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Class Information
Number: 257/E25.006
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Devices responsive or sensitive to electromagnetic radiation, e.g., infrared radiation, adapted for conversion of radiation into electrical energy or for control of electrical energy by such radiation (epo) > Stacked arrangements of devices (epo)
Description: This subclass is indented under subclass E25.004. This subclass is substantially the same in scope as ECLA classification H01L25/04C4.










Sub-classes under this class:

Class Number Class Name Patents
257/E25.007 Devices being solar cells (epo) 90


Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8710642 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus Apr. 29, 2014
8704354 Package on package structures and methods for forming the same Apr. 22, 2014
8704381 Very extremely thin semiconductor package Apr. 22, 2014
8680667 Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements Mar. 25, 2014
8664755 Power module package and method for manufacturing the same Mar. 4, 2014
8659143 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659142 Stub minimization for wirebond assemblies without windows Feb. 25, 2014
8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 25, 2014
8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate Feb. 25, 2014
8653642 Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems Feb. 18, 2014
8653646 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows Feb. 18, 2014
8643193 Semiconductor packages and electronic systems including the same Feb. 4, 2014
8637969 Stacked chips in a semiconductor package Jan. 28, 2014
8633576 Stacked chip-on-board module with edge connector Jan. 21, 2014
8618672 Three dimensional stacked chip package structure Dec. 31, 2013
8618670 Corrosion control of stacked integrated circuits Dec. 31, 2013
8581417 Semiconductor device stack with bonding layer and wire retaining member Nov. 12, 2013
8575762 Very extremely thin semiconductor package Nov. 5, 2013
8569885 Stacked semiconductor packages and related methods Oct. 29, 2013
8558369 Integrated circuit packaging system with interconnects and method of manufacture thereof Oct. 15, 2013
8551830 Semiconductor integrated circuit switch matrix Oct. 8, 2013
8546956 Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding Oct. 1, 2013
8546932 Thin substrate PoP structure Oct. 1, 2013
8546930 3-D ICs equipped with double sided power, coolant, and data features Oct. 1, 2013
8546929 Embedded integrated circuit package-on-package system Oct. 1, 2013
8536712 Memory device and method of manufacturing the same Sep. 17, 2013
8530276 Method for manufacturing a microelectronic device and a microelectronic device thus manufactured Sep. 10, 2013
8531021 Package stack device and fabrication method thereof Sep. 10, 2013
8531034 Semiconductor package and package on package having the same Sep. 10, 2013
8525320 Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods Sep. 3, 2013
8519523 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Aug. 27, 2013
8502370 Stack package structure and fabrication method thereof Aug. 6, 2013
8487421 Microelectronic package with stacked microelectronic elements and method for manufacture thereof Jul. 16, 2013
8487452 Semiconductor package having a stacked structure Jul. 16, 2013
8482111 Stackable molded microelectronic packages Jul. 9, 2013
8482133 Semiconductor package Jul. 9, 2013
8455301 Method of fabricating stacked chips in a semiconductor package Jun. 4, 2013
8450839 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices May. 28, 2013
8445322 Method of fabricating semiconductor package May. 21, 2013
8446000 Package structure and package process May. 21, 2013
8446016 Chip stack package May. 21, 2013
8426979 Composite layered chip package Apr. 23, 2013
8426958 Stacked chip package with redistribution lines Apr. 23, 2013
8426947 Laminated semiconductor wafer, laminated chip package and method of manufacturing the same Apr. 23, 2013
8415202 Method of manufacturing semiconductor device Apr. 9, 2013
8415674 Semiconductor device and method of forming the same Apr. 9, 2013
8405221 Semiconductor device and multilayer semiconductor device Mar. 26, 2013
8405226 Semiconductor device and method of making semiconductor device Mar. 26, 2013
8399973 Data storage and stackable configurations Mar. 19, 2013

1 2 3 4 5 6 7










 
 
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