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Class Information
Number: 257/E23.193
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Containers; seals (epo) > Characterized by material or arrangement of seals between parts, e.g., between cap and base of container or between leads and walls of container (epo)
Description: This subclass is indented under subclass E23.18. This subclass is substantially the same in scope as ECLA classification H01L23/10.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8674498 MEMS package and method for the production thereof Mar. 18, 2014
8610156 Light emitting device package Dec. 17, 2013
8610224 MEMS element and electrical device using the same Dec. 17, 2013
8604599 Semiconductor housing and method for the production of a semiconductor housing Dec. 10, 2013
8592959 Semiconductor device mounted on a wiring board having a cap Nov. 26, 2013
8587107 Silicon carbide semiconductor Nov. 19, 2013
8575748 Wafer-level packaging with compression-controlled seal ring bonding Nov. 5, 2013
8575752 Modulated deposition process for stress control in thick TiN films Nov. 5, 2013
8546933 Semiconductor apparatus including resin case Oct. 1, 2013
8513056 Semiconductor memory device and method of fabricating the same Aug. 20, 2013
8508036 Ultra-thin near-hermetic package based on rainier Aug. 13, 2013
8471382 Package and high frequency terminal structure for the same Jun. 25, 2013
8395177 Package for protecting a device from ambient substances Mar. 12, 2013
8390111 Wafer bonding method Mar. 5, 2013
8334582 Protective seal ring for preventing die-saw induced stress Dec. 18, 2012
8313970 Planar microshells for vacuum encapsulated devices and damascene method of manufacture Nov. 20, 2012
8288835 Microshells with integrated getter layer Oct. 16, 2012
8288851 Method and system for hermetically sealing packages for optics Oct. 16, 2012
8283769 Modular low stress package technology Oct. 9, 2012
8273594 Planar microshells for vacuum encapsulated devices and damascene method of manufacture Sep. 25, 2012
8268670 Method of semiconductor device protection Sep. 18, 2012
8232635 Hermetic semiconductor package Jul. 31, 2012
8227913 Power semiconductor module comprising elastic housing for accommodating movement of individual substrate regions on a heat sink Jul. 24, 2012
8203207 Electronic device packages and methods of formation Jun. 19, 2012
8168461 Micro-electro-mechanical device and method of manufacturing the same May. 1, 2012
8164181 Semiconductor device packaging structure Apr. 24, 2012
8159059 Microelectromechanical device and method for manufacturing the same Apr. 17, 2012
8129801 Discrete stress isolator attachment structures for MEMS sensor packages Mar. 6, 2012
8102015 Microphone package with minimum footprint size and thickness Jan. 24, 2012
8080869 Wafer level package structure and production method therefor Dec. 20, 2011
8076771 Semiconductor device having metal cap divided by slit Dec. 13, 2011
8058106 MEMS device package with vacuum cavity by two-step solder reflow method Nov. 15, 2011
8049318 Semiconductor light emitting device Nov. 1, 2011
8026595 Semiconductor device having hermitically sealed active area and electrodes Sep. 27, 2011
8018030 Semiconductor chip with seal ring and sacrificial corner pattern Sep. 13, 2011
8018043 Semiconductor package having side walls and method for manufacturing the same Sep. 13, 2011
8013404 Folded lead-frame packages for MEMS devices Sep. 6, 2011
8003442 Integrated cirucit package and method for fabrication thereof Aug. 23, 2011
8004078 Adhesive composition for semiconductor device Aug. 23, 2011
7972886 Method of manufacturing micro electro mechanical systems device Jul. 5, 2011
7952189 Hermetic packaging and method of manufacture and use therefore May. 31, 2011
7948000 Method and system for hermetically sealing packages for optics May. 24, 2011
7948069 Surface mountable hermetically sealed package May. 24, 2011
7935573 Electronic device and method for fabricating the same May. 3, 2011
7928535 Semiconductor device and semiconductor package having the same Apr. 19, 2011
7923790 Planar microshells for vacuum encapsulated devices and damascene method of manufacture Apr. 12, 2011
7911042 Package having shield case Mar. 22, 2011
7888777 Semiconductor device and method for manufacturing the same Feb. 15, 2011
7888797 High frequency package device with internal space having a resonant frequency offset from frequency used Feb. 15, 2011
7880275 Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device Feb. 1, 2011

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