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Browse by Category: Main > Physics
Class Information
Number: 257/E25.016
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Semiconductor devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo) > Devices being arranged next to each other (epo)
Description: This subclass is indented under subclass E25.014. This subclass is substantially the same in scope as ECLA classification H01L25/07N.










Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8552541 Power device packages having thermal electric modules using peltier effect and methods of fabricating the same Oct. 8, 2013
8546925 Synchronous buck converter having coplanar array of contact bumps of equal volume Oct. 1, 2013
8536713 System in package with heat sink Sep. 17, 2013
8502385 Power semiconductor device Aug. 6, 2013
8390109 Chip package with plank stack of semiconductor dies Mar. 5, 2013
8357952 Power semiconductor structure with field effect rectifier and fabrication method thereof Jan. 22, 2013
8358005 Packaged gallium nitride material transistors and methods associated with the same Jan. 22, 2013
8304889 Power semiconductor module and fabrication method thereof Nov. 6, 2012
8283763 Power semiconductor module and fabrication method thereof Oct. 9, 2012
8138593 Packaged microchip with spacer for mitigating electrical leakage between components Mar. 20, 2012
8114709 Electronic device and lead frame Feb. 14, 2012
8093634 In situ formed drain and source regions in a silicon/germanium containing transistor device Jan. 10, 2012
8071465 Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device Dec. 6, 2011
8049311 Electronic component and method for its production Nov. 1, 2011
8049319 Ultra wideband system-on-package Nov. 1, 2011
7986015 Semiconductor device with STI and method for manufacturing the semiconductor device Jul. 26, 2011
7956459 Semiconductor device and method of assembly Jun. 7, 2011
7919793 Semiconductor integrated circuit Apr. 5, 2011
7911051 Electronic circuit arrangement and method for producing an electronic circuit arrangement Mar. 22, 2011
7880283 High reliability power module Feb. 1, 2011
7851907 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting Dec. 14, 2010
7808049 Semiconductor device Oct. 5, 2010
7768005 Physically highly secure multi-chip assembly Aug. 3, 2010
7745930 Semiconductor device packages with substrates for redistributing semiconductor device electrodes Jun. 29, 2010
7741703 Electronic device and lead frame Jun. 22, 2010
7687901 Heat dissipating fins opposite semiconductor elements Mar. 30, 2010
7619313 Multi-chip module and methods Nov. 17, 2009
7612418 Monolithic power semiconductor structures including pairs of integrated devices Nov. 3, 2009
7601602 Trench type buried on-chip precision programmable resistor Oct. 13, 2009
7557442 Power semiconductor arrangement Jul. 7, 2009
7514780 Power semiconductor device Apr. 7, 2009
7498674 Semiconductor module having a coupling substrate, and methods for its production Mar. 3, 2009
7432593 Semiconductor package assembly and method for electrically isolating modules Oct. 7, 2008
7427810 Semiconductor device including semiconductor element mounted on another semiconductor element Sep. 23, 2008
7414299 Semiconductor package assembly and method for electrically isolating modules Aug. 19, 2008
7382000 Semiconductor device Jun. 3, 2008
7342262 Split-gate power module for suppressing oscillation therein Mar. 11, 2008
7312473 Display device and electronic device using the same Dec. 25, 2007
7227259 Low-inductance circuit arrangement for power semiconductor modules Jun. 5, 2007
7064448 Power controller with bond wire fuse Jun. 20, 2006
7057298 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material Jun. 6, 2006
7057275 Device with power semiconductor components for controlling the power of high currents and use of said device Jun. 6, 2006
7049688 Semiconductor device having a pair of heat sinks and method for manufacturing the same May. 23, 2006
7045884 Semiconductor device package May. 16, 2006
7042730 Non-isolated heatsink(s) for power modules May. 9, 2006
7042074 Power semiconductor module and method for producing it May. 9, 2006
7042744 Diode stack May. 9, 2006
7034345 High-power, integrated AC switch module with distributed array of hybrid devices Apr. 25, 2006
7030491 Power semiconductor module with deflection-resistant base plate Apr. 18, 2006
7023086 Semiconductor component arrangement with a reduced oscillation tendency Apr. 4, 2006

1 2 3 4 5 6 7 8










 
 
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