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Browse by Category: Main > Physics
Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6782610 Method for fabricating a wiring substrate by electroplating a wiring film on a metal base Aug. 31, 2004
6784019 Intercrossedly-stacked dual-chip semiconductor package and method of fabricating the same Aug. 31, 2004
6784023 Method of fabrication of stacked semiconductor devices Aug. 31, 2004
6784087 Method of fabricating cylindrical bonding structure Aug. 31, 2004
6784530 Circuit component built-in module with embedded semiconductor chip and method of manufacturing Aug. 31, 2004
6784555 Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes Aug. 31, 2004
6780672 Micro eletro-mechanical component and system architecture Aug. 24, 2004
6780770 Method for stacking semiconductor die within an implanted medical device Aug. 24, 2004
6781240 Semiconductor package with semiconductor chips stacked therein and method of making the package Aug. 24, 2004
6781241 Semiconductor device and manufacturing method thereof Aug. 24, 2004
6781243 Leadless leadframe package substitute and stack package Aug. 24, 2004
6781245 Array structure of solder balls able to control collapse Aug. 24, 2004
6781247 Semiconductor device Aug. 24, 2004
6781849 Multi-chip package having improved heat spread characteristics and method for manufacturing the same Aug. 24, 2004
6777261 Method and apparatus for a semiconductor package for vertical surface mounting Aug. 17, 2004
6777648 Method and system to manufacture stacked chip devices Aug. 17, 2004
6777796 Stacked semiconductor chips on a wiring board Aug. 17, 2004
6777797 Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding Aug. 17, 2004
6777799 Stacked semiconductor device and method of producing the same Aug. 17, 2004
6774471 Protected bond fingers Aug. 10, 2004
6774477 Structure and method of stacking multiple semiconductor substrates of a composite semiconductor device Aug. 10, 2004
6774478 Stacked semiconductor package Aug. 10, 2004
6774494 Semiconductor device and manufacturing method thereof Aug. 10, 2004
6774499 Non-leaded semiconductor package and method of fabricating the same Aug. 10, 2004
6775153 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument Aug. 10, 2004
6770511 Semiconductor device, and its manufacturing method, circuit substrate, and electronic apparatus Aug. 3, 2004
6768190 Stack type flip-chip package Jul. 27, 2004
6768195 Multi-chip semiconductor device Jul. 27, 2004
6768207 Multichip wafer-level package and method for manufacturing the same Jul. 27, 2004
6768208 Multiple chips bonded to packaging structure with low noise and multiple selectable functions Jul. 27, 2004
6765287 Three-dimensional stacked semiconductor package Jul. 20, 2004
6765288 Microelectronic adaptors, assemblies and methods Jul. 20, 2004
6765299 Semiconductor device and the method for manufacturing the same Jul. 20, 2004
6762076 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices Jul. 13, 2004
6762487 Stack arrangements of chips and interconnecting members Jul. 13, 2004
6759745 Semiconductor device and manufacturing method thereof Jul. 6, 2004
6756288 Method of subdividing a wafer Jun. 29, 2004
6756305 Stacked dice bonded with aluminum posts Jun. 29, 2004
6756681 Radio frequency integrated circuit having increased substrate resistance enabling three dimensional interconnection with feedthroughs Jun. 29, 2004
6756684 Flip-chip ball grid array semiconductor package with heat-dissipating device and method for fabricating the same Jun. 29, 2004
6753205 Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavity Jun. 22, 2004
6753613 Stacked dice standoffs Jun. 22, 2004
6753726 Apparatus and method for an offset-correcting sense amplifier Jun. 22, 2004
6750516 Systems and methods for electrically isolating portions of wafers Jun. 15, 2004
6750545 Semiconductor package capable of die stacking Jun. 15, 2004
6750547 Multi-substrate microelectronic packages and methods for manufacture Jun. 15, 2004
6746911 Semiconductor device with stacked memory and logic substrates and method for fabricating the same Jun. 8, 2004
6747347 Multi-chip electronic package and cooling system Jun. 8, 2004
6747348 Apparatus and method for leadless packaging of semiconductor devices Jun. 8, 2004
6743664 Flip-chip on flex for high performance packaging applications Jun. 1, 2004

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