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Class Information
Number: 257/E25.017
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Semiconductor devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo) > Apertured devices mounted on one or more rods passed through apertures (epo)
Description: This subclass is indented under subclass E25.014. This subclass is substantially the same in scope as ECLA classification H01L25/07R.










Patents under this class:

Patent Number Title Of Patent Date Issued
8587127 Semiconductor structures and methods of forming the same Nov. 19, 2013
8446000 Package structure and package process May. 21, 2013
8415661 Methods of self-aligned growth of chalcogenide memory access device Apr. 9, 2013
8399297 Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages Mar. 19, 2013
8344516 Integrated chip carrier with compliant interconnects Jan. 1, 2013
8174126 Stacked multi-chip May. 8, 2012
8164171 System-in packages Apr. 24, 2012
8124456 Methods for securing semiconductor devices using elongated fasteners Feb. 28, 2012
8110910 Stack package Feb. 7, 2012
8067840 Power amplifier assembly Nov. 29, 2011
8058732 Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same Nov. 15, 2011
8030780 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods Oct. 4, 2011
8008667 Semiconductor device including a transparent semiconductor layer for viewing an underlying transistor in a semiconductor substrate Aug. 30, 2011
7898095 Fiducial scheme adapted for stacked integrated circuits Mar. 1, 2011
7855444 Mountable integrated circuit package system with substrate Dec. 21, 2010
7723213 Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips May. 25, 2010
7663232 Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems Feb. 16, 2010
7193307 Multi-layer FET array and method of fabricating Mar. 20, 2007
7061094 Multilayer printed circuit board including first and second signal traces and a first ground trace Jun. 13, 2006
6492720 Flat-type semiconductor stack Dec. 10, 2002
5309011 Wafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed therein May. 3, 1994
5191224 Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein Mar. 2, 1993
4126883 Pressure-mounted semiconductive structure Nov. 21, 1978











 
 
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