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Class Information
Number: 257/E25.012
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Devices being arranged next to each other (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065N.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7579681 |
Super high density module with integrated wafer level packages |
Aug. 25, 2009 |
| 7576420 |
Semiconductor integrated circuit device having reduced terminals and I/O area |
Aug. 18, 2009 |
| 7576440 |
Semiconductor chip having bond pads and multi-chip package |
Aug. 18, 2009 |
| 7569414 |
CMOS imager with integrated non-volatile memory |
Aug. 4, 2009 |
| 7557437 |
Fan out type wafer level package structure and method of the same |
Jul. 7, 2009 |
| 7541682 |
Semiconductor chip having bond pads |
Jun. 2, 2009 |
| 7518229 |
Versatile Si-based packaging with integrated passive components for mmWave applications |
Apr. 14, 2009 |
| 7514780 |
Power semiconductor device |
Apr. 7, 2009 |
| 7498674 |
Semiconductor module having a coupling substrate, and methods for its production |
Mar. 3, 2009 |
| 7485569 |
Printed circuit board including embedded chips and method of fabricating the same |
Feb. 3, 2009 |
| 7476565 |
Method for forming filling paste structure of WL package |
Jan. 13, 2009 |
| 7462509 |
Dual-sided chip attached modules |
Dec. 9, 2008 |
| 7432143 |
Method for forming gate of semiconductor device |
Oct. 7, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7388295 |
Multi-chip module |
Jun. 17, 2008 |
| 7291926 |
Multi-chip package structure |
Nov. 6, 2007 |
| 7274100 |
Battery protection circuit with integrated passive components |
Sep. 25, 2007 |
| 7268426 |
High-frequency chip packages |
Sep. 11, 2007 |
| 7262510 |
Chip package structure |
Aug. 28, 2007 |
| 7253513 |
High-frequency switch device and electronic device using the same |
Aug. 7, 2007 |
| 7230332 |
Chip package with embedded component |
Jun. 12, 2007 |
| 7224053 |
Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
May. 29, 2007 |
| 7202108 |
Semiconductor wafer, semiconductor chip and method for manufacturing the same |
Apr. 10, 2007 |
| 7176560 |
Semiconductor device having a chip--chip structure |
Feb. 13, 2007 |
| 7129583 |
Multi-chip package structure |
Oct. 31, 2006 |
| 7095104 |
Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same |
Aug. 22, 2006 |
| 7064005 |
Semiconductor apparatus and method of manufacturing same |
Jun. 20, 2006 |
| 7060601 |
Packaging substrates for integrated circuits and soldering methods |
Jun. 13, 2006 |
| 7057278 |
Semiconductor device |
Jun. 6, 2006 |
| 7053473 |
Compact integrated circuit package |
May. 30, 2006 |
| 7050303 |
Semiconductor module with vertically mounted semiconductor chip packages |
May. 23, 2006 |
| 7050304 |
Heat sink structure with embedded electronic components for semiconductor package |
May. 23, 2006 |
| 7049170 |
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
May. 23, 2006 |
| 7035113 |
Multi-chip electronic package having laminate carrier and method of making same |
Apr. 25, 2006 |
| 7034401 |
Packaging substrates for integrated circuits and soldering methods |
Apr. 25, 2006 |
| 7026188 |
Electronic device and method for manufacturing the same |
Apr. 11, 2006 |
| 7023707 |
Information handling system |
Apr. 4, 2006 |
| 7019404 |
Multilayered circuit substrate, semiconductor device and method of producing same |
Mar. 28, 2006 |
| 7015574 |
Electronic device carrier adapted for transmitting high frequency signals |
Mar. 21, 2006 |
| 6995322 |
High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same |
Feb. 7, 2006 |
| 6995044 |
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board |
Feb. 7, 2006 |
| 6991470 |
Circuit carrier and production thereof |
Jan. 31, 2006 |
| 6992891 |
Metal ball attachment of heat dissipation devices |
Jan. 31, 2006 |
| 6992896 |
Stacked chip electronic package having laminate carrier and method of making same |
Jan. 31, 2006 |
| 6987031 |
Multiple chip semiconductor package and method of fabricating same |
Jan. 17, 2006 |
| 6984889 |
Semiconductor device |
Jan. 10, 2006 |
| 6982489 |
Semiconductor device having a plurality of laminated semiconductor elements with water absorbing resin films interposed therebetween |
Jan. 3, 2006 |
| 6980438 |
Semiconductor package with heat dissipating structure |
Dec. 27, 2005 |
| 6977211 |
Selective consolidation processes for electrically connecting contacts of semiconductor device components |
Dec. 20, 2005 |
| 6967410 |
Electronic device, method of manufacturing the same, and electronic instrument |
Nov. 22, 2005 |
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