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Class Information
Number: 257/E25.001
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Assemblies consisting of plurality of individual semiconductor or other solid-state devices (epo)
Description: This main group provides for housing or mounting arrangements of a plurality of discrete semiconductor or other solid state devices, e.g., side-by-side and/or stacked arrangement of devices such as solar cells and diodes. This subclass is substantially the same in scope as ECLA classification H01L25/00.










Sub-classes under this class:

Class Number Class Name Patents
257/E25.002 All devices being of same type, e.g., assemblies of rectifier diodes (epo) 13
257/E25.029 Devices being of two or more types, e.g., forming hybrid circuits (epo) 358


Patents under this class:

Patent Number Title Of Patent Date Issued
8680666 Bond wireless power module with double-sided single device cooling and immersion bath cooling Mar. 25, 2014
8637966 Semiconductor device Jan. 28, 2014
8633551 Semiconductor package with mechanical fuse Jan. 21, 2014
8629488 Method for manufacturing an energy storage device and structure therefor Jan. 14, 2014
8546929 Embedded integrated circuit package-on-package system Oct. 1, 2013
8546954 Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package Oct. 1, 2013
8541887 Layered chip package and method of manufacturing same Sep. 24, 2013
8426981 Composite layered chip package Apr. 23, 2013
8384098 AC light emitting diode and method for fabricating the same Feb. 26, 2013
8378448 Chip inductor with frequency dependent inductance Feb. 19, 2013
8338963 Multiple die face-down stacking for two or more die Dec. 25, 2012
8329495 Method of forming photovoltaic modules Dec. 11, 2012
8278744 Semiconductor device and method for manufacturing same Oct. 2, 2012
8076764 Stacked type semiconductor memory device and chip selection circuit Dec. 13, 2011
7928555 Stack semiconductor package including an interposer chip having an imposed diode or capacitor Apr. 19, 2011
7846772 Layered chip package and method of manufacturing same Dec. 7, 2010
7834364 AC light emitting diode and method for fabricating the same Nov. 16, 2010
7777223 Semiconductor device Aug. 17, 2010
7714442 Solid-state imaging device and method for making the same May. 11, 2010
7670862 Silicon optoelectronic device, manufacturing method thereof, and image input and/or output apparatus using the same Mar. 2, 2010
7537956 Silicon optoelectronic device manufacturing method and silicon optoelectronic device manufactured by thereof and image input and/or output apparatus having the same May. 26, 2009
7534634 Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source May. 19, 2009
7501300 Manufacturing method of semiconductor integrated circuit device Mar. 10, 2009
7485486 Photodiode for multiple wavelength operation Feb. 3, 2009
7317241 Semiconductor apparatus having a large-size bus connection Jan. 8, 2008
7215026 Semiconductor module and method of forming a semiconductor module May. 8, 2007











 
 
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