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Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.

Patents under this class:

Patent Number Title Of Patent Date Issued
7763973 Integrated heat sink for a microchip Jul. 27, 2010
7759783 Integrated circuit package system employing thin profile techniques Jul. 20, 2010
7755190 Electronic device including a nickel-palladium alloy layer Jul. 13, 2010
7755180 Integrated circuit package-in-package system Jul. 13, 2010
7745919 Semiconductor device including a plurality of semiconductor chips and a plurality of through-line groups Jun. 29, 2010
7737542 Stackable semiconductor package Jun. 15, 2010
7732929 Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same Jun. 8, 2010
7732912 Semiconductor chip packages and assemblies with chip carrier units Jun. 8, 2010
7732906 Semiconductor device Jun. 8, 2010
7718472 Integrated circuit package-on-package stacking system and method of manufacture thereof May. 18, 2010
7714447 Semiconductor chip arrangement May. 11, 2010
7714446 Single mask via method and device May. 11, 2010
7704794 Method of forming a semiconductor device Apr. 27, 2010
7701045 Point-to-point connection topology for stacked devices Apr. 20, 2010
7700409 Method and system for stacking integrated circuits Apr. 20, 2010
7696616 Stacked type semiconductor device and method of fabricating stacked type semiconductor device Apr. 13, 2010
7696015 Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips Apr. 13, 2010
7687897 Mountable integrated circuit package-in-package system with adhesive spacing structures Mar. 30, 2010
7687315 Stacked integrated circuit package system and method of manufacture therefor Mar. 30, 2010
7683404 Stacked memory and method for forming the same Mar. 23, 2010
7679176 Semiconductor device and electronic control unit using the same Mar. 16, 2010
7675181 Planar multi semiconductor chip package and method of manufacturing the same Mar. 9, 2010
7675180 Stacked electronic component package having film-on-wire spacer Mar. 9, 2010
7675155 Carrier structure stacking system and method Mar. 9, 2010
7675153 Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof Mar. 9, 2010
7675151 Silicon-based packaging for electronic devices Mar. 9, 2010
7674640 Stacked die package system Mar. 9, 2010
7671459 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Mar. 2, 2010
7667299 Circuit board and method for mounting chip component Feb. 23, 2010
7663245 Interposer and stacked chip package Feb. 16, 2010
7663221 Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same Feb. 16, 2010
7662666 Method of processing wafer Feb. 16, 2010
7642636 Stack package of ball grid array type Jan. 5, 2010
7642633 Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner Jan. 5, 2010
7638866 Stacked packaging designs offering inherent anti-tamper protection Dec. 29, 2009
7633151 Integrated circuit package lid with a wetting film Dec. 15, 2009
7632709 Method of manufacturing wafer level package Dec. 15, 2009
7632708 Microelectronic component with photo-imageable substrate Dec. 15, 2009
7626253 Computing device including a stacked semiconductor device Dec. 1, 2009
7626252 Multi-chip electronic package and cooling system Dec. 1, 2009
7615480 Methods of post-contact back end of the line through-hole via integration Nov. 10, 2009
7615411 Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof Nov. 10, 2009
7612444 Semiconductor package with flow controller Nov. 3, 2009
7611925 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument Nov. 3, 2009
7608924 Liquid cooled power electronic circuit comprising stacked direct die cooled packages Oct. 27, 2009
7608921 Multi-layer semiconductor package Oct. 27, 2009
7608481 Method for producing semiconductor package Oct. 27, 2009
7608477 Process for substrate incorporating component Oct. 27, 2009
7598617 Stack package utilizing through vias and re-distribution lines Oct. 6, 2009
7595551 Semiconductor package for a large die Sep. 29, 2009

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