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Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6580031 Method for making a flexible circuit interposer having high-aspect ratio conductors Jun. 17, 2003
6580092 Semiconductor chip, semiconductor device, and process for producing a semiconductor device Jun. 17, 2003
6580618 Low-profile multi-chip module Jun. 17, 2003
6576992 Chip scale stacking system and method Jun. 10, 2003
6576997 Semiconductor device and method for fabricating the same Jun. 10, 2003
6576998 Thin semiconductor package with semiconductor chip and electronic discrete device Jun. 10, 2003
6577013 Chip size semiconductor packages with stacked dies Jun. 10, 2003
6573608 Semiconductor device with layered semiconductor chips Jun. 3, 2003
6569709 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods May. 27, 2003
6569754 Method for making a module including a microplatform May. 27, 2003
6569762 Three dimensional IC package module May. 27, 2003
6570249 Semiconductor package May. 27, 2003
6570271 Apparatus for routing signals May. 27, 2003
6566232 Method of fabricating semiconductor device May. 20, 2003
6566746 Panel stacking of BGA devices to form three-dimensional modules May. 20, 2003
6564454 Method of making and stacking a semiconductor package May. 20, 2003
6563196 Semiconductor wafer, semiconductor device and manufacturing method therefor May. 13, 2003
6563205 Angularly offset and recessed stacked die multichip device and method of manufacture May. 13, 2003
6563206 Semiconductor device and semiconductor device structure May. 13, 2003
6558966 Apparatus and methods of packaging and testing die May. 6, 2003
6558977 Semiconductor device and method for fabricating the same May. 6, 2003
6559528 Semiconductor device and method for the fabrication thereof May. 6, 2003
6559539 Stacked package structure of image sensor May. 6, 2003
6560117 Packaged microelectronic die assemblies and methods of manufacture May. 6, 2003
6553658 Assembling a stacked die package Apr. 29, 2003
6555917 Semiconductor package having stacked semiconductor chips and method of making the same Apr. 29, 2003
6552416 Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring Apr. 22, 2003
6552419 Semiconductor device and liquid crystal module using the same Apr. 22, 2003
6552910 Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture Apr. 22, 2003
6548326 Semiconductor device and process of producing same Apr. 15, 2003
6548376 Methods of thinning microelectronic workpieces Apr. 15, 2003
6548391 Method of vertically integrating electric components by means of back contacting Apr. 15, 2003
6544815 Panel stacking of BGA devices to form three-dimensional modules Apr. 8, 2003
6544866 Semiconductor device fabricated on multiple substrate Apr. 8, 2003
6545365 Resin-sealed chip stack type semiconductor device Apr. 8, 2003
6545366 Multiple chip package semiconductor device Apr. 8, 2003
6545367 Semiconductor package substrate, semiconductor package Apr. 8, 2003
6541861 Semiconductor device manufacturing method including forming step of SOI structure and semiconductor device having SOI structure Apr. 1, 2003
6541869 Scalable data processing apparatus Apr. 1, 2003
6541870 Semiconductor package with stacked chips Apr. 1, 2003
6538332 Semiconductor device and method of production of same Mar. 25, 2003
6538333 Three dimensional IC package module Mar. 25, 2003
6534874 Semiconductor device and method of producing the same Mar. 18, 2003
6531337 Method of manufacturing a semiconductor structure having stacked semiconductor devices Mar. 11, 2003
6531338 Method of manufacturing a semiconductor structure having stacked semiconductor devices Mar. 11, 2003
6531784 Semiconductor package with spacer strips Mar. 11, 2003
6528348 Semiconductor device having protruding electrodes higher than a sealed portion Mar. 4, 2003
6528353 Chip stack-type semiconductor package and method for fabricating the same Mar. 4, 2003
6528870 Semiconductor device having a plurality of stacked wiring boards Mar. 4, 2003
6525415 Three-dimensional semiconductor integrated circuit apparatus and manufacturing method therefor Feb. 25, 2003

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