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Class Information
Number: 257/E25.021
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Incoherent light-emitting semiconductor devices having potential or surface barrier (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.019. This subclass is substantially the same in scope as ECLA classification H01L25/075S.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8710642 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus Apr. 29, 2014
8704354 Package on package structures and methods for forming the same Apr. 22, 2014
8686451 Optical-electronic component and method for production thereof Apr. 1, 2014
8680667 Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements Mar. 25, 2014
8653642 Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems Feb. 18, 2014
8643193 Semiconductor packages and electronic systems including the same Feb. 4, 2014
8618646 Layered chip package and method of manufacturing same Dec. 31, 2013
8618670 Corrosion control of stacked integrated circuits Dec. 31, 2013
8618672 Three dimensional stacked chip package structure Dec. 31, 2013
8569885 Stacked semiconductor packages and related methods Oct. 29, 2013
8563979 Method for producing display device Oct. 22, 2013
8558399 Dual molded multi-chip package system Oct. 15, 2013
8546929 Embedded integrated circuit package-on-package system Oct. 1, 2013
8546932 Thin substrate PoP structure Oct. 1, 2013
8530276 Method for manufacturing a microelectronic device and a microelectronic device thus manufactured Sep. 10, 2013
8519523 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Aug. 27, 2013
8502370 Stack package structure and fabrication method thereof Aug. 6, 2013
8487421 Microelectronic package with stacked microelectronic elements and method for manufacture thereof Jul. 16, 2013
8450839 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices May. 28, 2013
8446016 Chip stack package May. 21, 2013
8426958 Stacked chip package with redistribution lines Apr. 23, 2013
8405221 Semiconductor device and multilayer semiconductor device Mar. 26, 2013
8350373 Chip stacked structure and method of fabricating the same Jan. 8, 2013
8344519 Stacked-die package for battery power management Jan. 1, 2013
8338962 Semiconductor package substrate and semiconductor package having the same Dec. 25, 2012
8324681 Stacked non-volatile memory device and methods for fabricating the same Dec. 4, 2012
8319326 Stacked die with vertically-aligned conductors and methods for making the same Nov. 27, 2012
8319329 Stacked integrated circuit package having recessed sidewalls Nov. 27, 2012
8304918 Method for manufacturing electronic device and electronic device Nov. 6, 2012
8299627 Semiconductor packages and electronic systems including the same Oct. 30, 2012
8263438 Method for connecting a die assembly to a substrate in an integrated circuit Sep. 11, 2012
8227905 Stackable semiconductor package Jul. 24, 2012
8212364 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance Jul. 3, 2012
8178960 Stacked semiconductor package and method of manufacturing thereof May. 15, 2012
8178982 Dual molded multi-chip package system May. 15, 2012
8164171 System-in packages Apr. 24, 2012
8148825 Integrated circuit package system with leadfinger Apr. 3, 2012
8138611 Semiconductor device having shifted stacked chips Mar. 20, 2012
8129824 Shielding for a semiconductor package Mar. 6, 2012
8129833 Stacked integrated circuit packages that include monolithic conductive vias Mar. 6, 2012
8115290 Storage medium and semiconductor package Feb. 14, 2012
8110929 Semiconductor module Feb. 7, 2012
8110909 Semiconductor package including top-surface terminals for mounting another semiconductor package Feb. 7, 2012
8102032 System and method for compartmental shielding of stacked packages Jan. 24, 2012
8049322 Integrated circuit package-in-package system and method for making thereof Nov. 1, 2011
8039928 Chip stack package Oct. 18, 2011
8039943 Semiconductor device and manufacturing method therefor Oct. 18, 2011
8035115 Semiconductor apparatus, print head, and image forming apparatus Oct. 11, 2011
8030748 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Oct. 4, 2011
8026129 Stacked integrated circuits package system with passive components Sep. 27, 2011

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