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Browse by Category: Main > Physics
Class Information
Number: 257/E25.012
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Devices being arranged next to each other (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065N.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8669656 Interconnect having ultra high speed signal transmission/reception Mar. 11, 2014
8546925 Synchronous buck converter having coplanar array of contact bumps of equal volume Oct. 1, 2013
8536713 System in package with heat sink Sep. 17, 2013
8253241 Electronic module Aug. 28, 2012
8247845 Electrostatic discharge (ESD) protection circuit placement in semiconductor devices Aug. 21, 2012
8138593 Packaged microchip with spacer for mitigating electrical leakage between components Mar. 20, 2012
8138600 Semiconductor device and method of manufacturing the same Mar. 20, 2012
8049319 Ultra wideband system-on-package Nov. 1, 2011
8039852 Thin film transistor for a liquid crystal device in which a sealing pattern is electrically connected to a common electrode wiring Oct. 18, 2011
8022499 Semiconductor memory device including cell isolation structure using inactive transistors Sep. 20, 2011
7939923 Memory card and method for manufacturing memory card May. 10, 2011
7911051 Electronic circuit arrangement and method for producing an electronic circuit arrangement Mar. 22, 2011
7892963 Integrated circuit packaging system and method of manufacture thereof Feb. 22, 2011
7851907 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting Dec. 14, 2010
7834452 Device made of single-crystal silicon Nov. 16, 2010
7812444 Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein Oct. 12, 2010
7812445 Semiconductor memory module having an oblique memory chip Oct. 12, 2010
7741151 Integrated circuit package formation Jun. 22, 2010
7714423 Mid-plane arrangement for components in a computer system May. 11, 2010
7692285 Semiconductor device Apr. 6, 2010
7671462 Power semiconductor device Mar. 2, 2010
7579681 Super high density module with integrated wafer level packages Aug. 25, 2009
7576420 Semiconductor integrated circuit device having reduced terminals and I/O area Aug. 18, 2009
7576440 Semiconductor chip having bond pads and multi-chip package Aug. 18, 2009
7569414 CMOS imager with integrated non-volatile memory Aug. 4, 2009
7557437 Fan out type wafer level package structure and method of the same Jul. 7, 2009
7541682 Semiconductor chip having bond pads Jun. 2, 2009
7518229 Versatile Si-based packaging with integrated passive components for mmWave applications Apr. 14, 2009
7514780 Power semiconductor device Apr. 7, 2009
7498674 Semiconductor module having a coupling substrate, and methods for its production Mar. 3, 2009
7485569 Printed circuit board including embedded chips and method of fabricating the same Feb. 3, 2009
7476565 Method for forming filling paste structure of WL package Jan. 13, 2009
7462509 Dual-sided chip attached modules Dec. 9, 2008
7432143 Method for forming gate of semiconductor device Oct. 7, 2008
7400035 Semiconductor device having multilayer printed wiring board Jul. 15, 2008
7388295 Multi-chip module Jun. 17, 2008
7291926 Multi-chip package structure Nov. 6, 2007
7274100 Battery protection circuit with integrated passive components Sep. 25, 2007
7268426 High-frequency chip packages Sep. 11, 2007
7262510 Chip package structure Aug. 28, 2007
7253513 High-frequency switch device and electronic device using the same Aug. 7, 2007
7230332 Chip package with embedded component Jun. 12, 2007
7224053 Semiconductor device responsive to different levels of input and output signals and signal processing system using the same May. 29, 2007
7202108 Semiconductor wafer, semiconductor chip and method for manufacturing the same Apr. 10, 2007
7176560 Semiconductor device having a chip--chip structure Feb. 13, 2007
7129583 Multi-chip package structure Oct. 31, 2006
7095104 Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same Aug. 22, 2006
7064005 Semiconductor apparatus and method of manufacturing same Jun. 20, 2006
7060601 Packaging substrates for integrated circuits and soldering methods Jun. 13, 2006
7057278 Semiconductor device Jun. 6, 2006

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