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Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.

Patents under this class:

Patent Number Title Of Patent Date Issued
7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides Sep. 30, 2008
7420262 Electronic component and semiconductor wafer, and method for producing the same Sep. 2, 2008
7411294 Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer Aug. 12, 2008
7405472 Semiconductor device Jul. 29, 2008
7402903 Semiconductor device Jul. 22, 2008
7388293 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions Jun. 17, 2008
7385299 Stackable integrated circuit package system with multiple interconnect interface Jun. 10, 2008
7385283 Three dimensional integrated circuit and method of making the same Jun. 10, 2008
7385282 Stacked-type chip package structure Jun. 10, 2008
7385281 Semiconductor integrated circuit device Jun. 10, 2008
7378726 Stacked packages with interconnecting pins May. 27, 2008
7375420 Large area transducer array May. 20, 2008
7375418 Interposer stacking system and method May. 20, 2008
7372140 Memory module with different types of multi chip packages May. 13, 2008
7365418 Multi-chip structure Apr. 29, 2008
7364946 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package Apr. 29, 2008
7364945 Method of mounting an integrated circuit package in an encapsulant cavity Apr. 29, 2008
7358616 Semiconductor stacked die/wafer configuration and packaging and method thereof Apr. 15, 2008
7358602 Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer Apr. 15, 2008
7355274 Semiconductor package, manufacturing method thereof and IC chip Apr. 8, 2008
7355273 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods Apr. 8, 2008
7355271 Flexible assembly of stacked chips Apr. 8, 2008
7354800 Method of fabricating a stacked integrated circuit package system Apr. 8, 2008
7342308 Component stacking for integrated circuit electronic package Mar. 11, 2008
7339275 Multi-chips semiconductor device assemblies and methods for fabricating the same Mar. 4, 2008
7335974 Multi stack packaging chip and method of manufacturing the same Feb. 26, 2008
7332736 Article comprising gated field emission structures with centralized nanowires and method for making the same Feb. 19, 2008
7321164 Stack structure with semiconductor chip embedded in carrier Jan. 22, 2008
7309913 Stacked semiconductor packages Dec. 18, 2007
7304375 Castellation wafer level packaging of integrated circuit chips Dec. 4, 2007
7301242 Programmable system in package Nov. 27, 2007
7298038 Integrated circuit package system including die stacking Nov. 20, 2007
7298037 Stacked integrated circuit package-in-package system with recessed spacer Nov. 20, 2007
7291926 Multi-chip package structure Nov. 6, 2007
7285862 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film Oct. 23, 2007
7282791 Stacked semiconductor device and semiconductor memory module Oct. 16, 2007
7279785 Stacked die package system Oct. 9, 2007
7276787 Silicon chip carrier with conductive through-vias and method for fabricating same Oct. 2, 2007
7271047 Test structure and method for measuring the resistance of line-end vias Sep. 18, 2007
7268438 Semiconductor element including a wet prevention film Sep. 11, 2007
7268435 Capacitive semiconductor sensor Sep. 11, 2007
7265442 Stacked package integrated circuit Sep. 4, 2007
7265441 Stackable single package and stacked multi-chip assembly Sep. 4, 2007
7253530 Method for producing chip stacks Aug. 7, 2007
7253529 Multi-chip package structure Aug. 7, 2007
7253512 Organic dielectric electronic interconnect structures and method for making Aug. 7, 2007
7250684 Circular wire-bond pad, package made therewith, and method of assembling same Jul. 31, 2007
7247935 Semiconductor device Jul. 24, 2007
7247934 Multi-chip semiconductor package Jul. 24, 2007
7247933 Thin multiple semiconductor die package Jul. 24, 2007

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