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Browse by Category: Main > Physics
Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.










Patents under this class:
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Patent Number Title Of Patent Date Issued
7064055 Method of forming a multi-layer semiconductor structure having a seamless bonding interface Jun. 20, 2006
7064425 Semiconductor device circuit board, and electronic equipment Jun. 20, 2006
7064426 Semiconductor multi-package module having wire bond interconnect between stacked packages Jun. 20, 2006
7064443 Semiconductor device having a plurality of stacked semiconductor chips with positions of chip-selecting terminals being different from each other Jun. 20, 2006
7064444 Multi-chip ball grid array package Jun. 20, 2006
7060526 Wafer level methods for fabricating multi-dice chip scale semiconductor components Jun. 13, 2006
7061089 Memory module having space-saving arrangement of memory chips and memory chip therefore Jun. 13, 2006
7061103 Chip package structure Jun. 13, 2006
7061107 Semiconductor device and manufacturing method of the same Jun. 13, 2006
7061118 Semiconductor device, stacked semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument Jun. 13, 2006
7061785 Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package Jun. 13, 2006
7056801 Radio frequency integrated circuit, and method for manufacturing the same Jun. 6, 2006
7056810 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance Jun. 6, 2006
7056813 Methods of forming backside connections on a wafer stack Jun. 6, 2006
7057270 Systems and methods for stacking chip components Jun. 6, 2006
7057277 Chip package structure Jun. 6, 2006
7057290 Electronic parts packaging structure and method of manufacturing the same Jun. 6, 2006
7057291 Methods for securing vertically mountable semiconductor devices in back-to back relation Jun. 6, 2006
7053476 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages May. 30, 2006
7047634 Method of making a multilayer wiring board May. 23, 2006
7049217 Method of forming multi-piled bump May. 23, 2006
7049528 Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module May. 23, 2006
7049692 Stacked semiconductor device May. 23, 2006
7050303 Semiconductor module with vertically mounted semiconductor chip packages May. 23, 2006
7045390 Stacked die package May. 16, 2006
7045443 Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus May. 16, 2006
7045892 Stack package of semiconductor device May. 16, 2006
7045899 Semiconductor device and fabrication method of the same May. 16, 2006
7045901 Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board May. 16, 2006
7042078 Semiconductor package May. 9, 2006
7042104 Semiconductor package using flexible film and method of manufacturing the same May. 9, 2006
7042105 Methods for dicing wafer stacks to provide access to interior structures May. 9, 2006
7037752 Semiconductor device and manufacturing method thereof May. 2, 2006
7037756 Stacked microelectronic devices and methods of fabricating same May. 2, 2006
7037757 Stacked semiconductor module May. 2, 2006
7037760 Fabrication method of semiconductor integrated circuit device May. 2, 2006
7037800 Radio frequency semiconductor device and method of manufacturing the same May. 2, 2006
7037804 Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration May. 2, 2006
7033860 Process for manufacturing semiconductor device Apr. 25, 2006
7033911 Adhesive of folded package Apr. 25, 2006
7033935 Semiconductor device and method for manufacturing the same Apr. 25, 2006
7034386 Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same Apr. 25, 2006
7034388 Stack type flip-chip package Apr. 25, 2006
7029931 Stacked die module and techniques for forming a stacked die module Apr. 18, 2006
7029937 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument Apr. 18, 2006
7030489 Multi-chip module having bonding wires and method of fabricating the same Apr. 18, 2006
7026719 Semiconductor package with a heat spreader Apr. 11, 2006
7021520 Stacked chip connection using stand off stitch bonding Apr. 4, 2006
7023079 Stacked semiconductor chip package Apr. 4, 2006
7023096 Multi-chip package having spacer that is inserted between chips and manufacturing method thereof Apr. 4, 2006

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