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Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.

Patents under this class:

Patent Number Title Of Patent Date Issued
8227905 Stackable semiconductor package Jul. 24, 2012
8227296 Stacked semiconductor device Jul. 24, 2012
8217519 Electrical connection for multichip modules Jul. 10, 2012
8212364 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance Jul. 3, 2012
8198726 Through-hole electrode substrate and method of manufacturing the same Jun. 12, 2012
8198720 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods Jun. 12, 2012
8198131 Stackable semiconductor device packages Jun. 12, 2012
8183678 Semiconductor device having an interposer May. 22, 2012
8178982 Dual molded multi-chip package system May. 15, 2012
8178978 Support mounted electrically interconnected die assembly May. 15, 2012
8174108 Method for facilitating the stacking of integrated circuits having different areas and an integrated circuit package constructed by the method May. 8, 2012
8174104 Semiconductor arrangement having specially fashioned bond wires May. 8, 2012
8169065 Stackable circuit structures and methods of fabrication thereof May. 1, 2012
8169058 Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars May. 1, 2012
8164171 System-in packages Apr. 24, 2012
8159065 Semiconductor package having an internal cooling system Apr. 17, 2012
8148826 Three-dimensional integrated circuits with protection layers Apr. 3, 2012
8148813 Integrated circuit package architecture Apr. 3, 2012
8148806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions Apr. 3, 2012
8138611 Semiconductor device having shifted stacked chips Mar. 20, 2012
8138019 Integrated (multilayer) circuits and process of producing the same Mar. 20, 2012
8129831 Chip arrangement and method for producing a chip arrangement Mar. 6, 2012
8120186 Integrated circuit and method Feb. 21, 2012
8120068 Three-dimensional memory structures having shared pillar memory cells Feb. 21, 2012
8110930 Die backside metallization and surface activated bonding for stacked die packages Feb. 7, 2012
8110920 In-package microelectronic apparatus, and methods of using same Feb. 7, 2012
8110909 Semiconductor package including top-surface terminals for mounting another semiconductor package Feb. 7, 2012
8110440 Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure Feb. 7, 2012
8102032 System and method for compartmental shielding of stacked packages Jan. 24, 2012
8097954 Adhesive layer forming a capacitor dielectric between semiconductor chips Jan. 17, 2012
8097940 Stack package Jan. 17, 2012
8093726 Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same Jan. 10, 2012
8093718 Chip structure and stacked structure of chips Jan. 10, 2012
8080873 Semiconductor device, semiconductor package, and method for testing semiconductor device Dec. 20, 2011
8076764 Stacked type semiconductor memory device and chip selection circuit Dec. 13, 2011
8076763 Electrical shielding in stacked dies by using conductive die attach adhesive Dec. 13, 2011
8072057 Semiconductor device and method of fabrication Dec. 6, 2011
8072055 High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies Dec. 6, 2011
8067829 System and method for multi-chip module die extraction and replacement Nov. 29, 2011
8067827 Stacked microelectronic device assemblies Nov. 29, 2011
8063493 Semiconductor device assemblies and packages Nov. 22, 2011
8049322 Integrated circuit package-in-package system and method for making thereof Nov. 1, 2011
8044497 Stacked die package Oct. 25, 2011
8039969 Semiconductor device Oct. 18, 2011
8039943 Semiconductor device and manufacturing method therefor Oct. 18, 2011
8039928 Chip stack package Oct. 18, 2011
8030748 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Oct. 4, 2011
8026586 Semiconductor package Sep. 27, 2011
8026583 Flip-chip module and method for the production thereof Sep. 27, 2011
8026582 Integrated circuit package system with internal stacking module adhesive Sep. 27, 2011

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