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Class Information
Number: 257/E25.002
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo) > All devices being of same type, e.g., assemblies of rectifier diodes (epo)
Description: This subclass is indented under subclass E25.001. This subclass is substantially the same in scope as ECLA classification H01L25/03.










Sub-classes under this class:

Class Number Class Name Patents
257/E25.022 Devices having separate containers (epo) 52
257/E25.003 Devices not having separate containers (epo) 10


Patents under this class:

Patent Number Title Of Patent Date Issued
8502237 Semiconductor rectifying device Aug. 6, 2013
8329495 Method of forming photovoltaic modules Dec. 11, 2012
8304856 Semiconductor device Nov. 6, 2012
8039873 Semiconductor device Oct. 18, 2011
7947522 Method of production of semiconductor device and method of production of solid-state imaging device May. 24, 2011
7679122 Semiconductor device including source strapping line Mar. 16, 2010
7573069 Semiconductor device and manufacturing method thereof Aug. 11, 2009
7326965 Surface-emitting type device and its manufacturing method Feb. 5, 2008
7291926 Multi-chip package structure Nov. 6, 2007
7129583 Multi-chip package structure Oct. 31, 2006
6946323 Semiconductor package having one or more die stacked on a prepackaged device and method therefor Sep. 20, 2005
6870738 Power semiconductor module Mar. 22, 2005
5784264 MCM (Multi Chip Module) carrier with external connection teminals BGA (Ball Grid Array) type matrix array form Jul. 21, 1998











 
 
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