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Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615480 |
Methods of post-contact back end of the line through-hole via integration |
Nov. 10, 2009 |
| 7615411 |
Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof |
Nov. 10, 2009 |
| 7612444 |
Semiconductor package with flow controller |
Nov. 3, 2009 |
| 7611925 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Nov. 3, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7608921 |
Multi-layer semiconductor package |
Oct. 27, 2009 |
| 7608481 |
Method for producing semiconductor package |
Oct. 27, 2009 |
| 7608477 |
Process for substrate incorporating component |
Oct. 27, 2009 |
| 7598617 |
Stack package utilizing through vias and re-distribution lines |
Oct. 6, 2009 |
| 7595551 |
Semiconductor package for a large die |
Sep. 29, 2009 |
| 7592707 |
Method and apparatus for facilitating proximity communication and power delivery |
Sep. 22, 2009 |
| 7592691 |
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies |
Sep. 22, 2009 |
| 7582960 |
Multiple chip package module including die stacked over encapsulated package |
Sep. 1, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7573128 |
Semiconductor module in which a semiconductor package is bonded on a mount substrate |
Aug. 11, 2009 |
| 7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same |
Aug. 4, 2009 |
| 7560806 |
Memory card |
Jul. 14, 2009 |
| 7557438 |
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same |
Jul. 7, 2009 |
| 7554185 |
Flip chip and wire bond semiconductor package |
Jun. 30, 2009 |
| 7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof |
Jun. 23, 2009 |
| 7550832 |
Stackable semiconductor package |
Jun. 23, 2009 |
| 7547977 |
Semiconductor chip having bond pads |
Jun. 16, 2009 |
| 7547965 |
Package and package module of the package |
Jun. 16, 2009 |
| 7545049 |
Electronic parts packaging structure |
Jun. 9, 2009 |
| 7545029 |
Stack microelectronic assemblies |
Jun. 9, 2009 |
| 7544542 |
Reduction of damage to thermal interface material due to asymmetrical load |
Jun. 9, 2009 |
| 7541682 |
Semiconductor chip having bond pads |
Jun. 2, 2009 |
| 7541680 |
Semiconductor device package |
Jun. 2, 2009 |
| 7538413 |
Semiconductor components having through interconnects |
May. 26, 2009 |
| 7535086 |
Integrated circuit package-on-package stacking system |
May. 19, 2009 |
| 7531906 |
Flip chip packaging using recessed interposer terminals |
May. 12, 2009 |
| 7528494 |
Accessible chip stack and process of manufacturing thereof |
May. 5, 2009 |
| 7528491 |
Semiconductor components and assemblies including vias of varying lateral dimensions |
May. 5, 2009 |
| 7528476 |
Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument |
May. 5, 2009 |
| 7521810 |
Chip stack package and manufacturing method thereof |
Apr. 21, 2009 |
| 7521802 |
Semiconductor device having a refractory metal containing film and method for manufacturing the same |
Apr. 21, 2009 |
| 7521787 |
Semiconductor device |
Apr. 21, 2009 |
| 7521784 |
System for coupling wire to semiconductor region |
Apr. 21, 2009 |
| 7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces |
Apr. 21, 2009 |
| 7518251 |
Stacked electronics for sensors |
Apr. 14, 2009 |
| 7518224 |
Offset integrated circuit package-on-package stacking system |
Apr. 14, 2009 |
| 7518223 |
Semiconductor devices and semiconductor device assemblies including a nonconfluent spacer layer |
Apr. 14, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7508059 |
Stacked chip package with redistribution lines |
Mar. 24, 2009 |
| 7504717 |
Semiconductor device |
Mar. 17, 2009 |
| 7494847 |
Method for making a semiconductor multi-package module having inverted wire bond carrier second package |
Feb. 24, 2009 |
| 7489028 |
Die package |
Feb. 10, 2009 |
| 7468551 |
Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
Dec. 23, 2008 |
| 7466029 |
Chip on chip device including basic chips capable of functioning independently from each other, and a system in package device including the chip on chip device |
Dec. 16, 2008 |
| 7462930 |
Stack chip and stack chip package having the same |
Dec. 9, 2008 |
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