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Class Information
Number: 257/E23.194
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Protection against mechanical damage (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/00M.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8703539 Multiple die packaging interposer structure and method Apr. 22, 2014
8669661 Metal line and via formation using hard masks Mar. 11, 2014
8664747 Trenched substrate for crystal growth and wafer bonding Mar. 4, 2014
8648421 Electrostatic discharge (ESD) device and semiconductor structure Feb. 11, 2014
8610256 Device for detecting an attack against an integrated circuit Dec. 17, 2013
8604599 Semiconductor housing and method for the production of a semiconductor housing Dec. 10, 2013
8597964 Manufacturing method of LED package structure Dec. 3, 2013
8575763 Semiconductor device and method of manufacturing the same Nov. 5, 2013
8541260 Exposed die overmolded flip chip package and fabrication method Sep. 24, 2013
8492876 Geometry and design for conformal electronics Jul. 23, 2013
8481367 Method of manufacturing circuit device Jul. 9, 2013
8476748 Exposed die overmolded flip chip package and fabrication method Jul. 2, 2013
8461021 Multiple seal ring structure Jun. 11, 2013
8455990 Systems and methods of tamper proof packaging of a semiconductor device Jun. 4, 2013
8445997 Stacked packaged integrated circuit devices May. 21, 2013
8441104 Electrical overstress protection using through-silicon-via (TSV) May. 14, 2013
8436352 Semiconductor integrated circuit May. 7, 2013
8426234 Device for detecting an attack against an integrated circuit Apr. 23, 2013
8421167 Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a cham Apr. 16, 2013
8399977 Resin-sealed package and method of producing the same Mar. 19, 2013
8373254 Structure for reducing integrated circuit corner peeling Feb. 12, 2013
8368194 Exposed die overmolded flip chip package Feb. 5, 2013
8357996 Devices with crack stops Jan. 22, 2013
8344493 Warpage control features on the bottomside of TSV die lateral to protruding bottomside tips Jan. 1, 2013
8338917 Multiple seal ring structure Dec. 25, 2012
8324714 Semiconductor device and method for making the same Dec. 4, 2012
8319332 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Nov. 27, 2012
8298919 Manufacturing method of semiconductor device and semiconductor device Oct. 30, 2012
8293581 Semiconductor chip with protective scribe structure Oct. 23, 2012
8288862 Multiple die stack package Oct. 16, 2012
8288842 Method for dicing semiconductor wafers Oct. 16, 2012
8288857 Anti-tamper microchip package based on thermal nanofluids or fluids Oct. 16, 2012
8283769 Modular low stress package technology Oct. 9, 2012
8188565 Semiconductor chip and shielding structure thereof May. 29, 2012
8183674 Power semiconductor module comprising an explosion protection system May. 22, 2012
8169087 Semiconductor device May. 1, 2012
8164163 Semiconductor device having sealing ring Apr. 24, 2012
8148203 Technique for stable processing of thin/fragile substrates Apr. 3, 2012
8125052 Seal ring structure with improved cracking protection Feb. 28, 2012
8125053 Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices Feb. 28, 2012
8124453 Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates Feb. 28, 2012
8106491 Methods of forming stacked semiconductor devices with a leadframe and associated assemblies Jan. 31, 2012
8101990 Semiconductor device Jan. 24, 2012
8072084 Integrated circuit, circuit system, and method of manufacturing Dec. 6, 2011
8039313 Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate Oct. 18, 2011
8039949 Ball grid array package having one or more stiffeners Oct. 18, 2011
8026583 Flip-chip module and method for the production thereof Sep. 27, 2011
8017942 Semiconductor device and method Sep. 13, 2011
8013452 Wire-bonded semiconductor component with reinforced inner connection metallization Sep. 6, 2011
8004066 Crack stop and moisture barrier Aug. 23, 2011

1 2 3 4 5 6 7

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