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Class Information
Number: 257/E25.018
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Semiconductor devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo) > Stacked arrangements of nonapertured devices (epo)
Description: This subclass is indented under subclass E25.014. This subclass is substantially the same in scope as ECLA classification H01L25/07S.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8629545 Stub minimization for assemblies without wirebonds to package substrate Jan. 14, 2014
8618670 Corrosion control of stacked integrated circuits Dec. 31, 2013
8618673 Package structures Dec. 31, 2013
8604619 Through silicon via keep out zone formation along different crystal orientations Dec. 10, 2013
8558399 Dual molded multi-chip package system Oct. 15, 2013
8551830 Semiconductor integrated circuit switch matrix Oct. 8, 2013
8546929 Embedded integrated circuit package-on-package system Oct. 1, 2013
8530276 Method for manufacturing a microelectronic device and a microelectronic device thus manufactured Sep. 10, 2013
8513034 Method of manufacturing layered chip package Aug. 20, 2013
8497544 Repairing defects in a nonvolatile semiconductor memory module utilizing a heating element Jul. 30, 2013
8426981 Composite layered chip package Apr. 23, 2013
8373261 Chip stack package and method of fabricating the same Feb. 12, 2013
8362602 Layered chip package and method of manufacturing same Jan. 29, 2013
8319329 Stacked integrated circuit package having recessed sidewalls Nov. 27, 2012
8310045 Semiconductor package with heat dissipation devices Nov. 13, 2012
8304880 Integrated circuit packaging system with package-on-package and method of manufacture thereof Nov. 6, 2012
8299585 Power semiconductor device Oct. 30, 2012
8264075 Stacked-die package including substrate-ground coupling Sep. 11, 2012
8237253 Package structures Aug. 7, 2012
8227905 Stackable semiconductor package Jul. 24, 2012
8222721 Integrated circuit suitable for use in radio receivers Jul. 17, 2012
8212364 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance Jul. 3, 2012
8203214 Integrated circuit package in package system with adhesiveless package attach Jun. 19, 2012
8178875 Nonvolatile memory device and method for manufacturing same May. 15, 2012
8178982 Dual molded multi-chip package system May. 15, 2012
8148825 Integrated circuit package system with leadfinger Apr. 3, 2012
8072083 Stacked electronic component package having film-on-wire spacer Dec. 6, 2011
8063474 Embedded die package on package (POP) with pre-molded leadframe Nov. 22, 2011
8048727 Methods of forming SRAM devices having buried layer patterns Nov. 1, 2011
8048766 Integrated circuit on high performance chip Nov. 1, 2011
8049322 Integrated circuit package-in-package system and method for making thereof Nov. 1, 2011
8044497 Stacked die package Oct. 25, 2011
8035205 Molding compound flow controller Oct. 11, 2011
8008763 Stacked electronic component and manufacturing method thereof Aug. 30, 2011
7994620 Stacked semiconductor device Aug. 9, 2011
7994627 Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same Aug. 9, 2011
7982298 Package in package semiconductor device Jul. 19, 2011
7964950 Electronic parts packaging structure and method of manufacturing the same Jun. 21, 2011
7964948 Chip stack, chip stack package, and method of forming chip stack and chip stack package Jun. 21, 2011
7906854 Semiconductor device having spacer formed on semiconductor chip connected with wire Mar. 15, 2011
7898075 Semiconductor package having resin substrate with recess and method of fabricating the same Mar. 1, 2011
7884483 Chip connector Feb. 8, 2011
7872340 Integrated circuit package system employing an offset stacked configuration Jan. 18, 2011
7863721 Method and apparatus for wafer level integration using tapered vias Jan. 4, 2011
7851900 Stacked semiconductor package Dec. 14, 2010
7834464 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device Nov. 16, 2010
7786562 Stackable semiconductor chip layer comprising prefabricated trench interconnect vias Aug. 31, 2010
7767494 Method of manufacturing layered chip package Aug. 3, 2010
7737542 Stackable semiconductor package Jun. 15, 2010
7705468 Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same Apr. 27, 2010

1 2 3

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