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Class Information
Number: 257/E25.031
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > Devices being of two or more types, e.g., forming hybrid circuits (epo) > Containers (epo)
Description: This subclass is indented under subclass E25.029. This subclass is substantially the same in scope as ECLA classification H01L25/16H.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7602057 |
Signal light using phosphor coated LEDs |
Oct. 13, 2009 |
| 7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Aug. 11, 2009 |
| 7547965 |
Package and package module of the package |
Jun. 16, 2009 |
| 7518227 |
Multiple die stack apparatus employing T-shaped interposer elements |
Apr. 14, 2009 |
| 7449726 |
Power semiconductor apparatus |
Nov. 11, 2008 |
| 7446406 |
Circuit device and manufacturing method thereof |
Nov. 4, 2008 |
| 7427810 |
Semiconductor device including semiconductor element mounted on another semiconductor element |
Sep. 23, 2008 |
| 7402884 |
Low crosstalk substrate for mixed-signal integrated circuits |
Jul. 22, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7355264 |
Integrated passive devices with high Q inductors |
Apr. 8, 2008 |
| 7352068 |
Multi-chip module |
Apr. 1, 2008 |
| 7342308 |
Component stacking for integrated circuit electronic package |
Mar. 11, 2008 |
| 7291924 |
Flip chip stacked package |
Nov. 6, 2007 |
| 7285862 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film |
Oct. 23, 2007 |
| 7282793 |
Multiple die stack apparatus employing T-shaped interposer elements |
Oct. 16, 2007 |
| 7230320 |
Electronic circuit device with reduced breaking and cracking |
Jun. 12, 2007 |
| 7227252 |
Semiconductor component having stacked, encapsulated dice and method of fabrication |
Jun. 5, 2007 |
| RE39628 |
Stackable flex circuit IC package and method of making same |
May. 15, 2007 |
| 7151010 |
Methods for assembling a stack package for high density integrated circuits |
Dec. 19, 2006 |
| 7148567 |
Semiconductor integrated circuit device |
Dec. 12, 2006 |
| 7138726 |
Protective interleaf for stacked wafer shipping |
Nov. 21, 2006 |
| 7132746 |
Electronic assembly with solder-bonded heat sink |
Nov. 7, 2006 |
| 7109576 |
Semiconductor component having encapsulated die stack |
Sep. 19, 2006 |
| 7071550 |
Semiconductor module having heat sink serving as wiring line |
Jul. 4, 2006 |
| 7034392 |
Duplexer |
Apr. 25, 2006 |
| 7023706 |
Semiconductor device and manufacturing the same |
Apr. 4, 2006 |
| 7018218 |
Device for controlling a vehicle |
Mar. 28, 2006 |
| 6985364 |
Voltage converter module |
Jan. 10, 2006 |
| 6956743 |
Electronic component, in particular regulator for generators in motor vehicles |
Oct. 18, 2005 |
| 6950305 |
Overmolded device with contoured surface |
Sep. 27, 2005 |
| 6917526 |
Electronic component module |
Jul. 12, 2005 |
| 6894373 |
Surface-mounting type of electronic circuit unit suitable for miniaturization and a method for fabricating the unit |
May. 17, 2005 |
| 6888064 |
Modular packaging arrangements and methods |
May. 3, 2005 |
| 6882538 |
Intelligent power module |
Apr. 19, 2005 |
| 6858930 |
Multi chip module |
Feb. 22, 2005 |
| 6843335 |
Power conversion apparatus and mobile object incorporating thereof |
Jan. 18, 2005 |
| 6825066 |
Stiffener design |
Nov. 30, 2004 |
| 6818974 |
Semiconductor device |
Nov. 16, 2004 |
| 6791183 |
Power semiconductor module and cooling element for holding the power semiconductor module |
Sep. 14, 2004 |
| 6774465 |
Semiconductor power package module |
Aug. 10, 2004 |
| 6748645 |
Method of obtaining a module including an inductive winding |
Jun. 15, 2004 |
| 6734543 |
Module housing and power semiconductor module |
May. 11, 2004 |
| 6710439 |
Three-dimensional power semiconductor module and method of manufacturing the same |
Mar. 23, 2004 |
| 6707369 |
Power distributing box and power-device module |
Mar. 16, 2004 |
| 6703703 |
Low cost power semiconductor module without substrate |
Mar. 9, 2004 |
| 6703699 |
Semiconductor device |
Mar. 9, 2004 |
| 6680532 |
Multi chip module |
Jan. 20, 2004 |
| 6628526 |
Electronic device manufacturing method, electronic device and resin filling method |
Sep. 30, 2003 |
| 6618267 |
Multi-level electronic package and method for making same |
Sep. 9, 2003 |
| 6613979 |
Electrical circuit suspension system |
Sep. 2, 2003 |
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