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Browse by Category: Main > Physics
Class Information
Number: 257/E25.015
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Semiconductor devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (epo) > Devices being arranged next and on each other, i.e., mixed assemblies (epo)
Description: This subclass is indented under subclass E25.014. This subclass is substantially the same in scope as ECLA classification H01L25/07M.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8586991 Semiconductor device Nov. 19, 2013
8552565 Chip package and method for forming the same Oct. 8, 2013
8536713 System in package with heat sink Sep. 17, 2013
8461620 Laser pumping of thyristors for fast high current rise-times Jun. 11, 2013
8426244 High speed, high density, low power die interconnect system Apr. 23, 2013
8426968 High speed, high density, low power die interconnect system Apr. 23, 2013
8357952 Power semiconductor structure with field effect rectifier and fabrication method thereof Jan. 22, 2013
8217515 Semiconductor mounting substrate and method for manufacturing the same Jul. 10, 2012
8212257 Semiconductor device Jul. 3, 2012
8049319 Ultra wideband system-on-package Nov. 1, 2011
8008759 Pre-molded clip structure Aug. 30, 2011
7999383 High speed, high density, low power die interconnect system Aug. 16, 2011
7948078 Semiconductor device May. 24, 2011
7898067 Pre-molded, clip-bonded multi-die semiconductor package Mar. 1, 2011
7880283 High reliability power module Feb. 1, 2011
7786596 Hermetic seal and reliable bonding structures for 3D applications Aug. 31, 2010
7629612 Semiconductor device Dec. 8, 2009
7595222 Semiconductor device and manufacturing method thereof Sep. 29, 2009
7573126 Matching circuits on optoelectronic devices Aug. 11, 2009
7569920 Electronic component having at least one vertical semiconductor power transistor Aug. 4, 2009
7427810 Semiconductor device including semiconductor element mounted on another semiconductor element Sep. 23, 2008
7332808 Semiconductor module and method of manufacturing the same Feb. 19, 2008
7227246 Matching circuits on optoelectronic devices Jun. 5, 2007
7227260 Method and system for a pad structure for use with a semiconductor package Jun. 5, 2007
7215000 Selectively encased surface metal structures in a semiconductor device May. 8, 2007
7042086 Stacked semiconductor module and assembling method of the same May. 9, 2006
6885096 Semiconductor device having at least three power terminals superposed on each other Apr. 26, 2005
6774476 Power converter and method for producing the same Aug. 10, 2004
6697257 Power semiconductor module Feb. 24, 2004
6642576 Power semiconductor device having layered structure of power semiconductor elements and terminal members Nov. 4, 2003
6621703 Automotive bridge rectifier assembly with thermal protection Sep. 16, 2003
6528911 Rectifier assembly for automotive alternators Mar. 4, 2003
6462382 MOS type semiconductor apparatus Oct. 8, 2002
6388316 Semiconductor module May. 14, 2002
6327128 Automotive bridge rectifier assembly with thermal protection Dec. 4, 2001
6285076 Press-connection semiconductor device and press-connection semiconductor assembly Sep. 4, 2001
6278179 Power electronic device Aug. 21, 2001
6229180 MOS type semiconductor apparatus May. 8, 2001
6198615 Voltage unit bus clip Mar. 6, 2001
6034862 Diode module assembly with bifurcated terminals Mar. 7, 2000
5892676 Rectifier bridges assembly having improved heat dispersing characteristics and an arcing-free design Apr. 6, 1999
5859468 Micro semiconductor bridge rectifier and method of manufacturing the same Jan. 12, 1999
RE35807 Power semiconductor packaging May. 26, 1998
5631806 Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints May. 20, 1997
5574312 Low-inductance power semiconductor module Nov. 12, 1996
5532512 Direct stacked and flip chip power semiconductor device structures Jul. 2, 1996
5446314 Low profile metal-ceramic-metal packaging Aug. 29, 1995
5218231 Mold-type semiconductor device Jun. 8, 1993
4613892 Laminated semiconductor assembly Sep. 23, 1986
4599636 Two terminal axial lead suppressor and diode bridge device Jul. 8, 1986

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