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Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6867066 Method for production of a semiconductor device with package that includes an insulator frame on a metal member Mar. 15, 2005
6867073 Single mask via method and device Mar. 15, 2005
6867486 Stack chip module with electrical connection and adhesion of chips through a bump for improved heat release capacity Mar. 15, 2005
6867500 Multi-chip module and methods Mar. 15, 2005
6864166 Method of manufacturing wire bonded microelectronic device assemblies Mar. 8, 2005
6864172 Manufacturing method of semiconductor device Mar. 8, 2005
6864509 Packaging optically coupled integrated circuits using flip-chip methods Mar. 8, 2005
6865084 Thermally enhanced semiconductor package with EMI shielding Mar. 8, 2005
6861283 Package for integrated circuit with thermal vias and method thereof Mar. 1, 2005
6861288 Stacked semiconductor packages and method for the fabrication thereof Mar. 1, 2005
6861366 Packaged semiconductor device having stacked die Mar. 1, 2005
6861738 Laminated-chip semiconductor device Mar. 1, 2005
6861761 Multi-chip stack flip-chip package Mar. 1, 2005
6857470 Stacked chip package with heat transfer wires Feb. 22, 2005
6858920 Semiconductor device with stacked semiconductor elements Feb. 22, 2005
6858932 Packaged semiconductor device and method of formation Feb. 22, 2005
6858938 Semiconductor device Feb. 22, 2005
6858941 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array Feb. 22, 2005
6856007 High-frequency chip packages Feb. 15, 2005
6856010 Thin scale outline package Feb. 15, 2005
6856026 Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device Feb. 15, 2005
6856027 Multi-chips stacked package Feb. 15, 2005
6852621 Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment Feb. 8, 2005
6853085 Method and device for securing a multi-dimensionally constructed chip stack and chip configuration Feb. 8, 2005
6849802 Semiconductor chip, chip stack package and manufacturing method Feb. 1, 2005
6849932 Double-sided thermally enhanced IC chip package Feb. 1, 2005
6849940 Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same Feb. 1, 2005
6849951 Bypass capacitor solution for integrated circuit dice Feb. 1, 2005
6848177 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme Feb. 1, 2005
6847105 Bumping technology in stacked die configurations Jan. 25, 2005
6844217 Die support structure Jan. 18, 2005
6844619 Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same Jan. 18, 2005
6845027 Semiconductor chip Jan. 18, 2005
6841418 Multi-substrate microelectronic packages and methods for manufacture Jan. 11, 2005
6841469 Semiconductor device and method of manufacturing the same Jan. 11, 2005
6841849 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument Jan. 11, 2005
6841883 Multi-dice chip scale semiconductor components and wafer level methods of fabrication Jan. 11, 2005
6841884 Semiconductor device Jan. 11, 2005
6836961 Ceramic packaging method employing flip-chip bonding Jan. 4, 2005
6838310 Integrated circuit with improved interconnect structure and process for making same Jan. 4, 2005
6838761 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield Jan. 4, 2005
6838762 Water-level package with bump ring Jan. 4, 2005
6838774 Interlocking conductor method for bonding wafers to produce stacked integrated circuits Jan. 4, 2005
6836002 Semiconductor device Dec. 28, 2004
6836025 Semiconductor device configured to be surface mountable Dec. 28, 2004
6833287 System for semiconductor package with stacked dies Dec. 21, 2004
6833984 Semiconductor module with serial bus connection to multiple dies Dec. 21, 2004
6831000 Semiconductor device manufacturing method Dec. 14, 2004
6831132 Film adhesives containing maleimide compounds and methods for use thereof Dec. 14, 2004
6831367 Semiconductor device and method of manufacturing the same Dec. 14, 2004

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