolar integrated circuit |
Nov. 21, 1995 |
| 5414295 |
Avalance diode incorporated in a bipolar integrated circuit |
May. 9, 1995 |
| 5343070 |
Mesa type PIN diode |
Aug. 30, 1994 |
| 5268310 |
Method for making a mesa type PIN diode |
Dec. 7, 1993 |
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