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Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.










Patents under this class:
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Patent Number Title Of Patent Date Issued
6967411 Stackable layers containing ball grid array packages Nov. 22, 2005
6964896 Methods of forming semiconductor logic circuitry, and semiconductor logic circuit constructions Nov. 15, 2005
6965160 Semiconductor dice packages employing at least one redistribution layer Nov. 15, 2005
6965163 Substrate-less microelectronic package Nov. 15, 2005
6965166 Semiconductor device of chip-on-chip structure Nov. 15, 2005
6962865 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument Nov. 8, 2005
6962867 Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof Nov. 8, 2005
6960827 Semiconductor device and manufacturing method thereof Nov. 1, 2005
6958259 Method of stacking semiconductor element in a semiconductor device Oct. 25, 2005
6958532 Semiconductor storage device Oct. 25, 2005
6958544 Semiconductor device and method of manufacturing the same Oct. 25, 2005
6956741 Semiconductor package with heat sink Oct. 18, 2005
6953748 Method of manufacturing semiconductor device Oct. 11, 2005
6953991 Semiconductor device Oct. 11, 2005
6953994 Wireless coupling of staked dies within system in package Oct. 11, 2005
6951774 Semiconductor device and method of manufacturing the same Oct. 4, 2005
6952047 Assemblies having stacked semiconductor chips and methods of making same Oct. 4, 2005
6949834 Stacked semiconductor package with circuit side polymer layer Sep. 27, 2005
6949835 Semiconductor device Sep. 27, 2005
6946323 Semiconductor package having one or more die stacked on a prepackaged device and method therefor Sep. 20, 2005
6946328 Method for manufacturing semiconductor devices Sep. 20, 2005
6946384 Stacked device underfill and a method of fabrication Sep. 20, 2005
6943067 Three-dimensional integrated semiconductor devices Sep. 13, 2005
6943430 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same Sep. 13, 2005
6943438 Memory card having a control chip Sep. 13, 2005
6943442 Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film Sep. 13, 2005
6940729 Integrated circuit stacking system and method Sep. 6, 2005
6936532 Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another Aug. 30, 2005
6936913 High performance vias for vertical IC packaging Aug. 30, 2005
6937477 Structure of gold fingers Aug. 30, 2005
6933597 Spacer with passive components for use in multi-chip modules Aug. 23, 2005
6933605 Semiconductor package Aug. 23, 2005
6930378 Stacked semiconductor die assembly having at least one support Aug. 16, 2005
6930382 Semiconductor device and method of manufacturing the same Aug. 16, 2005
6930396 Semiconductor device and method for manufacturing the same Aug. 16, 2005
6927431 Semiconductor circuit constructions Aug. 9, 2005
6927484 Stack arrangement of a memory module Aug. 9, 2005
6924173 Semiconductor device and method for the fabrication thereof Aug. 2, 2005
6924551 Through silicon via, folded flex microelectronic package Aug. 2, 2005
6921016 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment Jul. 26, 2005
6921018 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array Jul. 26, 2005
6921968 Stacked flip chip package Jul. 26, 2005
6921980 Integrated semiconductor circuit including electronic component connected between different component connection portions Jul. 26, 2005
6919220 Method of making chip package with grease heat sink Jul. 19, 2005
6919627 Multichip module Jul. 19, 2005
6919628 Stack chip package structure Jul. 19, 2005
6919631 Structures for improving heat dissipation in stacked semiconductor packages Jul. 19, 2005
6916682 Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testing Jul. 12, 2005
6916686 Method of manufacturing a semiconductor device Jul. 12, 2005
6916725 Method for manufacturing semiconductor device, and method for manufacturing semiconductor module Jul. 12, 2005

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