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Class Information
Number: 257/E25.022
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices having separate containers (epo)
Description: This subclass is indented under subclass E25.002. This subclass is substantially the same in scope as ECLA classification H01L25/10.










Sub-classes under this class:

Class Number Class Name Patents
257/E25.023 Device consisting of plurality of semiconductor or other solid-state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) 852
257/E25.028 Incoherent light-emitting semiconductor devices having potential or surface barrier (epo) 133
257/E25.024 Semiconductors devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo) 10


Patents under this class:
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Patent Number Title Of Patent Date Issued
8035115 Semiconductor apparatus, print head, and image forming apparatus Oct. 11, 2011
7902668 Flip chip semiconductor device including an unconnected neutralizing electrode Mar. 8, 2011
7582960 Multiple chip package module including die stacked over encapsulated package Sep. 1, 2009
7332808 Semiconductor module and method of manufacturing the same Feb. 19, 2008
7105377 Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process Sep. 12, 2006
6514793 Stackable flex circuit IC package and method of making same Feb. 4, 2003
6426549 Stackable flex circuit IC package and method of making same Jul. 30, 2002
6426240 Stackable flex circuit chip package and method of making same Jul. 30, 2002
6351029 Stackable flex circuit chip package and method of making same Feb. 26, 2002
6323060 Stackable flex circuit IC package and method of making same Nov. 27, 2001
6191493 Resin seal semiconductor package and manufacturing method of the same Feb. 20, 2001
6168970 Ultra high density integrated circuit packages Jan. 2, 2001
6151220 Mounting structure for electronic part Nov. 21, 2000
6137162 Chip stack package Oct. 24, 2000
RE36916 Apparatus for stacking semiconductor chips Oct. 17, 2000
6072234 Stack of equal layer neo-chips containing encapsulated IC chips of different sizes Jun. 6, 2000
6049123 Ultra high density integrated circuit packages Apr. 11, 2000
6025642 Ultra high density integrated circuit packages Feb. 15, 2000
5953588 Stackable layers containing encapsulated IC chips Sep. 14, 1999
5757445 Single crystal silicon tiles for display panels May. 26, 1998
5583335 Method of making an eye tracking system having an active matrix display Dec. 10, 1996
5566051 Ultra high density integrated circuit packages method and apparatus Oct. 15, 1996
5561591 Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package Oct. 1, 1996
5550711 Ultra high density integrated circuit packages Aug. 27, 1996
5543664 Ultra high density integrated circuit package Aug. 6, 1996
5539550 Liquid crystal display having adhered circuit tiles Jul. 23, 1996
5514907 Apparatus for stacking semiconductor chips May. 7, 1996
5499160 High density integrated circuit module with snap-on rail assemblies Mar. 12, 1996
5499124 Polysilicon transistors formed on an insulation layer which is adjacent to a liquid crystal material Mar. 12, 1996
5475920 Method of assembling ultra high density integrated circuit packages Dec. 19, 1995
5446620 Ultra high density integrated circuit packages Aug. 29, 1995
5420751 Ultra high density modular integrated circuit package May. 30, 1995
5376561 High density electronic circuit modules Dec. 27, 1994
5377031 Single crystal silicon tiles for liquid crystal display panels including light shielding layers Dec. 27, 1994
5377077 Ultra high density integrated circuit packages method and apparatus Dec. 27, 1994
5367766 Ultra high density integrated circuit packages method Nov. 29, 1994
5331149 Eye tracking system having an array of photodetectors aligned respectively with an array of pixels Jul. 19, 1994
5279029 Ultra high density integrated circuit packages method Jan. 18, 1994
5258325 Method for manufacturing a semiconductor device using a circuit transfer film Nov. 2, 1993
5256562 Method for manufacturing a semiconductor device using a circuit transfer film Oct. 26, 1993
4807105 Circuit arrangement for producing high DC voltage from medium-frequency AC voltage Feb. 21, 1989
4670678 Rotating rectifying device for the excitation of a synchronous machine Jun. 2, 1987
4614964 Coaxial semiconductor package Sep. 30, 1986
4441150 High-voltage rectifier unit Apr. 3, 1984
4321664 Rectifier assembly with heat sink Mar. 23, 1982
4320446 Cockcroft-Walton voltage multiplying circuit for slim hole well logging tool Mar. 16, 1982
4288711 Alternator-rectifier construction where sheet metal diode support plates support a bearing Sep. 8, 1981
4284915 Mobile alternator-rectifier combination construction, particularly for automotive vehicles Aug. 18, 1981
4273185 Device for holding a disc-shaped semiconductor element Jun. 16, 1981
4110821 Semiconductor device having a semiconductor accommodated in a sealed vessel Aug. 29, 1978

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