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Class Information
Number: 257/E25.006
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Devices responsive or sensitive to electromagnetic radiation, e.g., infrared radiation, adapted for conversion of radiation into electrical energy or for control of electrical energy by such radiation (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.004. This subclass is substantially the same in scope as ECLA classification H01L25/04C4.










Sub-classes under this class:

Class Number Class Name Patents
257/E25.007 Devices being solar cells (epo) 90


Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
7592594 Method of construction of CTE matching structure with wafer processing and resulting structure Sep. 22, 2009
7592690 Semiconductor device including semiconductor elements mounted on base plate Sep. 22, 2009
7592691 High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies Sep. 22, 2009
7592692 Semiconductor device with a dummy electrode Sep. 22, 2009
7573128 Semiconductor module in which a semiconductor package is bonded on a mount substrate Aug. 11, 2009
7573136 Semiconductor device assemblies and packages including multiple semiconductor device components Aug. 11, 2009
7566958 Multi-chip package for reducing parasitic load of pin Jul. 28, 2009
7545048 Stacked die package Jun. 9, 2009
7541680 Semiconductor device package Jun. 2, 2009
7538419 Stacked-type chip package structure May. 26, 2009
7528474 Stacked semiconductor package assembly having hollowed substrate May. 5, 2009
7528477 Castellation wafer level packaging of integrated circuit chips May. 5, 2009
7525186 Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same Apr. 28, 2009
7504717 Semiconductor device Mar. 17, 2009
7473581 Wafer stacking package method Jan. 6, 2009
7468552 Physical quantity sensor Dec. 23, 2008
7462930 Stack chip and stack chip package having the same Dec. 9, 2008
7459774 Stacked chip package using photosensitive polymer and manufacturing method thereof Dec. 2, 2008
7446403 Carrier structure stacking system and method Nov. 4, 2008
7432600 System having semiconductor component with multiple stacked dice Oct. 7, 2008
7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides Sep. 30, 2008
7427810 Semiconductor device including semiconductor element mounted on another semiconductor element Sep. 23, 2008
7417322 Multi-chip module with embedded package and method for manufacturing the same Aug. 26, 2008
7410884 3D integrated circuits using thick metal for backside connections and offset bumps Aug. 12, 2008
7391105 Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same Jun. 24, 2008
7391106 Stack type package Jun. 24, 2008
7388294 Semiconductor components having stacked dice Jun. 17, 2008
7385299 Stackable integrated circuit package system with multiple interconnect interface Jun. 10, 2008
7385282 Stacked-type chip package structure Jun. 10, 2008
7378726 Stacked packages with interconnecting pins May. 27, 2008
7375418 Interposer stacking system and method May. 20, 2008
7375420 Large area transducer array May. 20, 2008
7372140 Memory module with different types of multi chip packages May. 13, 2008
7358115 Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides Apr. 15, 2008
7355264 Integrated passive devices with high Q inductors Apr. 8, 2008
7355271 Flexible assembly of stacked chips Apr. 8, 2008
7355273 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods Apr. 8, 2008
7348666 Chip-to-chip trench circuit structure Mar. 25, 2008
7335994 Semiconductor component having multiple stacked dice Feb. 26, 2008
7335974 Multi stack packaging chip and method of manufacturing the same Feb. 26, 2008
7329895 Dual wavelength detector Feb. 12, 2008
7307003 Method of forming a multi-layer semiconductor structure incorporating a processing handle member Dec. 11, 2007
7304375 Castellation wafer level packaging of integrated circuit chips Dec. 4, 2007
7301242 Programmable system in package Nov. 27, 2007
7298038 Integrated circuit package system including die stacking Nov. 20, 2007
7298037 Stacked integrated circuit package-in-package system with recessed spacer Nov. 20, 2007
7291896 Voltage droop suppressing active interposer Nov. 6, 2007
7288835 Integrated circuit package-in-package system Oct. 30, 2007
7282791 Stacked semiconductor device and semiconductor memory module Oct. 16, 2007
7279785 Stacked die package system Oct. 9, 2007

1 2 3 4 5 6 7










 
 
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