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Browse by Category: Main > Physics
Class Information
Number: 257/E25.03
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > Devices being of two or more types, e.g., forming hybrid circuits (epo) > Devices being mounted on two or more different substrates (epo)
Description: This subclass is indented under subclass E25.029. This subclass is substantially the same in scope as ECLA classification H01L25/16F.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8587123 Multi-chip and multi-substrate reconstitution based packaging Nov. 19, 2013
8575724 Semiconductor device having under-filled die in a die stack Nov. 5, 2013
8551830 Semiconductor integrated circuit switch matrix Oct. 8, 2013
8546929 Embedded integrated circuit package-on-package system Oct. 1, 2013
8546186 Planar interconnect structure for hybrid circuits Oct. 1, 2013
8525326 IC package with capacitors disposed on an interposal layer Sep. 3, 2013
8427844 Widebody coil isolators Apr. 23, 2013
8390133 Semiconductor device and manufacturing method thereof Mar. 5, 2013
8378379 Substrate for mounting light-emitting element and light-emitting device Feb. 19, 2013
8310035 Semiconductor package and system Nov. 13, 2012
8283763 Power semiconductor module and fabrication method thereof Oct. 9, 2012
8169058 Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars May. 1, 2012
8169066 Semiconductor package May. 1, 2012
8159075 Semiconductor chip stack and manufacturing method thereof Apr. 17, 2012
8148201 Planar interconnect structure for hybrid circuits Apr. 3, 2012
8148806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions Apr. 3, 2012
8148825 Integrated circuit package system with leadfinger Apr. 3, 2012
8110930 Die backside metallization and surface activated bonding for stacked die packages Feb. 7, 2012
8093983 Narrowbody coil isolator Jan. 10, 2012
8004869 Memory circuit arrangement and method for the production thereof Aug. 23, 2011
7961487 Power converter device Jun. 14, 2011
7952196 Affordable high performance high frequency multichip module fabrication and apparatus May. 31, 2011
7948079 Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof May. 24, 2011
7901955 Method of constructing a stacked-die semiconductor structure Mar. 8, 2011
7859118 Multi-substrate region-based package and method for fabricating the same Dec. 28, 2010
7812390 Semiconductor memory device with memory cells on multiple layers Oct. 12, 2010
7764530 Memory circuit arrangement and method for the production thereof Jul. 27, 2010
7696615 Semiconductor device having pillar-shaped terminal Apr. 13, 2010
7652368 Semiconductor device Jan. 26, 2010
7652358 Semiconductor device including main substrate and sub substrates Jan. 26, 2010
7612448 Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner Nov. 3, 2009
7602070 Room temperature metal direct bonding Oct. 13, 2009
7569922 Semiconductor device having a bonding wire and method for manufacturing the same Aug. 4, 2009
7514777 Power semiconductor module Apr. 7, 2009
7468551 Multiple chips bonded to packaging structure with low noise and multiple selectable functions Dec. 23, 2008
7420281 Stacked chip semiconductor device Sep. 2, 2008
7382000 Semiconductor device Jun. 3, 2008
7372139 Semiconductor chip package May. 13, 2008
7355264 Integrated passive devices with high Q inductors Apr. 8, 2008
7342308 Component stacking for integrated circuit electronic package Mar. 11, 2008
7247932 Chip package with capacitor Jul. 24, 2007
7217587 MEMS scanning mirror with trenched surface and tapered comb teeth for reducing inertia and deformation May. 15, 2007
7208833 Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate Apr. 24, 2007
7205646 Electronic device and chip package Apr. 17, 2007
7164201 Semiconductor module with scalable construction Jan. 16, 2007
7154171 Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor Dec. 26, 2006
7138708 Electronic system for fixing power and signal semiconductor chips Nov. 21, 2006
7057275 Device with power semiconductor components for controlling the power of high currents and use of said device Jun. 6, 2006
7057272 Power supply connection structure to a semiconductor device Jun. 6, 2006
6995463 Integrated chip package having intermediate substrate and multiple semiconductor chips Feb. 7, 2006

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