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Class Information
Number: 257/E25.005
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo) > Devices not having separate containers (epo) > Devices responsive or sensitive to electromagnetic radiation, e.g., infrared radiation, adapted for conversion of radiation into electrical energy or for control of electrical energy by such radiation (epo) > Devices being arranged next to each other (epo)
Description: This subclass is indented under subclass E25.004. This subclass is substantially the same in scope as ECLA classification H01L25/04C2.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8664755 Power module package and method for manufacturing the same Mar. 4, 2014
8625297 Package structure with electronic component and method for manufacturing same Jan. 7, 2014
8552519 Semiconductor module for power generation or light emission Oct. 8, 2013
8546925 Synchronous buck converter having coplanar array of contact bumps of equal volume Oct. 1, 2013
8399960 Semiconductor device Mar. 19, 2013
8394650 Solar cell interconnection, module and panel method Mar. 12, 2013
8338962 Semiconductor package substrate and semiconductor package having the same Dec. 25, 2012
8253241 Electronic module Aug. 28, 2012
8227886 Semiconductor device and method of manufacturing semiconductor device Jul. 24, 2012
8178960 Stacked semiconductor package and method of manufacturing thereof May. 15, 2012
8138593 Packaged microchip with spacer for mitigating electrical leakage between components Mar. 20, 2012
8125063 COL package having small chip hidden between leads Feb. 28, 2012
8110929 Semiconductor module Feb. 7, 2012
8049292 Semiconductor device and method for manufacturing semiconductor device Nov. 1, 2011
8049319 Ultra wideband system-on-package Nov. 1, 2011
8039852 Thin film transistor for a liquid crystal device in which a sealing pattern is electrically connected to a common electrode wiring Oct. 18, 2011
8039873 Semiconductor device Oct. 18, 2011
8008759 Pre-molded clip structure Aug. 30, 2011
7999340 Apparatus and method for forming optical black pixels with uniformly low dark current Aug. 16, 2011
7994032 Method of making deep junction for electrical crosstalk reduction of an image sensor Aug. 9, 2011
7977130 Method of assembling displays on substrates Jul. 12, 2011
7936057 High bandwidth package May. 3, 2011
7911051 Electronic circuit arrangement and method for producing an electronic circuit arrangement Mar. 22, 2011
7898091 Multi-host interface controller with USB PHY/analog functions integrated in a single package Mar. 1, 2011
7898067 Pre-molded, clip-bonded multi-die semiconductor package Mar. 1, 2011
7851907 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting Dec. 14, 2010
7843051 Semiconductor package and method of fabricating the same Nov. 30, 2010
7799619 Thin film transistor array substrate and fabricating method thereof Sep. 21, 2010
7768115 Stack chip and stack chip package having the same Aug. 3, 2010
7768005 Physically highly secure multi-chip assembly Aug. 3, 2010
7759783 Integrated circuit package system employing thin profile techniques Jul. 20, 2010
7737460 White LED and manufacturing method therefor Jun. 15, 2010
7714347 Casting for an LED module May. 11, 2010
7701044 Chip package for image sensor and method of manufacturing the same Apr. 20, 2010
7692311 POP (package-on-package) device encapsulating soldered joints between external leads Apr. 6, 2010
7687920 Integrated circuit package-on-package system with central bond wires Mar. 30, 2010
7683467 Integrated circuit package system employing structural support Mar. 23, 2010
7683491 Semiconductor device Mar. 23, 2010
7663246 Stacked chip packaging with heat sink structure Feb. 16, 2010
7635917 Three-dimensional package and method of making the same Dec. 22, 2009
7632712 Method of fabricating a power semiconductor module Dec. 15, 2009
7619314 Integrated circuit package system including die stacking Nov. 17, 2009
7619313 Multi-chip module and methods Nov. 17, 2009
7605476 Stacked die semiconductor package Oct. 20, 2009
7545048 Stacked die package Jun. 9, 2009
7518229 Versatile Si-based packaging with integrated passive components for mmWave applications Apr. 14, 2009
7504703 Semiconductor integrated circuit device Mar. 17, 2009
7498674 Semiconductor module having a coupling substrate, and methods for its production Mar. 3, 2009
7476958 Semiconductor wafer having different impurity concentrations in respective regions Jan. 13, 2009
7358529 Active matrix display devices, and their manufacture Apr. 15, 2008

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