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Class Information
Number: 257/E25.013
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065S.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710677 Multi-chip package with a supporting member and method of manufacturing the same Apr. 29, 2014
8704381 Very extremely thin semiconductor package Apr. 22, 2014
8704380 Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods Apr. 22, 2014
8704354 Package on package structures and methods for forming the same Apr. 22, 2014
8704351 Stacked microelectronic assemblies Apr. 22, 2014
8685793 Chip assembly having via interconnects joined by plating Apr. 1, 2014
8685792 Integrated circuit package system with interposer Apr. 1, 2014
8680686 Method and system for thin multi chip stack package with film on wire and copper wire Mar. 25, 2014
8680667 Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements Mar. 25, 2014
8674482 Semiconductor chip with through-silicon-via and sidewall pad Mar. 18, 2014
8669664 Stacked die package for MEMS resonator system Mar. 11, 2014
8664780 Semiconductor package having plural semiconductor chips and method of forming the same Mar. 4, 2014
8664755 Power module package and method for manufacturing the same Mar. 4, 2014
8664666 Semiconductor device and process for fabricating the same Mar. 4, 2014
8653642 Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems Feb. 18, 2014
8643193 Semiconductor packages and electronic systems including the same Feb. 4, 2014
8637969 Stacked chips in a semiconductor package Jan. 28, 2014
8633584 Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well Jan. 21, 2014
8633578 Integrated circuit package system with laminate base Jan. 21, 2014
8629565 Thin wafer protection device Jan. 14, 2014
8629545 Stub minimization for assemblies without wirebonds to package substrate Jan. 14, 2014
8625297 Package structure with electronic component and method for manufacturing same Jan. 7, 2014
8623751 Through-hole electrode substrate and method of manufacturing the same Jan. 7, 2014
8618672 Three dimensional stacked chip package structure Dec. 31, 2013
8618670 Corrosion control of stacked integrated circuits Dec. 31, 2013
8618648 Methods for flip chip stacking Dec. 31, 2013
8618647 Packaged microelectronic elements having blind vias for heat dissipation Dec. 31, 2013
8618646 Layered chip package and method of manufacturing same Dec. 31, 2013
8610264 Compliant interconnects in wafers Dec. 17, 2013
8604622 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device Dec. 10, 2013
8604593 Reconfiguring through silicon vias in stacked multi-die packages Dec. 10, 2013
8598716 Semiconductor apparatus having stacked semiconductor components Dec. 3, 2013
8598695 Active chip on carrier or laminated chip having microelectronic element embedded therein Dec. 3, 2013
8586983 Semiconductor chip embedded with a test circuit Nov. 19, 2013
8586465 Through silicon via dies and packages Nov. 19, 2013
8575762 Very extremely thin semiconductor package Nov. 5, 2013
8558399 Dual molded multi-chip package system Oct. 15, 2013
8558393 Semiconductor device Oct. 15, 2013
8558369 Integrated circuit packaging system with interconnects and method of manufacture thereof Oct. 15, 2013
8546956 Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding Oct. 1, 2013
8546955 Multi-die stack package Oct. 1, 2013
8546932 Thin substrate PoP structure Oct. 1, 2013
8536712 Memory device and method of manufacturing the same Sep. 17, 2013
8536692 Mountable integrated circuit package system with mountable integrated circuit die Sep. 17, 2013
8531021 Package stack device and fabrication method thereof Sep. 10, 2013
8530276 Method for manufacturing a microelectronic device and a microelectronic device thus manufactured Sep. 10, 2013
8525327 Stub minimization for assemblies without wirebonds to package substrate Sep. 3, 2013
8519523 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Aug. 27, 2013
8513792 Package-on-package interconnect stiffener Aug. 20, 2013
8513034 Method of manufacturing layered chip package Aug. 20, 2013











 
 
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