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Class Information
Number: 257/E25.006
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Devices responsive or sensitive to electromagnetic radiation, e.g., infrared radiation, adapted for conversion of radiation into electrical energy or for control of electrical energy by such radiation (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.004. This subclass is substantially the same in scope as ECLA classification H01L25/04C4.










Sub-classes under this class:

Class Number Class Name Patents
257/E25.007 Devices being solar cells (epo) 90


Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
7808060 MEMS microphone module and method thereof Oct. 5, 2010
7808112 Wafer level pre-packaged flip chip system Oct. 5, 2010
7804134 MOSFET on SOI device Sep. 28, 2010
7800194 Thin film photodetector, method and system Sep. 21, 2010
7800212 Mountable integrated circuit package system with stacking interposer Sep. 21, 2010
7795718 Warpage resistant semiconductor package and method for manufacturing the same Sep. 14, 2010
7786592 Chip capacitive coupling Aug. 31, 2010
7786562 Stackable semiconductor chip layer comprising prefabricated trench interconnect vias Aug. 31, 2010
7781878 Zigzag-stacked package structure Aug. 24, 2010
7767494 Method of manufacturing layered chip package Aug. 3, 2010
7768115 Stack chip and stack chip package having the same Aug. 3, 2010
7763972 Stacked package structure for reducing package volume of an acoustic micro-sensor Jul. 27, 2010
7759783 Integrated circuit package system employing thin profile techniques Jul. 20, 2010
7755180 Integrated circuit package-in-package system Jul. 13, 2010
7745918 Package in package (PiP) Jun. 29, 2010
7737542 Stackable semiconductor package Jun. 15, 2010
7737543 Semiconductor device and method of manufacturing the same Jun. 15, 2010
7732906 Semiconductor device Jun. 8, 2010
7732900 Wired circuit board Jun. 8, 2010
7732912 Semiconductor chip packages and assemblies with chip carrier units Jun. 8, 2010
7723832 Semiconductor device including semiconductor elements mounted on base plate May. 25, 2010
7709941 Resin-sealed semiconductor device and method of manufacturing the same May. 4, 2010
7705469 Lead frame, semiconductor device using same and manufacturing method thereof Apr. 27, 2010
7701046 Stacked type chip package structure Apr. 20, 2010
7696616 Stacked type semiconductor device and method of fabricating stacked type semiconductor device Apr. 13, 2010
7692311 POP (package-on-package) device encapsulating soldered joints between external leads Apr. 6, 2010
7687896 Semiconductor device having a stacked chip structure Mar. 30, 2010
7687920 Integrated circuit package-on-package system with central bond wires Mar. 30, 2010
7683467 Integrated circuit package system employing structural support Mar. 23, 2010
7683491 Semiconductor device Mar. 23, 2010
7679179 Castellation wafer level packaging of integrated circuit chips Mar. 16, 2010
7675155 Carrier structure stacking system and method Mar. 9, 2010
7675153 Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof Mar. 9, 2010
7674640 Stacked die package system Mar. 9, 2010
7666710 Method of manufacturing photo couplers Feb. 23, 2010
7667299 Circuit board and method for mounting chip component Feb. 23, 2010
7667312 Semiconductor device including a heat-transmitting and electromagnetic-noise-blocking substance and method of manufacturing the same Feb. 23, 2010
7663245 Interposer and stacked chip package Feb. 16, 2010
7663246 Stacked chip packaging with heat sink structure Feb. 16, 2010
7656015 Packaging substrate having heat-dissipating structure Feb. 2, 2010
7646102 Wafer level pre-packaged flip chip systems Jan. 12, 2010
7626252 Multi-chip electronic package and cooling system Dec. 1, 2009
7626253 Computing device including a stacked semiconductor device Dec. 1, 2009
7622801 Thin planar semiconductor device Nov. 24, 2009
7619313 Multi-chip module and methods Nov. 17, 2009
7619314 Integrated circuit package system including die stacking Nov. 17, 2009
7608481 Method for producing semiconductor package Oct. 27, 2009
7605476 Stacked die semiconductor package Oct. 20, 2009
7595550 Flex-based circuit module Sep. 29, 2009
7595551 Semiconductor package for a large die Sep. 29, 2009

1 2 3 4 5 6 7










 
 
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