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Class Information
Number: 257/E25.01
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Device consisting of plurality of semiconductor or other solid state devices or components formed in or on common substrate, e.g., integrated circuit device (epo)
Description: This subclass is indented under subclass E25.003. This subclass is substantially the same in scope as ECLA classification H01L25/065.










Sub-classes under this class:

Class Number Class Name Patents
257/E25.011 Devices being arranged next and on each other, i.e., mixed assemblies (epo) 492
257/E25.012 Devices being arranged next to each other (epo) 491
257/E25.013 Stacked arrangements of devices (epo) 1,622


Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8664666 Semiconductor device and process for fabricating the same Mar. 4, 2014
8664689 Memory cell access device having a pn-junction with polycrystalline plug and single-crystal semiconductor regions Mar. 4, 2014
8592872 Integrated circuit including cross-coupled transistors with two transistors of different type having gate electrodes formed by common gate level feature with shared diffusion regions on opposi Nov. 26, 2013
8569881 Semiconductor device Oct. 29, 2013
8551830 Semiconductor integrated circuit switch matrix Oct. 8, 2013
8536713 System in package with heat sink Sep. 17, 2013
8421200 Semiconductor integrated circuit device and method for fabricating the same Apr. 16, 2013
8399967 Package structure Mar. 19, 2013
8349654 Method of fabricating stacked packages with bridging traces Jan. 8, 2013
8338929 Stacked-type chip package structure and fabrication method thereof Dec. 25, 2012
8304918 Method for manufacturing electronic device and electronic device Nov. 6, 2012
8253241 Electronic module Aug. 28, 2012
RE43380 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, an May. 15, 2012
8174103 Enhanced architectural interconnect options enabled with flipped die on a multi-chip package May. 8, 2012
8048766 Integrated circuit on high performance chip Nov. 1, 2011
8049319 Ultra wideband system-on-package Nov. 1, 2011
8039873 Semiconductor device Oct. 18, 2011
8026598 Semiconductor chip module with stacked flip-chip unit Sep. 27, 2011
7973401 Stacked chip package with redistribution lines Jul. 5, 2011
7952195 Stacked packages with bridging traces May. 31, 2011
7944058 Semiconductor device and process for fabricating the same May. 17, 2011
7939923 Memory card and method for manufacturing memory card May. 10, 2011
7936057 High bandwidth package May. 3, 2011
7892963 Integrated circuit packaging system and method of manufacture thereof Feb. 22, 2011
7851907 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting Dec. 14, 2010
7842550 Method of fabricating quad flat non-leaded package Nov. 30, 2010
7821127 Semiconductor device package having buffered memory module and method thereof Oct. 26, 2010
7768005 Physically highly secure multi-chip assembly Aug. 3, 2010
7732890 Integrated circuit with high voltage junction structure Jun. 8, 2010
7692285 Semiconductor device Apr. 6, 2010
7692282 Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and ma Apr. 6, 2010
7652358 Semiconductor device including main substrate and sub substrates Jan. 26, 2010
7518229 Versatile Si-based packaging with integrated passive components for mmWave applications Apr. 14, 2009
7514289 Methods and structures for facilitating proximity communication Apr. 7, 2009
7508238 Semiconductor integrated circuit device Mar. 24, 2009
7508061 Three-dimensional semiconductor module having multi-sided ground block Mar. 24, 2009
7498674 Semiconductor module having a coupling substrate, and methods for its production Mar. 3, 2009
7476958 Semiconductor wafer having different impurity concentrations in respective regions Jan. 13, 2009
7470932 Liquid crystal display panel and fabricating method thereof Dec. 30, 2008
7370530 Package for MEMS devices May. 13, 2008
7368813 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, an May. 6, 2008
7358600 Interposer for interconnecting components in a memory card Apr. 15, 2008
7332808 Semiconductor module and method of manufacturing the same Feb. 19, 2008
7317241 Semiconductor apparatus having a large-size bus connection Jan. 8, 2008
7071028 Semiconductor device and its manufacturing method Jul. 4, 2006
7030411 Electronic unit integrated into a flexible polymer body Apr. 18, 2006
6992474 Movement actuator/sensor systems Jan. 31, 2006
6991963 Electronic unit integrated into a flexible polymer body Jan. 31, 2006
6984882 Semiconductor device with reduced wiring paths between an array of semiconductor chip parts Jan. 10, 2006
6933715 Sensor system for sensing movement Aug. 23, 2005

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