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Class Information
Number: 257/E23.193
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (epo)
Description: This subclass is indented under subclass E23.18. This subclass is substantially the same in scope as ECLA classification H01L23/10.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615850 |
Method and device including reworkable alpha particle barrier and corrosion barrier |
Nov. 10, 2009 |
| 7615397 |
Micro-element package and manufacturing method thereof |
Nov. 10, 2009 |
| 7605448 |
Semiconductor device with seal ring |
Oct. 20, 2009 |
| 7598125 |
Method for wafer level packaging and fabricating cap structures |
Oct. 6, 2009 |
| 7541662 |
Packaging chip having inductor therein |
Jun. 2, 2009 |
| 7508063 |
Low cost hermetically sealed package |
Mar. 24, 2009 |
| 7508064 |
Package for sealing an integrated circuit die |
Mar. 24, 2009 |
| 7485956 |
Microelectronic package optionally having differing cover and device thermal expansivities |
Feb. 3, 2009 |
| 7482682 |
Micro-device packaging |
Jan. 27, 2009 |
| 7476961 |
Method and apparatus for forming a DMD window frame with molded glass |
Jan. 13, 2009 |
| 7476600 |
FET gate structure and fabrication process |
Jan. 13, 2009 |
| 7465488 |
Bow control in an electronic package |
Dec. 16, 2008 |
| 7446407 |
Chip package structure |
Nov. 4, 2008 |
| 7443024 |
Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same |
Oct. 28, 2008 |
| 7436056 |
Electronic component package |
Oct. 14, 2008 |
| 7432533 |
Encapsulation of electronic devices with shaped spacers |
Oct. 7, 2008 |
| 7408250 |
Micromirror array device with compliant adhesive |
Aug. 5, 2008 |
| 7394153 |
Encapsulation of electronic devices |
Jul. 1, 2008 |
| 7382046 |
Semiconductor device protection cover, and semiconductor device unit including the cover |
Jun. 3, 2008 |
| 7378748 |
Solid-state imaging device and method for manufacturing the same |
May. 27, 2008 |
| 7354799 |
Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring |
Apr. 8, 2008 |
| 7342263 |
Circuit device |
Mar. 11, 2008 |
| 7294925 |
Optical scanner package having heating dam |
Nov. 13, 2007 |
| 7291904 |
Downsized package for electric wave device |
Nov. 6, 2007 |
| 7291914 |
Power semiconductor module |
Nov. 6, 2007 |
| 7235867 |
Semiconductor device with electrically biased die edge seal |
Jun. 26, 2007 |
| 7202552 |
MEMS package using flexible substrates, and method thereof |
Apr. 10, 2007 |
| 7173331 |
Hermetic sealing cap and method of manufacturing the same |
Feb. 6, 2007 |
| 7154173 |
Semiconductor device and manufacturing method of the same |
Dec. 26, 2006 |
| 7132745 |
Method for attaching shields on substrates |
Nov. 7, 2006 |
| 7102224 |
Encapsulated component and method for the production thereof |
Sep. 5, 2006 |
| 7073410 |
Hydraulic motor vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein |
Jul. 11, 2006 |
| 7074103 |
Manufacturing method of electroluminescence display apparatus |
Jul. 11, 2006 |
| 7065867 |
Low temperature hermetic sealing method having passivation layer |
Jun. 27, 2006 |
| 7066659 |
Small form factor transceiver with externally modulated laser |
Jun. 27, 2006 |
| 7061102 |
High performance flipchip package that incorporates heat removal with minimal thermal mismatch |
Jun. 13, 2006 |
| 7060530 |
Semiconductor package having a resin cap member |
Jun. 13, 2006 |
| 7053299 |
Flange for integrated circuit package |
May. 30, 2006 |
| 7045890 |
Heat spreader and stiffener having a stiffener extension |
May. 16, 2006 |
| 7042723 |
Cooling arrangement for an integrated circuit |
May. 9, 2006 |
| 7026223 |
Hermetic electric component package |
Apr. 11, 2006 |
| 7023078 |
Packages for communication devices |
Apr. 4, 2006 |
| 7012326 |
Lid and method of employing a lid on an integrated circuit |
Mar. 14, 2006 |
| 7004325 |
Resin-molded package with cavity structure |
Feb. 28, 2006 |
| 6998533 |
Electronic device and method of manufacturing same |
Feb. 14, 2006 |
| 6996304 |
Small form factor transceiver with externally modulated laser |
Feb. 7, 2006 |
| 6989296 |
Fabrication method of semiconductor package with photosensitive chip |
Jan. 24, 2006 |
| 6983537 |
Method of making a plastic package with an air cavity |
Jan. 10, 2006 |
| 6982486 |
Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same |
Jan. 3, 2006 |
| 6982463 |
Integrated circuit with reduced coupling via the substrate |
Jan. 3, 2006 |
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