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Class Information
Number: 257/E25.006
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Devices responsive or sensitive to electromagnetic radiation, e.g., infrared radiation, adapted for conversion of radiation into electrical energy or for control of electrical energy by such radiation (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.004. This subclass is substantially the same in scope as ECLA classification H01L25/04C4.

Sub-classes under this class:

Class Number Class Name Patents
257/E25.007 Devices being solar cells (epo) 90

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8030748 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Oct. 4, 2011
8030134 Stacked semiconductor package having adhesive/spacer structure and insulation Oct. 4, 2011
8026582 Integrated circuit package system with internal stacking module adhesive Sep. 27, 2011
8026586 Semiconductor package Sep. 27, 2011
8026608 Stackable electronic package Sep. 27, 2011
8008763 Stacked electronic component and manufacturing method thereof Aug. 30, 2011
8008667 Semiconductor device including a transparent semiconductor layer for viewing an underlying transistor in a semiconductor substrate Aug. 30, 2011
7994619 Bridge stack integrated circuit package system Aug. 9, 2011
7994623 Semiconductor device with offset stacked integrated circuits Aug. 9, 2011
7994627 Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same Aug. 9, 2011
7982298 Package in package semiconductor device Jul. 19, 2011
7982300 Stackable layer containing ball grid array package Jul. 19, 2011
7982306 Stackable semiconductor package Jul. 19, 2011
7973401 Stacked chip package with redistribution lines Jul. 5, 2011
7969019 Module with stacked semiconductor devices Jun. 28, 2011
7964948 Chip stack, chip stack package, and method of forming chip stack and chip stack package Jun. 21, 2011
7964952 Stacked semiconductor package assembly having hollowed substrate Jun. 21, 2011
7964953 Stacked type chip package structure Jun. 21, 2011
7960844 3-dimensional flash memory device, method of fabrication and method of operation Jun. 14, 2011
7952181 Wiring substrate for a multi-chip semiconductor device May. 31, 2011
7936057 High bandwidth package May. 3, 2011
7936074 Programmable system in package May. 3, 2011
7928551 Semiconductor device and method of manufacturing the same Apr. 19, 2011
7923847 Semiconductor system-in-a-package containing micro-layered lead frame Apr. 12, 2011
7919850 Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof Apr. 5, 2011
7919870 Coaxial through chip connection Apr. 5, 2011
7915079 Method of manufacturing layered chip package Mar. 29, 2011
7915083 Method of manufacturing layered chip package Mar. 29, 2011
7911045 Semiconductor element and semiconductor device Mar. 22, 2011
7906854 Semiconductor device having spacer formed on semiconductor chip connected with wire Mar. 15, 2011
7902651 Apparatus and method for stacking integrated circuits Mar. 8, 2011
7898091 Multi-host interface controller with USB PHY/analog functions integrated in a single package Mar. 1, 2011
7898080 Power semiconductor device comprising a semiconductor chip stack and method for producing the same Mar. 1, 2011
7898075 Semiconductor package having resin substrate with recess and method of fabricating the same Mar. 1, 2011
7898069 Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate Mar. 1, 2011
7892890 Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof Feb. 22, 2011
7893539 Semiconductor apparatus and mobile apparatus Feb. 22, 2011
7871861 Stacked integrated circuit package system with intra-stack encapsulation Jan. 18, 2011
7872339 Vertically stacked pre-packaged integrated circuit chips Jan. 18, 2011
7868438 Multi-chip package for reducing parasitic load of pin Jan. 11, 2011
7863721 Method and apparatus for wafer level integration using tapered vias Jan. 4, 2011
7855444 Mountable integrated circuit package system with substrate Dec. 21, 2010
7851900 Stacked semiconductor package Dec. 14, 2010
7847383 Multi-chip package for reducing parasitic load of pin Dec. 7, 2010
7847384 Semiconductor package and manufacturing method thereof Dec. 7, 2010
7843051 Semiconductor package and method of fabricating the same Nov. 30, 2010
7834469 Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame Nov. 16, 2010
7829995 Semiconductor device and method of fabrication Nov. 9, 2010
7816775 Multi-die IC package and manufacturing method Oct. 19, 2010
7816778 Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Oct. 19, 2010

1 2 3 4 5 6 7

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