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Class Information
Number: 257/E25.021
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Incoherent light-emitting semiconductor devices having potential or surface barrier (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.019. This subclass is substantially the same in scope as ECLA classification H01L25/075S.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7378726 |
Stacked packages with interconnecting pins |
May. 27, 2008 |
| 7375418 |
Interposer stacking system and method |
May. 20, 2008 |
| 7375420 |
Large area transducer array |
May. 20, 2008 |
| 7372140 |
Memory module with different types of multi chip packages |
May. 13, 2008 |
| 7355271 |
Flexible assembly of stacked chips |
Apr. 8, 2008 |
| 7355273 |
Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods |
Apr. 8, 2008 |
| 7335974 |
Multi stack packaging chip and method of manufacturing the same |
Feb. 26, 2008 |
| 7309913 |
Stacked semiconductor packages |
Dec. 18, 2007 |
| 7304375 |
Castellation wafer level packaging of integrated circuit chips |
Dec. 4, 2007 |
| 7301242 |
Programmable system in package |
Nov. 27, 2007 |
| 7298038 |
Integrated circuit package system including die stacking |
Nov. 20, 2007 |
| 7298037 |
Stacked integrated circuit package-in-package system with recessed spacer |
Nov. 20, 2007 |
| 7288835 |
Integrated circuit package-in-package system |
Oct. 30, 2007 |
| 7282791 |
Stacked semiconductor device and semiconductor memory module |
Oct. 16, 2007 |
| 7265441 |
Stackable single package and stacked multi-chip assembly |
Sep. 4, 2007 |
| 7253530 |
Method for producing chip stacks |
Aug. 7, 2007 |
| 7247933 |
Thin multiple semiconductor die package |
Jul. 24, 2007 |
| 7235870 |
Microelectronic multi-chip module |
Jun. 26, 2007 |
| 7187068 |
Methods and apparatuses for providing stacked-die devices |
Mar. 6, 2007 |
| 7157787 |
Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices |
Jan. 2, 2007 |
| 7119425 |
Stacked multi-chip semiconductor package improving connection reliability of stacked chips |
Oct. 10, 2006 |
| 7119429 |
3-D stackable semiconductor package |
Oct. 10, 2006 |
| 7075501 |
Head mounted display system |
Jul. 11, 2006 |
| 7064354 |
Color mixing light emitting diode |
Jun. 20, 2006 |
| 7008078 |
Light source having blue, blue-green, orange and red LED's |
Mar. 7, 2006 |
| 6961190 |
Bulk lens, light emitting body, lighting device and optical information system |
Nov. 1, 2005 |
| 6956322 |
Semiconductor light emitting device with stacked light emitting elements |
Oct. 18, 2005 |
| 6919935 |
Method of forming an active matrix display |
Jul. 19, 2005 |
| 6876149 |
Double-face LED device for an electronic instrument |
Apr. 5, 2005 |
| 6876006 |
Radiation source |
Apr. 5, 2005 |
| 6864627 |
Image display device and light emission device |
Mar. 8, 2005 |
| 6817735 |
Illumination light source |
Nov. 16, 2004 |
| 6720730 |
High power led lamp |
Apr. 13, 2004 |
| 6642545 |
Semiconductor light emitting device |
Nov. 4, 2003 |
| 6639251 |
Light emitting element array module and printer head and micro-display using the same |
Oct. 28, 2003 |
| 6635987 |
High power white LED lamp structure using unique phosphor application for LED lighting products |
Oct. 21, 2003 |
| 6636185 |
Head-mounted display system |
Oct. 21, 2003 |
| 6633120 |
LED lamps |
Oct. 14, 2003 |
| 6627953 |
High density electronic circuit modules |
Sep. 30, 2003 |
| 6593978 |
Method for manufacturing active matrix liquid crystal displays |
Jul. 15, 2003 |
| 6586874 |
Image display device and light emission device |
Jul. 1, 2003 |
| 6563139 |
Package structure of full color LED form by overlap cascaded die bonding |
May. 13, 2003 |
| 6525464 |
Stacked light-mixing LED |
Feb. 25, 2003 |
| 6521940 |
High density electronic circuit modules |
Feb. 18, 2003 |
| 6490402 |
Flexible flat color display |
Dec. 3, 2002 |
| 6486929 |
Bonded layer semiconductor device |
Nov. 26, 2002 |
| 6465961 |
Semiconductor light source using a heat sink with a plurality of panels |
Oct. 15, 2002 |
| 6424020 |
High Density electronic circuit modules |
Jul. 23, 2002 |
| 6414783 |
Method of transferring semiconductors |
Jul. 2, 2002 |
| 6403985 |
Method of making light emitting diode displays |
Jun. 11, 2002 |
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