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Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6917219 Multi-chip programmable logic device having configurable logic circuitry and configuration data storage on different dice Jul. 12, 2005
6914324 Memory expansion and chip scale stacking system and method Jul. 5, 2005
6910268 Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via Jun. 28, 2005
6911721 Semiconductor device, method for manufacturing semiconductor device and electronic equipment Jun. 28, 2005
6911723 Multiple die stack apparatus employing T-shaped interposer elements Jun. 28, 2005
6908565 Etch thinning techniques for wafer-to-wafer vertical stacks Jun. 21, 2005
6908792 Chip stack with differing chip package types Jun. 21, 2005
6909172 Semiconductor device with conduction test terminals Jun. 21, 2005
6905911 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal Jun. 14, 2005
6905912 Semiconductor device and method for fabricating the same Jun. 14, 2005
6906407 Field programmable gate array assembly Jun. 14, 2005
6902953 Methods of forming semiconductor stacked die devices Jun. 7, 2005
6903442 Semiconductor component having backside pin contacts Jun. 7, 2005
6903455 Side braze packages Jun. 7, 2005
6903465 Method and apparatus for a semiconductor package for vertical surface mounting Jun. 7, 2005
6900528 Stacked mass storage flash memory package May. 31, 2005
6900549 Semiconductor assembly without adhesive fillets May. 31, 2005
6900551 Semiconductor device with alternate bonding wire arrangement May. 31, 2005
6897088 Method for connecting circuit devices May. 24, 2005
6897091 Semiconductor device and manufacturing method thereof May. 24, 2005
6897096 Method of packaging semiconductor dice employing at least one redistribution layer May. 24, 2005
6897125 Methods of forming backside connections on a wafer stack May. 24, 2005
6893897 Stacked package for integrated circuits May. 17, 2005
6894378 Electronic component with stacked semiconductor chips May. 17, 2005
6894380 Packaged stacked semiconductor die and method of preparing same May. 17, 2005
6894381 Electronic device having a stack of semiconductor chips and method for the production thereof May. 17, 2005
6894392 Scaleable integrated data processing device May. 17, 2005
6894395 System on a chip device including a re-wiring layer formed between groups of electronic devices May. 17, 2005
6890798 Stacked chip packaging May. 10, 2005
6891273 Semiconductor package and fabrication method thereof May. 10, 2005
6887753 Methods of forming semiconductor circuitry, and semiconductor circuit constructions May. 3, 2005
6888227 Apparatus for routing signals May. 3, 2005
6884653 Folded interposer Apr. 26, 2005
6884657 Angularly offset stacked die multichip device and method of manufacture Apr. 26, 2005
6884658 Die stacking scheme Apr. 26, 2005
6885093 Stacked die semiconductor device Apr. 26, 2005
6885106 Stacked microelectronic assemblies and methods of making same Apr. 26, 2005
6881611 Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device Apr. 19, 2005
6882030 Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate Apr. 19, 2005
6882056 Multi-chip package type semiconductor device Apr. 19, 2005
6878571 Panel stacking of BGA devices to form three-dimensional modules Apr. 12, 2005
6879031 Multi-chips package Apr. 12, 2005
6876088 Flex-based IC package construction employing a balanced lamination Apr. 5, 2005
6872594 Method of fabricating an electronic component Mar. 29, 2005
6873036 Die stacking scheme Mar. 29, 2005
6873037 Vertical surface mount package utilizing a back-to-back semiconductor device module Mar. 29, 2005
6869827 Semiconductor/printed circuit board assembly, and computer system Mar. 22, 2005
6869828 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods Mar. 22, 2005
6870249 Semiconductor device and manufacturing method thereof Mar. 22, 2005
6870269 Assemblies including stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween, packages including the assemblies, and methods Mar. 22, 2005

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