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Class Information
Number: 257/E25.029
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > Devices being of two or more types, e.g., forming hybrid circuits (epo)
Description: This subclass is indented under subclass E25.001. This subclass is substantially the same in scope as ECLA classification H01L25/16.

Sub-classes under this class:

Class Number Class Name Patents
257/E25.032 Comprising optoelectronic devices, e.g., led, photodiodes (epo) 486
257/E25.031 Containers (epo) 163
257/E25.03 Devices being mounted on two or more different substrates (epo) 165

Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8710676 Stacked structure and stacked method for three-dimensional chip Apr. 29, 2014
8704329 SOI devices for plasma display panel driver chip Apr. 22, 2014
8643174 Calibration of temperature sensitive circuits with heater elements Feb. 4, 2014
8569881 Semiconductor device Oct. 29, 2013
8476689 Super CMOS devices on a microelectronics system Jul. 2, 2013
8415790 Semiconductor package having passive device and method for making the same Apr. 9, 2013
8399994 Semiconductor chip and semiconductor package having the same Mar. 19, 2013
8368173 Semiconductor package and method for making the same Feb. 5, 2013
8358005 Packaged gallium nitride material transistors and methods associated with the same Jan. 22, 2013
8288852 Semiconductor device Oct. 16, 2012
8278146 Manufacturing method of chip package with coplanarity controlling feature Oct. 2, 2012
8178978 Support mounted electrically interconnected die assembly May. 15, 2012
8174115 Multi-chip package memory device May. 8, 2012
8148813 Integrated circuit package architecture Apr. 3, 2012
8125080 Semiconductor power module packages with simplified structure and methods of fabricating the same Feb. 28, 2012
8076779 Reduction of macro level stresses in copper/low-K wafers Dec. 13, 2011
8049303 Semiconductor device with power noise suppression Nov. 1, 2011
8039939 Embedded wiring board, semiconductor package including the same and method of fabricating the same Oct. 18, 2011
8018038 IC card with terminals for direct access to internal components Sep. 13, 2011
8008699 Semiconductor device with circuit for reduced parasitic inductance Aug. 30, 2011
7973405 Integrated circuit for driving semiconductor device and power converter Jul. 5, 2011
7964976 Layered chip package and method of manufacturing same Jun. 21, 2011
7915707 Deformable integrated circuit device Mar. 29, 2011
7897477 Method of forming an isolation structure Mar. 1, 2011
7892948 Method for manufacturing SOI wafer and SOI wafer Feb. 22, 2011
7888709 Capacitive micromachined ultrasonic transducer and manufacturing method Feb. 15, 2011
7875953 Low crosstalk substrate for mixed-signal integrated circuits Jan. 25, 2011
7868439 Chip package and substrate thereof Jan. 11, 2011
7829971 Semiconductor apparatus Nov. 9, 2010
7821124 Thin, thermally enhanced flip chip in a leaded molded package Oct. 26, 2010
7804171 Techniques for packaging a multiple device component Sep. 28, 2010
7795728 Electronic component Sep. 14, 2010
7763974 Integrated circuit for driving semiconductor device and power converter Jul. 27, 2010
7696615 Semiconductor device having pillar-shaped terminal Apr. 13, 2010
7687885 Semiconductor device with reduced parasitic inductance Mar. 30, 2010
7687896 Semiconductor device having a stacked chip structure Mar. 30, 2010
7670862 Silicon optoelectronic device, manufacturing method thereof, and image input and/or output apparatus using the same Mar. 2, 2010
7663247 Semiconductor intergrated circuit device Feb. 16, 2010
7566575 Mounting circuit and method for producing semiconductor-chip-mounting circuit Jul. 28, 2009
7564073 CMOS and HCMOS semiconductor integrated circuit Jul. 21, 2009
7557421 Hybrid radio frequency integrated circuit using gallium nitride epitaxy layers grown on a donor substrate Jul. 7, 2009
7557437 Fan out type wafer level package structure and method of the same Jul. 7, 2009
7537956 Silicon optoelectronic device manufacturing method and silicon optoelectronic device manufactured by thereof and image input and/or output apparatus having the same May. 26, 2009
7518229 Versatile Si-based packaging with integrated passive components for mmWave applications Apr. 14, 2009
7485569 Printed circuit board including embedded chips and method of fabricating the same Feb. 3, 2009
7408262 Semiconductor integrated circuit device Aug. 5, 2008
7402884 Low crosstalk substrate for mixed-signal integrated circuits Jul. 22, 2008
7385281 Semiconductor integrated circuit device Jun. 10, 2008
7382000 Semiconductor device Jun. 3, 2008
7355264 Integrated passive devices with high Q inductors Apr. 8, 2008

1 2 3 4 5 6 7 8

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