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Class Information
Number: 257/E25.023
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices having separate containers (epo) > Device consisting of plurality of semiconductor or other solid-state devices or components formed in or on common substrate, e.g., integrated circuit device (epo)
Description: This subclass is indented under subclass E25.022. This subclass is substantially the same in scope as ECLA classification H01L25/10J.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8669656 Interconnect having ultra high speed signal transmission/reception Mar. 11, 2014
8629001 Semiconductor device and method of manufacturing semiconductor device Jan. 14, 2014
8598715 Bump-on-trace structures in packaging Dec. 3, 2013
8586465 Through silicon via dies and packages Nov. 19, 2013
8587107 Silicon carbide semiconductor Nov. 19, 2013
8507318 Method for manufacturing microelectronic devices Aug. 13, 2013
8508029 Semiconductor package including an integrated waveguide Aug. 13, 2013
8508036 Ultra-thin near-hermetic package based on rainier Aug. 13, 2013
8482291 Substrate structure Jul. 9, 2013
8395245 Semiconductor package module Mar. 12, 2013
8372693 Semiconductor device including semiconductor chips with different thickness Feb. 12, 2013
8362626 Semiconductor device with non-overlapped circuits Jan. 29, 2013
8310061 Stacked die parallel plate capacitor Nov. 13, 2012
8299596 Integrated circuit packaging system with bump conductors and method of manufacture thereof Oct. 30, 2012
8269326 Semiconductor device assemblies Sep. 18, 2012
8237251 Semiconductor device including semiconductor chips with different thickness Aug. 7, 2012
8217269 Electrical microfilament to circuit interface Jul. 10, 2012
8198131 Stackable semiconductor device packages Jun. 12, 2012
8198713 Semiconductor wafer structure Jun. 12, 2012
RE43444 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes Jun. 5, 2012
8093718 Chip structure and stacked structure of chips Jan. 10, 2012
8093700 Packaging millimeter wave modules Jan. 10, 2012
8067827 Stacked microelectronic device assemblies Nov. 29, 2011
8049319 Ultra wideband system-on-package Nov. 1, 2011
8035115 Semiconductor apparatus, print head, and image forming apparatus Oct. 11, 2011
8003438 Circuit module and manufacturing method thereof Aug. 23, 2011
7999376 Semiconductor device and its manufacturing method Aug. 16, 2011
7994626 Multi-layer semiconductor package with vertical connectors and method of manufacture thereof Aug. 9, 2011
7989940 System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures Aug. 2, 2011
7973401 Stacked chip package with redistribution lines Jul. 5, 2011
7968989 Multi-package slot array Jun. 28, 2011
7939918 Chip packages with covers May. 10, 2011
7936057 High bandwidth package May. 3, 2011
7932593 Multipackage module having stacked packages with asymmetrically arranged die and molding Apr. 26, 2011
7902648 Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods Mar. 8, 2011
7888784 Substrate package with through holes for high speed I/O flex cable Feb. 15, 2011
7868434 Integrated circuit package-on-package stacking system Jan. 11, 2011
7851900 Stacked semiconductor package Dec. 14, 2010
7842550 Method of fabricating quad flat non-leaded package Nov. 30, 2010
7834344 Nanometric structure and corresponding manufacturing method Nov. 16, 2010
RE41721 Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes Sep. 21, 2010
7772686 Memory card fabricated using SiP/SMT hybrid technology Aug. 10, 2010
7768005 Physically highly secure multi-chip assembly Aug. 3, 2010
7737539 Integrated circuit package system including honeycomb molding Jun. 15, 2010
7718472 Integrated circuit package-on-package stacking system and method of manufacture thereof May. 18, 2010
7714424 Stacked-type semiconductor package May. 11, 2010
7701045 Point-to-point connection topology for stacked devices Apr. 20, 2010
7687897 Mountable integrated circuit package-in-package system with adhesive spacing structures Mar. 30, 2010
7671458 Connecting member used for semiconductor device including plurality of arranged semiconductor modules and semiconductor device provided with the same Mar. 2, 2010
7659623 Semiconductor device having improved wiring Feb. 9, 2010

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