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Browse by Category: Main > Physics
Class Information
Number: 257/E25.027
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices having separate containers (epo) > Semiconductors devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.024. This subclass is substantially the same in scope as ECLA classification H01L25/11S.










Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8710642 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus Apr. 29, 2014
8704380 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods Apr. 22, 2014
8680667 Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements Mar. 25, 2014
8659135 Semiconductor device stack and method for its production Feb. 25, 2014
8659149 Semiconductor structure with galvanic isolation Feb. 25, 2014
8653671 System for relieving stress and improving heat management in a 3D chip stack Feb. 18, 2014
8653642 Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems Feb. 18, 2014
8653637 Stack type semiconductor package apparatus Feb. 18, 2014
8642383 Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires Feb. 4, 2014
8643193 Semiconductor packages and electronic systems including the same Feb. 4, 2014
8618672 Three dimensional stacked chip package structure Dec. 31, 2013
8618646 Layered chip package and method of manufacturing same Dec. 31, 2013
8569885 Stacked semiconductor packages and related methods Oct. 29, 2013
8564137 System for relieving stress and improving heat management in a 3D chip stack having an array of inter-stack connections Oct. 22, 2013
8546956 Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding Oct. 1, 2013
8546932 Thin substrate PoP structure Oct. 1, 2013
8546929 Embedded integrated circuit package-on-package system Oct. 1, 2013
8536713 System in package with heat sink Sep. 17, 2013
8525329 Component stacking for integrated circuit electronic package Sep. 3, 2013
8519523 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Aug. 27, 2013
8513793 Stacked semiconductor package and method of fabricating the same Aug. 20, 2013
8502370 Stack package structure and fabrication method thereof Aug. 6, 2013
8487421 Microelectronic package with stacked microelectronic elements and method for manufacture thereof Jul. 16, 2013
8486759 Method for forming terminal of stacked package element and method for forming stacked package Jul. 16, 2013
8450839 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices May. 28, 2013
8432042 System and method for relieving stress and improving heat management in a 3D chip stack having an array of inter-stack connections Apr. 30, 2013
8426981 Composite layered chip package Apr. 23, 2013
8426979 Composite layered chip package Apr. 23, 2013
8426958 Stacked chip package with redistribution lines Apr. 23, 2013
8421087 Semiconductor module including a switch and non-central diode Apr. 16, 2013
8405221 Semiconductor device and multilayer semiconductor device Mar. 26, 2013
8399992 Package-on-package type semiconductor package Mar. 19, 2013
8362602 Layered chip package and method of manufacturing same Jan. 29, 2013
8362482 Semiconductor device and structure Jan. 29, 2013
8350373 Chip stacked structure and method of fabricating the same Jan. 8, 2013
8344519 Stacked-die package for battery power management Jan. 1, 2013
8338962 Semiconductor package substrate and semiconductor package having the same Dec. 25, 2012
8338933 Three-dimensional package structure Dec. 25, 2012
8338928 Three-dimensional package structure Dec. 25, 2012
8319326 Stacked die with vertically-aligned conductors and methods for making the same Nov. 27, 2012
8319329 Stacked integrated circuit package having recessed sidewalls Nov. 27, 2012
8310045 Semiconductor package with heat dissipation devices Nov. 13, 2012
8304918 Method for manufacturing electronic device and electronic device Nov. 6, 2012
8304876 Semiconductor package and method for manufacturing the same Nov. 6, 2012
8299585 Power semiconductor device Oct. 30, 2012
8299627 Semiconductor packages and electronic systems including the same Oct. 30, 2012
8268673 Stacked electronic component and manufacturing method thereof Sep. 18, 2012
8247895 4D device process and structure Aug. 21, 2012
8242717 Light output device Aug. 14, 2012
8237266 Component stacking for integrated circuit electronic package Aug. 7, 2012

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