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Browse by Category: Main > Physics
Class Information
Number: 257/E25.011
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo) > Devices being arranged next and on each other, i.e., mixed assemblies (epo)
Description: This subclass is indented under subclass E25.01. This subclass is substantially the same in scope as ECLA classification H01L25/065M.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8686570 Multi-dimensional integrated circuit structures and methods of forming the same Apr. 1, 2014
8669656 Interconnect having ultra high speed signal transmission/reception Mar. 11, 2014
8546925 Synchronous buck converter having coplanar array of contact bumps of equal volume Oct. 1, 2013
8436457 Stub minimization for multi-die wirebond assemblies with parallel windows May. 7, 2013
8426979 Composite layered chip package Apr. 23, 2013
8405225 Three-dimensional integrated circuits with protection layers Mar. 26, 2013
8329495 Method of forming photovoltaic modules Dec. 11, 2012
8324725 Stacked die module Dec. 4, 2012
8222723 Electric module having a conductive pattern layer Jul. 17, 2012
8148806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions Apr. 3, 2012
8148826 Three-dimensional integrated circuits with protection layers Apr. 3, 2012
8093715 Enhancement of thermal interface conductivities with carbon nanotube arrays Jan. 10, 2012
8076779 Reduction of macro level stresses in copper/low-K wafers Dec. 13, 2011
8049319 Ultra wideband system-on-package Nov. 1, 2011
8046914 Method for manufacturing multilayer printed circuit board Nov. 1, 2011
8008759 Pre-molded clip structure Aug. 30, 2011
7973401 Stacked chip package with redistribution lines Jul. 5, 2011
7911051 Electronic circuit arrangement and method for producing an electronic circuit arrangement Mar. 22, 2011
7898067 Pre-molded, clip-bonded multi-die semiconductor package Mar. 1, 2011
7892963 Integrated circuit packaging system and method of manufacture thereof Feb. 22, 2011
7796399 Thin multi-chip flex module Sep. 14, 2010
7786596 Hermetic seal and reliable bonding structures for 3D applications Aug. 31, 2010
7741151 Integrated circuit package formation Jun. 22, 2010
7714429 Wafer structure with a plurality of functional macro chips for chip-on-chip configuration May. 11, 2010
7663215 Electronic module with a conductive-pattern layer and a method of manufacturing same Feb. 16, 2010
7642105 Manufacturing method for partially-good memory modules with defect table in EEPROM Jan. 5, 2010
7576420 Semiconductor integrated circuit device having reduced terminals and I/O area Aug. 18, 2009
7566575 Mounting circuit and method for producing semiconductor-chip-mounting circuit Jul. 28, 2009
7544994 Semiconductor structure with multiple fins having different channel region heights and method of forming the semiconductor structure Jun. 9, 2009
7518227 Multiple die stack apparatus employing T-shaped interposer elements Apr. 14, 2009
7518229 Versatile Si-based packaging with integrated passive components for mmWave applications Apr. 14, 2009
7514796 Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips Apr. 7, 2009
7468551 Multiple chips bonded to packaging structure with low noise and multiple selectable functions Dec. 23, 2008
7453146 High power MCM package with improved planarity and heat dissipation Nov. 18, 2008
7436055 Packaging method of a plurality of chips stacked on each other and package structure thereof Oct. 14, 2008
7432585 Semiconductor device electronic component, circuit board, and electronic device Oct. 7, 2008
7375421 High density multilayer circuit module May. 20, 2008
7355272 Semiconductor device with stacked semiconductor chips of the same type Apr. 8, 2008
7341890 Circuit board with built-in electronic component and method for manufacturing the same Mar. 11, 2008
7332808 Semiconductor module and method of manufacturing the same Feb. 19, 2008
7317241 Semiconductor apparatus having a large-size bus connection Jan. 8, 2008
7307293 Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths Dec. 11, 2007
7282793 Multiple die stack apparatus employing T-shaped interposer elements Oct. 16, 2007
7247932 Chip package with capacitor Jul. 24, 2007
7227252 Semiconductor component having stacked, encapsulated dice and method of fabrication Jun. 5, 2007
7205646 Electronic device and chip package Apr. 17, 2007
7205673 Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing Apr. 17, 2007
7199458 Stacked offset semiconductor package and method for fabricating Apr. 3, 2007
7176560 Semiconductor device having a chip--chip structure Feb. 13, 2007
7151013 Semiconductor package having exposed heat dissipating surface and method of fabrication Dec. 19, 2006

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