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Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7017638 Forming folded-stack packaged device using vertical progression folding tool Mar. 28, 2006
7018866 Circuit component built-in module with embedded semiconductor chip and method of manufacturing Mar. 28, 2006
7019397 Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device Mar. 28, 2006
7015063 Methods of utilizing a back to back semiconductor device module Mar. 21, 2006
7015572 Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system Mar. 21, 2006
7015586 Stacked structure of integrated circuits Mar. 21, 2006
7012323 Microelectronic assemblies incorporating inductors Mar. 14, 2006
7008823 Die stacking scheme Mar. 7, 2006
7009300 Low profile stacked multi-chip package and method of forming same Mar. 7, 2006
7005316 Method for package reduction in stacked chip and board assemblies Feb. 28, 2006
7005324 Method of fabricating stacked semiconductor chips Feb. 28, 2006
7005325 Semiconductor package with passive device integration Feb. 28, 2006
7005729 Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame Feb. 28, 2006
7005730 Memory module having interconnected and stacked integrated circuits Feb. 28, 2006
7005748 Flip chip interface circuit of a semiconductor memory device Feb. 28, 2006
7002251 Semiconductor device Feb. 21, 2006
7002254 Integrated circuit package employing flip-chip technology and method of assembly Feb. 21, 2006
7002255 Multi-chips stacked package Feb. 21, 2006
6998703 Thin package for stacking integrated circuits Feb. 14, 2006
6998717 Multi-dice chip scale semiconductor components Feb. 14, 2006
6995041 Semiconductor package with circuit side polymer layer and wafer level fabrication method Feb. 7, 2006
6995455 Semiconductor device Feb. 7, 2006
6995473 Stacked semiconductor transistors Feb. 7, 2006
6991964 Stacked type semiconductor device Jan. 31, 2006
6992396 Semiconductor device and method for fabricating the same Jan. 31, 2006
6992871 Microtransformer for system-on-chip power supply Jan. 31, 2006
6992940 Semiconductor memory apparatus with variable contact connections, and a corresponding semiconductor apparatus Jan. 31, 2006
6989285 Method of fabrication of stacked semiconductor devices Jan. 24, 2006
6987325 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element Jan. 17, 2006
6984873 Method of forming a stacked device filler Jan. 10, 2006
6984881 Stackable integrated circuit package and method therefor Jan. 10, 2006
6984885 Semiconductor device having densely stacked semiconductor chips Jan. 10, 2006
6982478 Semiconductor device and method of fabricating the same Jan. 3, 2006
6982487 Wafer level package and multi-package stack Jan. 3, 2006
6982488 Semiconductor package and method for fabricating the same Jan. 3, 2006
6982489 Semiconductor device having a plurality of laminated semiconductor elements with water absorbing resin films interposed therebetween Jan. 3, 2006
6982869 Folded interposer Jan. 3, 2006
6979591 Connection of integrated circuits Dec. 27, 2005
6979644 Method of manufacturing electronic circuit component Dec. 27, 2005
6979905 Semiconductor device Dec. 27, 2005
6977190 Semiconductor device and method for production thereof Dec. 20, 2005
6977439 Semiconductor chip stack structure Dec. 20, 2005
6975016 Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof Dec. 13, 2005
6975025 Semiconductor chip package and method of manufacturing same Dec. 13, 2005
6975027 Multi-chip electronic package and cooling system Dec. 13, 2005
6975038 Chip scale pin array Dec. 13, 2005
6972481 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages Dec. 6, 2005
6972487 Multi chip package structure having a plurality of semiconductor chips mounted in the same package Dec. 6, 2005
6969667 Electrical device and method of making Nov. 29, 2005
6969914 Electronic device package Nov. 29, 2005

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