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Class Information
Number: 257/E25.016
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Semiconductor devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo) > Devices being arranged next to each other (epo)
Description: This subclass is indented under subclass E25.014. This subclass is substantially the same in scope as ECLA classification H01L25/07N.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619313 |
Multi-chip module and methods |
Nov. 17, 2009 |
| 7612418 |
Monolithic power semiconductor structures including pairs of integrated devices |
Nov. 3, 2009 |
| 7601602 |
Trench type buried on-chip precision programmable resistor |
Oct. 13, 2009 |
| 7557442 |
Power semiconductor arrangement |
Jul. 7, 2009 |
| 7514780 |
Power semiconductor device |
Apr. 7, 2009 |
| 7498674 |
Semiconductor module having a coupling substrate, and methods for its production |
Mar. 3, 2009 |
| 7432593 |
Semiconductor package assembly and method for electrically isolating modules |
Oct. 7, 2008 |
| 7427810 |
Semiconductor device including semiconductor element mounted on another semiconductor element |
Sep. 23, 2008 |
| 7414299 |
Semiconductor package assembly and method for electrically isolating modules |
Aug. 19, 2008 |
| 7382000 |
Semiconductor device |
Jun. 3, 2008 |
| 7342262 |
Split-gate power module for suppressing oscillation therein |
Mar. 11, 2008 |
| 7312473 |
Display device and electronic device using the same |
Dec. 25, 2007 |
| 7227259 |
Low-inductance circuit arrangement for power semiconductor modules |
Jun. 5, 2007 |
| 7064448 |
Power controller with bond wire fuse |
Jun. 20, 2006 |
| 7057298 |
Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
Jun. 6, 2006 |
| 7057275 |
Device with power semiconductor components for controlling the power of high currents and use of said device |
Jun. 6, 2006 |
| 7049688 |
Semiconductor device having a pair of heat sinks and method for manufacturing the same |
May. 23, 2006 |
| 7045884 |
Semiconductor device package |
May. 16, 2006 |
| 7042074 |
Power semiconductor module and method for producing it |
May. 9, 2006 |
| 7042730 |
Non-isolated heatsink(s) for power modules |
May. 9, 2006 |
| 7042744 |
Diode stack |
May. 9, 2006 |
| 7034345 |
High-power, integrated AC switch module with distributed array of hybrid devices |
Apr. 25, 2006 |
| 7030491 |
Power semiconductor module with deflection-resistant base plate |
Apr. 18, 2006 |
| 7023086 |
Semiconductor component arrangement with a reduced oscillation tendency |
Apr. 4, 2006 |
| 7019390 |
Silicon nitride insulating substrate for power semiconductor module |
Mar. 28, 2006 |
| 7012810 |
Leadframe-based module DC bus design to reduce module inductance |
Mar. 14, 2006 |
| 7009291 |
Semiconductor module and semiconductor device |
Mar. 7, 2006 |
| 7009116 |
Contact device and a process to facilitate contact of power electronics components and an assembly that consists of one or several power electronics components |
Mar. 7, 2006 |
| 7006270 |
Optical scanning device, image forming apparatus, and optical scanning method |
Feb. 28, 2006 |
| 7005739 |
High power semiconductor module |
Feb. 28, 2006 |
| 6987670 |
Dual power module power system architecture |
Jan. 17, 2006 |
| 6982482 |
Packaging of solid state devices |
Jan. 3, 2006 |
| 6979204 |
Pressure piece for use in a power semiconductor module |
Dec. 27, 2005 |
| 6969907 |
Cooling structure for multichip module |
Nov. 29, 2005 |
| 6970357 |
Rectifier bridge assembly |
Nov. 29, 2005 |
| 6967402 |
Hermetically sealed semiconductor power module and large scale module comprising the same |
Nov. 22, 2005 |
| 6958534 |
Power semiconductor module |
Oct. 25, 2005 |
| 6946740 |
High power MCM package |
Sep. 20, 2005 |
| 6943445 |
Semiconductor device having bridge-connected wiring structure |
Sep. 13, 2005 |
| 6943293 |
High power electronic package with enhanced cooling characteristics |
Sep. 13, 2005 |
| 6940136 |
Circuit arrangement with semiconductor elements arranged in chips |
Sep. 6, 2005 |
| 6933593 |
Power module having a heat sink |
Aug. 23, 2005 |
| 6930879 |
Electronic module |
Aug. 16, 2005 |
| 6927969 |
Circuit arrangement |
Aug. 9, 2005 |
| 6921969 |
Semiconductor module and method of producing a semiconductor module |
Jul. 26, 2005 |
| 6914325 |
Power semiconductor module |
Jul. 5, 2005 |
| 6906404 |
Power module with voltage overshoot limiting |
Jun. 14, 2005 |
| 6900986 |
Power module |
May. 31, 2005 |
| 6897558 |
Power electronic component module and method for assembling same |
May. 24, 2005 |
| 6885097 |
Semiconductor device |
Apr. 26, 2005 |
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